CN101755015A - 表面-改性的、热解制备的二氧化硅 - Google Patents
表面-改性的、热解制备的二氧化硅 Download PDFInfo
- Publication number
- CN101755015A CN101755015A CN200880025235A CN200880025235A CN101755015A CN 101755015 A CN101755015 A CN 101755015A CN 200880025235 A CN200880025235 A CN 200880025235A CN 200880025235 A CN200880025235 A CN 200880025235A CN 101755015 A CN101755015 A CN 101755015A
- Authority
- CN
- China
- Prior art keywords
- silicon
- dioxide
- modified
- preparation
- pyrolysis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 108
- 239000000377 silicon dioxide Substances 0.000 title claims abstract description 54
- 235000012239 silicon dioxide Nutrition 0.000 title claims abstract description 54
- 229960001866 silicon dioxide Drugs 0.000 title claims abstract description 54
- 238000002360 preparation method Methods 0.000 title claims abstract description 27
- 238000000197 pyrolysis Methods 0.000 title claims abstract description 24
- 230000008719 thickening Effects 0.000 claims abstract description 12
- 239000007788 liquid Substances 0.000 claims abstract description 8
- 239000008187 granular material Substances 0.000 claims abstract description 3
- -1 polydimethylsiloxane Polymers 0.000 claims description 47
- 239000003795 chemical substances by application Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 claims description 10
- 238000005507 spraying Methods 0.000 claims description 9
- 239000007921 spray Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000012986 modification Methods 0.000 claims description 6
- 230000004048 modification Effects 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- 238000007669 thermal treatment Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 description 25
- 125000003118 aryl group Chemical group 0.000 description 17
- 238000002156 mixing Methods 0.000 description 14
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 13
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 230000004927 fusion Effects 0.000 description 5
- RSKGMYDENCAJEN-UHFFFAOYSA-N hexadecyl(trimethoxy)silane Chemical compound CCCCCCCCCCCCCCCC[Si](OC)(OC)OC RSKGMYDENCAJEN-UHFFFAOYSA-N 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 239000000523 sample Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 125000000753 cycloalkyl group Chemical group 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 150000001282 organosilanes Chemical class 0.000 description 4
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 239000011541 reaction mixture Substances 0.000 description 4
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 4
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 3
- 229960003493 octyltriethoxysilane Drugs 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- 241000024287 Areas Species 0.000 description 1
- LJXVZFDPCUEGLM-UHFFFAOYSA-N C(CCCCC)[Si](OC)(OC)OC.[F] Chemical class C(CCCCC)[Si](OC)(OC)OC.[F] LJXVZFDPCUEGLM-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910003849 O-Si Inorganic materials 0.000 description 1
- 229910003872 O—Si Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000012496 blank sample Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- SSLNXNMYNJKQTO-UHFFFAOYSA-N diethoxy-octyl-(2,2,2-trifluoroethoxy)silane Chemical compound FC(CO[Si](OCC)(OCC)CCCCCCCC)(F)F SSLNXNMYNJKQTO-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- OYGYKEULCAINCL-UHFFFAOYSA-N triethoxy(hexadecyl)silane Chemical compound CCCCCCCCCCCCCCCC[Si](OCC)(OCC)OCC OYGYKEULCAINCL-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/28—Compounds of silicon
- C09C1/30—Silicic acid
- C09C1/3081—Treatment with organo-silicon compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/43—Thickening agents
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/50—Agglomerated particles
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/11—Powder tap density
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/80—Compositional purity
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Nanotechnology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Composite Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
- Silicon Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007035951A DE102007035951A1 (de) | 2007-07-30 | 2007-07-30 | Oberflächenmodifizierte, pyrogen hergestellte Kieselsäuren |
| DE102007035951.0 | 2007-07-30 | ||
| PCT/EP2008/058435 WO2009015971A1 (en) | 2007-07-30 | 2008-07-01 | Surface-modified, pyrogenically prepared silicas |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101755015A true CN101755015A (zh) | 2010-06-23 |
Family
ID=39772907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200880025235A Pending CN101755015A (zh) | 2007-07-30 | 2008-07-01 | 表面-改性的、热解制备的二氧化硅 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20100196243A1 (enExample) |
| EP (1) | EP2171002B1 (enExample) |
| JP (1) | JP5484331B2 (enExample) |
| CN (1) | CN101755015A (enExample) |
| DE (1) | DE102007035951A1 (enExample) |
| UA (1) | UA100697C2 (enExample) |
| WO (1) | WO2009015971A1 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105228970A (zh) * | 2013-03-26 | 2016-01-06 | 喜利得股份公司 | 用于胺固化剂的添加剂组合物、其用途以及含有其的胺固化剂组合物 |
| CN108698885A (zh) * | 2015-12-18 | 2018-10-23 | 贺利氏石英玻璃有限两合公司 | 石英玻璃制备中硅含量的提升 |
| CN115806746A (zh) * | 2022-08-18 | 2023-03-17 | 杭州应星新材料有限公司 | 一种等离子体原位聚合硅油改性二氧化硅的方法及应用 |
| CN115838176A (zh) * | 2022-08-18 | 2023-03-24 | 杭州应星新材料有限公司 | 一种硅油处理的疏水二氧化硅制备方法及二氧化硅 |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007035955A1 (de) * | 2007-07-30 | 2009-02-05 | Evonik Degussa Gmbh | Oberflächenmodifizierte, pyrogen hergestellte Kieselsäuren |
| DE102007035952A1 (de) * | 2007-07-30 | 2009-04-09 | Evonik Degussa Gmbh | Oberflächenmodifizierte, pyrogen hergestellte Kieselsäuren |
| WO2011000816A1 (de) | 2009-07-03 | 2011-01-06 | Basf Se | Nanokompositblends enthaltend polyamide und polyolefine |
| EP2456816A1 (de) | 2009-07-21 | 2012-05-30 | Basf Se | Nanokompositblends auf basis von polyamiden und polyarylenethersulfonen |
| WO2011134930A1 (de) | 2010-04-30 | 2011-11-03 | Basf Se | Langfaserverstärkte polyamide mit polyolefinen |
| WO2012022669A2 (de) | 2010-08-19 | 2012-02-23 | Basf Se | Nanocompositblends mit polyestern |
| WO2012168324A1 (de) * | 2011-06-09 | 2012-12-13 | Basf Se | Biologisch abbaubare polyestermischung |
| EP2935445B1 (en) * | 2012-12-21 | 2019-04-03 | 3M Innovative Properties Company | Composition comprising particulate flow aid |
| EP3178887B1 (en) * | 2015-12-09 | 2018-06-20 | Evonik Degussa GmbH | Hydrophobic silica for electrophotographic toner composition |
| JP6940235B2 (ja) | 2015-12-18 | 2021-09-22 | ヘレウス クワルツグラス ゲーエムベーハー ウント コンパニー カーゲー | 高融点金属の溶融坩堝内での石英ガラス体の調製 |
| TWI733723B (zh) | 2015-12-18 | 2021-07-21 | 德商何瑞斯廓格拉斯公司 | 不透明石英玻璃體的製備 |
| WO2017103131A1 (de) | 2015-12-18 | 2017-06-22 | Heraeus Quarzglas Gmbh & Co. Kg | Verringern des erdalkalimetallgehalts von siliziumdioxidgranulat durch behandlung von kohlenstoffdotiertem siliziumdioxidgranulat bei hoher temperatur |
| KR20180094087A (ko) | 2015-12-18 | 2018-08-22 | 헤래우스 크바르츠글라스 게엠베하 ＆ 컴파니 케이지 | 실리카 과립으로부터 실리카 유리 제품의 제조 |
| CN108698894A (zh) | 2015-12-18 | 2018-10-23 | 贺利氏石英玻璃有限两合公司 | 在多腔式烘箱中制备石英玻璃体 |
| EP3390303B1 (de) | 2015-12-18 | 2024-02-07 | Heraeus Quarzglas GmbH & Co. KG | Herstellung von quarzglaskörpern mit taupunktkontrolle im schmelzofen |
| CN108698883A (zh) | 2015-12-18 | 2018-10-23 | 贺利氏石英玻璃有限两合公司 | 石英玻璃制备中的二氧化硅的喷雾造粒 |
| CN112638490B (zh) | 2018-06-15 | 2023-01-03 | 格雷斯公司 | 消泡剂活性物质、其制造方法和消泡制剂 |
| EP3954743A1 (de) | 2020-08-12 | 2022-02-16 | Evonik Operations GmbH | Verwendung von siliziumdioxid zur verbesserung der leitfähigkeit von beschichtungen |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5989768A (en) * | 1997-03-06 | 1999-11-23 | Cabot Corporation | Charge-modified metal oxides with cyclic silazane and electrostatographic systems incorporating same |
| JP4372331B2 (ja) * | 2000-11-07 | 2009-11-25 | 電気化学工業株式会社 | シリカ微粉の表面改質法 |
| DE10132943A1 (de) * | 2001-07-06 | 2003-01-23 | Degussa | Silanmodifizierter oxidischer oder silikatischer Füllstoff, Verfahren zu dessen Herstellung und dessen Verwendung |
| DE10145162A1 (de) * | 2001-09-13 | 2003-04-10 | Wacker Chemie Gmbh | Kieselsäure mit geringem Gehalt an Kieselsäure-Silanolgruppen |
| DE10150274A1 (de) * | 2001-10-12 | 2003-04-30 | Wacker Chemie Gmbh | Kieselsäure mit homogener Silyliermittelschicht |
| DE10151478C1 (de) * | 2001-10-18 | 2003-03-13 | Wacker Chemie Gmbh | Mit Aminogruppen oberflächenmodifizierte Feststoffe, Verfahren zu deren Herstellung und deren Verwendung |
| DE10239424A1 (de) * | 2002-08-28 | 2004-03-11 | Degussa Ag | Kieselsäuren |
| EP1431245A1 (de) * | 2002-12-17 | 2004-06-23 | Degussa-Hüls Aktiengesellschaft | Oberflächenmodifizierte, aerogelartige, strukturierte Kieselsäure |
| DE10260323A1 (de) * | 2002-12-20 | 2004-07-08 | Wacker-Chemie Gmbh | Wasserbenetzbare silylierte Metalloxide |
| US8034173B2 (en) * | 2003-12-18 | 2011-10-11 | Evonik Degussa Gmbh | Processing compositions and method of forming the same |
| DE102004029073A1 (de) * | 2004-06-16 | 2005-12-29 | Degussa Ag | Lackformulierung mit verbesserten rheologischen Eigenschaften |
| DE102005001409A1 (de) * | 2005-01-12 | 2006-07-20 | Degussa Ag | Pyrogen hergestelltes Siliciumdioxidpulver und dieses Pulver enthaltene Silikondichtmasse |
| DE102005001408A1 (de) * | 2005-01-12 | 2006-07-20 | Degussa Ag | Pyrogen hergestelltes Siliciumdioxidpulver |
| DE102007035952A1 (de) * | 2007-07-30 | 2009-04-09 | Evonik Degussa Gmbh | Oberflächenmodifizierte, pyrogen hergestellte Kieselsäuren |
| DE102007035955A1 (de) * | 2007-07-30 | 2009-02-05 | Evonik Degussa Gmbh | Oberflächenmodifizierte, pyrogen hergestellte Kieselsäuren |
-
2007
- 2007-07-30 DE DE102007035951A patent/DE102007035951A1/de not_active Ceased
-
2008
- 2008-07-01 CN CN200880025235A patent/CN101755015A/zh active Pending
- 2008-07-01 US US12/670,130 patent/US20100196243A1/en not_active Abandoned
- 2008-07-01 JP JP2010518587A patent/JP5484331B2/ja active Active
- 2008-07-01 UA UAA201002024A patent/UA100697C2/uk unknown
- 2008-07-01 EP EP08774581.6A patent/EP2171002B1/en active Active
- 2008-07-01 WO PCT/EP2008/058435 patent/WO2009015971A1/en not_active Ceased
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105228970A (zh) * | 2013-03-26 | 2016-01-06 | 喜利得股份公司 | 用于胺固化剂的添加剂组合物、其用途以及含有其的胺固化剂组合物 |
| CN108698885A (zh) * | 2015-12-18 | 2018-10-23 | 贺利氏石英玻璃有限两合公司 | 石英玻璃制备中硅含量的提升 |
| CN115806746A (zh) * | 2022-08-18 | 2023-03-17 | 杭州应星新材料有限公司 | 一种等离子体原位聚合硅油改性二氧化硅的方法及应用 |
| CN115838176A (zh) * | 2022-08-18 | 2023-03-24 | 杭州应星新材料有限公司 | 一种硅油处理的疏水二氧化硅制备方法及二氧化硅 |
| CN115806746B (zh) * | 2022-08-18 | 2024-11-15 | 杭州应星新材料有限公司 | 一种等离子体原位聚合硅油改性二氧化硅的方法及应用 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2171002A1 (en) | 2010-04-07 |
| WO2009015971A1 (en) | 2009-02-05 |
| JP2010534619A (ja) | 2010-11-11 |
| UA100697C2 (uk) | 2013-01-25 |
| US20100196243A1 (en) | 2010-08-05 |
| EP2171002B1 (en) | 2014-04-02 |
| DE102007035951A1 (de) | 2009-02-05 |
| JP5484331B2 (ja) | 2014-05-07 |
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