CN101688315A - 用于蚀刻铜和回收废蚀刻溶液的方法 - Google Patents
用于蚀刻铜和回收废蚀刻溶液的方法 Download PDFInfo
- Publication number
- CN101688315A CN101688315A CN200880024106A CN200880024106A CN101688315A CN 101688315 A CN101688315 A CN 101688315A CN 200880024106 A CN200880024106 A CN 200880024106A CN 200880024106 A CN200880024106 A CN 200880024106A CN 101688315 A CN101688315 A CN 101688315A
- Authority
- CN
- China
- Prior art keywords
- etching
- solution
- copper
- etching solution
- recovery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D11/00—Solvent extraction
- B01D11/04—Solvent extraction of solutions which are liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D11/00—Solvent extraction
- B01D11/04—Solvent extraction of solutions which are liquid
- B01D11/0446—Juxtaposition of mixers-settlers
- B01D11/0457—Juxtaposition of mixers-settlers comprising rotating mechanisms, e.g. mixers, mixing pumps
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
Description
Claims (26)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0701681A SE531697C2 (sv) | 2007-07-11 | 2007-07-11 | Etsnings- och återvinningsförfarande |
SE0701681-9 | 2007-07-11 | ||
SE07016819 | 2007-07-11 | ||
PCT/SE2008/000431 WO2009008801A1 (en) | 2007-07-11 | 2008-07-07 | A method for etching copper and recovery of the spent etching solution |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101688315A true CN101688315A (zh) | 2010-03-31 |
CN101688315B CN101688315B (zh) | 2012-07-25 |
Family
ID=40228823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008800241068A Active CN101688315B (zh) | 2007-07-11 | 2008-07-07 | 用于蚀刻铜和回收废蚀刻溶液的方法 |
Country Status (9)
Country | Link |
---|---|
US (1) | US8236189B2 (zh) |
EP (1) | EP2165007B1 (zh) |
JP (1) | JP5608078B2 (zh) |
KR (1) | KR101560704B1 (zh) |
CN (1) | CN101688315B (zh) |
HK (1) | HK1141564A1 (zh) |
PL (1) | PL2165007T3 (zh) |
SE (1) | SE531697C2 (zh) |
WO (1) | WO2009008801A1 (zh) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102240814A (zh) * | 2010-05-12 | 2011-11-16 | 陈卓贤 | 一种环保型回收线路板蚀刻废液制备超细铜粉的方法 |
CN102864306A (zh) * | 2012-09-26 | 2013-01-09 | 东北大学 | 一种提高水溶液中铜萃取效率的方法 |
CN102942278A (zh) * | 2012-11-22 | 2013-02-27 | 长沙铂鲨环保设备有限公司 | 一种酸性含铜废液的处理方法 |
CN103757635A (zh) * | 2013-12-13 | 2014-04-30 | 陶克(苏州)机械设备有限公司 | 电解槽及使用该电解槽的再生酸性蚀刻液设备及再生方法 |
CN104264184A (zh) * | 2014-09-12 | 2015-01-07 | 上海电力学院 | 一种从废旧线路板中提取金属铜的方法 |
CN105077561A (zh) * | 2015-08-28 | 2015-11-25 | 安徽中烟工业有限责任公司 | 一种造纸法再造烟叶萃取液中Cu含量的选择性降低方法 |
CN106555055A (zh) * | 2015-09-29 | 2017-04-05 | 宏齐科技股份有限公司 | 从含金属废液中回收固态金属的系统及方法 |
CN106676527A (zh) * | 2015-11-06 | 2017-05-17 | 陶克(苏州)机械设备有限公司 | 一种氯酸钠型酸性蚀刻液离线再生系统 |
CN111270239A (zh) * | 2020-03-27 | 2020-06-12 | Tcl华星光电技术有限公司 | 含铜酸性蚀刻液循环再生的方法 |
CN112813489A (zh) * | 2020-12-30 | 2021-05-18 | 广东臻鼎环境科技有限公司 | 一种试剂级二水合氯化铜晶体的制备方法 |
CN112831784A (zh) * | 2020-12-31 | 2021-05-25 | 惠州市鸿宇泰科技有限公司 | 一种酸性蚀刻液及提高其蚀刻精度的控制方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102259087B (zh) * | 2011-07-20 | 2013-08-07 | 上海电力学院 | 一种具有耐蚀性能的黄铜超疏水表面的制备方法 |
CN102335651B (zh) * | 2011-08-08 | 2015-12-16 | 上海电力学院 | 一种具有耐蚀性能的超疏水表面的黄铜的制备方法 |
EP2927347A1 (en) | 2014-04-01 | 2015-10-07 | Sigma Engineering Ab | Oxidation of copper in a copper etching solution by the use of oxygen and/or air as an oxidizing agent |
CN106119853A (zh) * | 2016-08-05 | 2016-11-16 | 励福(江门)环保科技股份有限公司 | 高效零排放废酸性铜蚀刻液回收及再生系统 |
CN110770177A (zh) * | 2017-08-16 | 2020-02-07 | 深圳市柔宇科技有限公司 | 废液存储装置和湿式蚀刻系统 |
CN108642518A (zh) * | 2018-07-09 | 2018-10-12 | 南京舜业环保科技有限公司 | 一种pcb酸性蚀刻液提取铜的方法及装置 |
CN110359051B (zh) * | 2019-06-18 | 2020-09-22 | 龙建国 | 线路板蚀刻废液循环再利用的方法 |
WO2021061184A1 (en) * | 2019-09-23 | 2021-04-01 | All Green Recycling, Inc. | Systems and methods of efficiently recovering precious metals using an alkaline leach, ultrasound, and electrolysis |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
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CH505213A (de) * | 1968-11-07 | 1971-03-31 | Saba Gmbh | Verfahren zum Ätzen von Kupfer und Kupferlegierungen, insbesondere von kupferkaschierten Schichtpressstoffen |
US3772105A (en) * | 1970-07-24 | 1973-11-13 | Shipley Co | Continuous etching process |
US3784455A (en) * | 1971-12-28 | 1974-01-08 | Western Electric Co | Methods of electrolytic regenerative etching and metal recovery |
SE387966B (sv) * | 1972-09-09 | 1976-09-20 | Loewe Opta Gmbh | Sett att upparbeta helt eller delvis forbrukade kopparetsningslosningar |
JPS5124537A (en) * | 1974-08-26 | 1976-02-27 | Hitachi Ltd | Etsuchinguyokuno saiseihoho |
US4060447A (en) * | 1976-03-29 | 1977-11-29 | Philip A. Hunt Chemical Corporation | Process for etching of metal |
SE411231B (sv) * | 1978-05-02 | 1979-12-10 | Mx Processer Reinhardt | Forfarande for atervinning av ett ammonialkaliskt etsbad |
GB2048173A (en) * | 1979-02-01 | 1980-12-10 | Procirc Co Ltd | Apparatus for etching copper and copper alloys |
US4272492A (en) * | 1979-05-31 | 1981-06-09 | Jensen Wayne H | Selective extraction and recovery of copper |
DE3035864A1 (de) * | 1980-09-23 | 1982-05-06 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zur regenerierung salzsaurer kupferchlorid-aetzloesungen |
US4378270A (en) * | 1981-10-29 | 1983-03-29 | Learonal, Inc. | Method of etching circuit boards and recovering copper from the spent etch solutions |
US4604175A (en) * | 1982-12-07 | 1986-08-05 | Naumov Jury I | Process for regeneration of iron-copper chloride etching solution |
GB2133806B (en) * | 1983-01-20 | 1986-06-04 | Electricity Council | Regenerating solutions for etching copper |
ATE37047T1 (de) * | 1984-10-19 | 1988-09-15 | Ibm | Verfahren zum automatischen regenerieren von kupferchlorid-aetzloesungen. |
SU1280045A1 (ru) * | 1984-12-25 | 1986-12-30 | Предприятие П/Я В-2438 | Способ обработки отработанного раствора дл травлени меди |
DE3839651A1 (de) * | 1988-11-24 | 1990-05-31 | Hoellmueller Hans | Anlage zum aetzen von gegenstaenden |
EP0393270A1 (en) * | 1989-04-21 | 1990-10-24 | Ming-Hsing Lee | Process for etching copper with ammoniacal etchant solution and reconditioning the used etchant solution |
JP2700982B2 (ja) * | 1992-11-02 | 1998-01-21 | 鶴見曹達株式会社 | エッチング処理装置 |
US5560838A (en) * | 1994-12-05 | 1996-10-01 | Training `N` Technology, Inc. | Process and apparatus for converting spent etchants |
US5556553A (en) * | 1995-05-23 | 1996-09-17 | Applied Electroless Concepts, Inc. | Recycle process for regeneration of ammoniacal copper etchant |
US5755950A (en) * | 1995-06-07 | 1998-05-26 | Dulin Metals Company | Process for removing plating materials from copper-based substrates |
DE19521352A1 (de) * | 1995-06-12 | 1996-12-19 | Henkel Kgaa | Verfahren zur Aufarbeitung ammoniakalischer Metallösungen |
JPH11140673A (ja) * | 1997-11-10 | 1999-05-25 | Mec Kk | 銅エッチング液の廃液の再生方法 |
JP3392336B2 (ja) * | 1997-12-01 | 2003-03-31 | 株式会社アイン | エッチング廃液の再利用方法 |
US6086779A (en) * | 1999-03-01 | 2000-07-11 | Mcgean-Rohco, Inc. | Copper etching compositions and method for etching copper |
GB9907848D0 (en) * | 1999-04-07 | 1999-06-02 | Shipley Co Llc | Processes and apparatus for removal of copper from fluids |
US7175819B2 (en) | 2005-03-04 | 2007-02-13 | Phibro-Tech, Inc. | Regeneration of cupric etchants and recovery of copper sulfate |
CN1904142B (zh) * | 2006-07-08 | 2012-01-25 | 江门市蓬江区大盈机电设备有限公司 | 一种蚀刻废液或低含铜废水的提铜方法 |
US8597461B2 (en) * | 2009-09-02 | 2013-12-03 | Novellus Systems, Inc. | Reduced isotropic etchant material consumption and waste generation |
-
2007
- 2007-07-11 SE SE0701681A patent/SE531697C2/sv not_active IP Right Cessation
-
2008
- 2008-07-07 KR KR1020107000541A patent/KR101560704B1/ko active IP Right Grant
- 2008-07-07 WO PCT/SE2008/000431 patent/WO2009008801A1/en active Application Filing
- 2008-07-07 US US12/665,960 patent/US8236189B2/en active Active
- 2008-07-07 EP EP08767103.8A patent/EP2165007B1/en active Active
- 2008-07-07 JP JP2010516004A patent/JP5608078B2/ja active Active
- 2008-07-07 CN CN2008800241068A patent/CN101688315B/zh active Active
- 2008-07-07 PL PL08767103T patent/PL2165007T3/pl unknown
-
2010
- 2010-08-20 HK HK10107988.7A patent/HK1141564A1/xx unknown
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102240814A (zh) * | 2010-05-12 | 2011-11-16 | 陈卓贤 | 一种环保型回收线路板蚀刻废液制备超细铜粉的方法 |
CN102864306A (zh) * | 2012-09-26 | 2013-01-09 | 东北大学 | 一种提高水溶液中铜萃取效率的方法 |
CN102864306B (zh) * | 2012-09-26 | 2014-02-05 | 东北大学 | 一种提高水溶液中铜萃取效率的方法 |
CN102942278A (zh) * | 2012-11-22 | 2013-02-27 | 长沙铂鲨环保设备有限公司 | 一种酸性含铜废液的处理方法 |
CN103757635B (zh) * | 2013-12-13 | 2016-11-23 | 陶克(苏州)机械设备有限公司 | 电解槽及使用该电解槽的再生酸性蚀刻液设备及再生方法 |
CN103757635A (zh) * | 2013-12-13 | 2014-04-30 | 陶克(苏州)机械设备有限公司 | 电解槽及使用该电解槽的再生酸性蚀刻液设备及再生方法 |
CN104264184A (zh) * | 2014-09-12 | 2015-01-07 | 上海电力学院 | 一种从废旧线路板中提取金属铜的方法 |
CN105077561A (zh) * | 2015-08-28 | 2015-11-25 | 安徽中烟工业有限责任公司 | 一种造纸法再造烟叶萃取液中Cu含量的选择性降低方法 |
CN106555055A (zh) * | 2015-09-29 | 2017-04-05 | 宏齐科技股份有限公司 | 从含金属废液中回收固态金属的系统及方法 |
CN106676527A (zh) * | 2015-11-06 | 2017-05-17 | 陶克(苏州)机械设备有限公司 | 一种氯酸钠型酸性蚀刻液离线再生系统 |
CN106676527B (zh) * | 2015-11-06 | 2019-03-08 | 库特勒环保科技(苏州)有限公司 | 一种氯酸钠型酸性蚀刻液离线再生系统 |
CN111270239A (zh) * | 2020-03-27 | 2020-06-12 | Tcl华星光电技术有限公司 | 含铜酸性蚀刻液循环再生的方法 |
CN112813489A (zh) * | 2020-12-30 | 2021-05-18 | 广东臻鼎环境科技有限公司 | 一种试剂级二水合氯化铜晶体的制备方法 |
CN112831784A (zh) * | 2020-12-31 | 2021-05-25 | 惠州市鸿宇泰科技有限公司 | 一种酸性蚀刻液及提高其蚀刻精度的控制方法 |
Also Published As
Publication number | Publication date |
---|---|
KR101560704B1 (ko) | 2015-10-15 |
JP5608078B2 (ja) | 2014-10-15 |
WO2009008801A1 (en) | 2009-01-15 |
SE0701681L (sv) | 2009-01-12 |
EP2165007A4 (en) | 2014-08-13 |
KR20100034001A (ko) | 2010-03-31 |
EP2165007B1 (en) | 2015-11-11 |
PL2165007T3 (pl) | 2016-05-31 |
HK1141564A1 (en) | 2010-11-12 |
EP2165007A1 (en) | 2010-03-24 |
SE531697C2 (sv) | 2009-07-07 |
US20110000884A1 (en) | 2011-01-06 |
CN101688315B (zh) | 2012-07-25 |
US8236189B2 (en) | 2012-08-07 |
JP2010533242A (ja) | 2010-10-21 |
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Correction item: Inventor Name Correct: Harald Otn False: Ottertun Harald Number: 30 Page: The title page Volume: 28 |
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ERR | Gazette correction |
Free format text: CORRECT: INVENTOR NAME; FROM: OTTERTUS HARAL TO: OTTERTUN HARALD |
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