CN101794823B - 薄膜晶体管和显示装置 - Google Patents
薄膜晶体管和显示装置 Download PDFInfo
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- CN101794823B CN101794823B CN2010101080202A CN201010108020A CN101794823B CN 101794823 B CN101794823 B CN 101794823B CN 2010101080202 A CN2010101080202 A CN 2010101080202A CN 201010108020 A CN201010108020 A CN 201010108020A CN 101794823 B CN101794823 B CN 101794823B
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- film
- oxide semiconductor
- semiconductor layer
- layer
- gate insulating
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/62—Electrodes ohmically coupled to a semiconductor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
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- Thin Film Transistor (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-024035 | 2009-02-04 | ||
| JP2009024035A JP2010182819A (ja) | 2009-02-04 | 2009-02-04 | 薄膜トランジスタおよび表示装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101794823A CN101794823A (zh) | 2010-08-04 |
| CN101794823B true CN101794823B (zh) | 2013-08-21 |
Family
ID=42396939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101080202A Active CN101794823B (zh) | 2009-02-04 | 2010-01-28 | 薄膜晶体管和显示装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US8426851B2 (enExample) |
| JP (1) | JP2010182819A (enExample) |
| CN (1) | CN101794823B (enExample) |
Families Citing this family (65)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010182819A (ja) * | 2009-02-04 | 2010-08-19 | Sony Corp | 薄膜トランジスタおよび表示装置 |
| JP2010205987A (ja) * | 2009-03-04 | 2010-09-16 | Sony Corp | 薄膜トランジスタおよびその製造方法並びに表示装置 |
| KR101084173B1 (ko) | 2009-10-27 | 2011-11-17 | 삼성모바일디스플레이주식회사 | 유기 발광 표시장치 및 그 제조 방법 |
| KR102479269B1 (ko) * | 2010-01-20 | 2022-12-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 및 휴대 전화기 |
| WO2012002186A1 (en) | 2010-07-02 | 2012-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US8633481B2 (en) | 2010-08-30 | 2014-01-21 | Sharp Kabushiki Kaisha | Semiconductor device and process for production thereof |
| KR101932576B1 (ko) * | 2010-09-13 | 2018-12-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| JP2012256821A (ja) | 2010-09-13 | 2012-12-27 | Semiconductor Energy Lab Co Ltd | 記憶装置 |
| US9437743B2 (en) * | 2010-10-07 | 2016-09-06 | Semiconductor Energy Laboratory Co., Ltd. | Thin film element, semiconductor device, and method for manufacturing the same |
| US8679986B2 (en) | 2010-10-14 | 2014-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing display device |
| CN102005389A (zh) * | 2010-10-15 | 2011-04-06 | 信利半导体有限公司 | 降低背沟道刻蚀型tft漏电率的方法 |
| JP5624628B2 (ja) * | 2010-11-10 | 2014-11-12 | 株式会社日立製作所 | 半導体装置 |
| KR20120063809A (ko) * | 2010-12-08 | 2012-06-18 | 삼성전자주식회사 | 박막 트랜지스터 표시판 |
| KR20120065854A (ko) * | 2010-12-13 | 2012-06-21 | 엘지디스플레이 주식회사 | 산화물 박막 트랜지스터의 제조방법 |
| US20130280859A1 (en) * | 2010-12-30 | 2013-10-24 | Jae-ho Kim | Thin-film transistor and method for manufacturing same |
| KR101827514B1 (ko) * | 2011-08-18 | 2018-02-08 | 주성엔지니어링(주) | 박막 트랜지스터 및 그 제조 방법 |
| JP5766467B2 (ja) * | 2011-03-02 | 2015-08-19 | 株式会社東芝 | 薄膜トランジスタ及びその製造方法、表示装置 |
| US8841664B2 (en) * | 2011-03-04 | 2014-09-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP2012204548A (ja) * | 2011-03-24 | 2012-10-22 | Sony Corp | 表示装置およびその製造方法 |
| US9082860B2 (en) * | 2011-03-31 | 2015-07-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US8541266B2 (en) * | 2011-04-01 | 2013-09-24 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| KR101768487B1 (ko) * | 2011-05-03 | 2017-08-18 | 엘지디스플레이 주식회사 | 박막트랜지스터 및 그를 포함하는 트랜지스터 어레이 기판 |
| US9117920B2 (en) * | 2011-05-19 | 2015-08-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device using oxide semiconductor |
| US9112036B2 (en) * | 2011-06-10 | 2015-08-18 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
| KR101790062B1 (ko) * | 2011-08-24 | 2017-10-25 | 엘지디스플레이 주식회사 | 산화물 반도체층을 이용한 박막 트랜지스터 및 그의 제조방법 |
| JP2013115111A (ja) * | 2011-11-25 | 2013-06-10 | Hitachi Ltd | 酸化物半導体装置およびその製造方法 |
| JP6081171B2 (ja) | 2011-12-09 | 2017-02-15 | 株式会社半導体エネルギー研究所 | 記憶装置 |
| US8785258B2 (en) * | 2011-12-20 | 2014-07-22 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| TW201338173A (zh) * | 2012-02-28 | 2013-09-16 | Sony Corp | 電晶體、製造電晶體之方法、顯示裝置及電子機器 |
| CN102723359B (zh) * | 2012-06-13 | 2015-04-29 | 京东方科技集团股份有限公司 | 薄膜晶体管及其制作方法、阵列基板、显示装置 |
| US9153699B2 (en) * | 2012-06-15 | 2015-10-06 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor with multiple oxide semiconductor layers |
| US9564474B2 (en) | 2012-06-21 | 2017-02-07 | Joled Inc. | TFT substrate, method for producing same, organic EL display device, and method for manufacturing organic EL display device |
| JP5991668B2 (ja) * | 2012-08-23 | 2016-09-14 | 株式会社ジャパンディスプレイ | 表示装置及びその製造方法 |
| US8653516B1 (en) * | 2012-08-31 | 2014-02-18 | Eastman Kodak Company | High performance thin film transistor |
| US9812338B2 (en) * | 2013-03-14 | 2017-11-07 | Cree, Inc. | Encapsulation of advanced devices using novel PECVD and ALD schemes |
| US8994073B2 (en) | 2012-10-04 | 2015-03-31 | Cree, Inc. | Hydrogen mitigation schemes in the passivation of advanced devices |
| US9991399B2 (en) | 2012-10-04 | 2018-06-05 | Cree, Inc. | Passivation structure for semiconductor devices |
| IN2015DN03772A (enExample) * | 2012-11-08 | 2015-10-02 | Semiconductor Energy Lab | |
| JP6015389B2 (ja) | 2012-11-30 | 2016-10-26 | 株式会社リコー | 電界効果型トランジスタ、表示素子、画像表示装置、及びシステム |
| JP2014170829A (ja) | 2013-03-04 | 2014-09-18 | Sony Corp | 半導体装置およびその製造方法、並びに表示装置の製造方法および電子機器の製造方法 |
| CN104460143B (zh) * | 2013-09-17 | 2017-12-15 | 瀚宇彩晶股份有限公司 | 像素结构及其制造方法 |
| JP6394171B2 (ja) | 2013-10-30 | 2018-09-26 | 株式会社リコー | 電界効果型トランジスタ、表示素子、画像表示装置、及びシステム |
| US20150287831A1 (en) * | 2014-04-08 | 2015-10-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device including semiconductor device |
| US10121898B2 (en) | 2014-05-09 | 2018-11-06 | Joled Inc. | Thin-film transistor substrate and method of manufacturing the same |
| CN104112766B (zh) * | 2014-07-22 | 2017-02-15 | 深圳市华星光电技术有限公司 | 彩色显示器件结构 |
| US10147823B2 (en) | 2015-03-19 | 2018-12-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| CN105097950A (zh) * | 2015-08-24 | 2015-11-25 | 京东方科技集团股份有限公司 | 薄膜晶体管及制作方法、阵列基板、显示装置 |
| JP6607013B2 (ja) * | 2015-12-08 | 2019-11-20 | 株式会社リコー | 電界効果型トランジスタ、表示素子、画像表示装置、及びシステム |
| CN107104138B (zh) * | 2016-02-19 | 2021-04-27 | 硅显示技术有限公司 | 氧化物半导体晶体管 |
| KR101829805B1 (ko) * | 2016-02-19 | 2018-02-20 | 실리콘 디스플레이 (주) | 산화물 반도체 트랜지스터 및 이의 제조 방법 |
| KR102640383B1 (ko) * | 2016-03-22 | 2024-02-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 및 상기 반도체 장치를 포함하는 표시 장치 |
| KR101809833B1 (ko) | 2016-04-29 | 2017-12-15 | 고려대학교 산학협력단 | 투명 금속산화막/금속/투명 금속산화막 보호층을 구비한 비정질 산화물 박막 트랜지스터 |
| KR101808432B1 (ko) * | 2016-06-22 | 2018-01-18 | 경희대학교 산학협력단 | 산화물 반도체 박막 트랜지스터 및 그 제조방법 |
| KR101897345B1 (ko) * | 2016-09-21 | 2018-09-10 | 고려대학교 산학협력단 | 박막 트랜지스터 |
| CN106486551A (zh) * | 2016-12-07 | 2017-03-08 | 电子科技大学 | 一种铟镓锌氧薄膜晶体管及其制备方法 |
| JP2018170324A (ja) * | 2017-03-29 | 2018-11-01 | 株式会社ジャパンディスプレイ | 表示装置 |
| JP7258754B2 (ja) | 2017-07-31 | 2023-04-17 | 株式会社半導体エネルギー研究所 | 半導体装置、および半導体装置の作製方法 |
| CN107664889B (zh) * | 2017-09-14 | 2020-05-22 | 深圳市华星光电半导体显示技术有限公司 | 一种tft器件及液晶显示面板的静电保护电路 |
| CN109148303B (zh) * | 2018-07-23 | 2020-04-10 | 深圳市华星光电半导体显示技术有限公司 | 薄膜晶体管的制备方法 |
| KR102813697B1 (ko) * | 2019-07-31 | 2025-05-28 | 삼성디스플레이 주식회사 | 표시 장치 |
| US20220230878A1 (en) * | 2019-09-05 | 2022-07-21 | Hewlett-Packard Development Company, L.P. | Semiconductor composite layers |
| CN111816668A (zh) * | 2020-08-12 | 2020-10-23 | 成都中电熊猫显示科技有限公司 | 金属氧化物阵列基板的制造方法、阵列基板及显示面板 |
| EP4131411A4 (en) * | 2021-03-11 | 2023-08-16 | BOE Technology Group Co., Ltd. | ARRAY SUBSTRATE AND DISPLAY PANEL THEREFORE, AND DISPLAY DEVICE |
| US20220384366A1 (en) * | 2021-06-01 | 2022-12-01 | Cree, Inc. | Multilayer encapsulation for humidity robustness and related fabrication methods |
| US20230317634A1 (en) * | 2022-04-05 | 2023-10-05 | Applied Materials, Inc. | Coatings with diffusion barriers for corrosion and contamination protection |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101090073A (zh) * | 2006-05-10 | 2007-12-19 | 索尼株式会社 | 制造薄膜晶体管的方法、薄膜晶体管和显示单元 |
| WO2008069056A1 (en) * | 2006-12-05 | 2008-06-12 | Canon Kabushiki Kaisha | Bottom gate type thin film transistor, method of manufacturing the same, and display apparatus |
| CN101335304A (zh) * | 2005-09-29 | 2008-12-31 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6825543B2 (en) * | 2000-12-28 | 2004-11-30 | Canon Kabushiki Kaisha | Semiconductor device, method for manufacturing the same, and liquid jet apparatus |
| JP3913756B2 (ja) | 2002-05-22 | 2007-05-09 | 雅司 川崎 | 半導体装置およびそれを用いる表示装置 |
| JP4860183B2 (ja) * | 2005-05-24 | 2012-01-25 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| JP4870403B2 (ja) * | 2005-09-02 | 2012-02-08 | 財団法人高知県産業振興センター | 薄膜トランジスタの製法 |
| JP2007073705A (ja) * | 2005-09-06 | 2007-03-22 | Canon Inc | 酸化物半導体チャネル薄膜トランジスタおよびその製造方法 |
| WO2007043493A1 (en) * | 2005-10-14 | 2007-04-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US8629490B2 (en) * | 2006-03-31 | 2014-01-14 | Semiconductor Energy Laboratory Co., Ltd. | Nonvolatile semiconductor storage device with floating gate electrode and control gate electrode |
| KR101206033B1 (ko) * | 2006-04-18 | 2012-11-28 | 삼성전자주식회사 | ZnO 반도체 박막의 제조방법 및 이를 이용한박막트랜지스터 및 그 제조방법 |
| JP5216204B2 (ja) * | 2006-10-31 | 2013-06-19 | 株式会社半導体エネルギー研究所 | 液晶表示装置及びその作製方法 |
| KR101410926B1 (ko) * | 2007-02-16 | 2014-06-24 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조방법 |
| JP5003277B2 (ja) * | 2007-05-18 | 2012-08-15 | ソニー株式会社 | 薄膜の結晶化方法、薄膜半導体装置の製造方法、電子機器の製造方法、および表示装置の製造方法 |
| JP5272342B2 (ja) * | 2007-07-13 | 2013-08-28 | 凸版印刷株式会社 | 薄膜トランジスタ基板の製造方法及び画像表示装置 |
| JP4488039B2 (ja) * | 2007-07-25 | 2010-06-23 | ソニー株式会社 | 薄膜半導体装置の製造方法 |
| KR101499239B1 (ko) * | 2008-08-26 | 2015-03-06 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
| CN102509736B (zh) * | 2008-10-24 | 2015-08-19 | 株式会社半导体能源研究所 | 半导体器件和用于制造该半导体器件的方法 |
| JP2010182819A (ja) * | 2009-02-04 | 2010-08-19 | Sony Corp | 薄膜トランジスタおよび表示装置 |
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2009
- 2009-02-04 JP JP2009024035A patent/JP2010182819A/ja active Pending
- 2009-12-29 US US12/654,658 patent/US8426851B2/en active Active
-
2010
- 2010-01-28 CN CN2010101080202A patent/CN101794823B/zh active Active
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2012
- 2012-10-31 US US13/665,487 patent/US9178072B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101335304A (zh) * | 2005-09-29 | 2008-12-31 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
| CN101090073A (zh) * | 2006-05-10 | 2007-12-19 | 索尼株式会社 | 制造薄膜晶体管的方法、薄膜晶体管和显示单元 |
| WO2008069056A1 (en) * | 2006-12-05 | 2008-06-12 | Canon Kabushiki Kaisha | Bottom gate type thin film transistor, method of manufacturing the same, and display apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010182819A (ja) | 2010-08-19 |
| US20100193772A1 (en) | 2010-08-05 |
| CN101794823A (zh) | 2010-08-04 |
| US9178072B2 (en) | 2015-11-03 |
| US8426851B2 (en) | 2013-04-23 |
| US20130056728A1 (en) | 2013-03-07 |
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