CN101656294A - 包括针孔底切区域的器件和工艺 - Google Patents

包括针孔底切区域的器件和工艺 Download PDF

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Publication number
CN101656294A
CN101656294A CN200910166517A CN200910166517A CN101656294A CN 101656294 A CN101656294 A CN 101656294A CN 200910166517 A CN200910166517 A CN 200910166517A CN 200910166517 A CN200910166517 A CN 200910166517A CN 101656294 A CN101656294 A CN 101656294A
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CN
China
Prior art keywords
region
conductive region
etching
dielectric
undercut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200910166517A
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English (en)
Chinese (zh)
Inventor
Y·吴
P·刘
Y·李
H·潘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Publication of CN101656294A publication Critical patent/CN101656294A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/464—Lateral top-gate IGFETs comprising only a single gate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/468—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/481—Insulated gate field-effect transistors [IGFETs] characterised by the gate conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/80—Constructional details
    • H10K10/82—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Electroluminescent Light Sources (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CN200910166517A 2008-08-18 2009-08-17 包括针孔底切区域的器件和工艺 Pending CN101656294A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/193,249 US7821068B2 (en) 2008-08-18 2008-08-18 Device and process involving pinhole undercut area
US12/193249 2008-08-18

Publications (1)

Publication Number Publication Date
CN101656294A true CN101656294A (zh) 2010-02-24

Family

ID=41262208

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200910166517A Pending CN101656294A (zh) 2008-08-18 2009-08-17 包括针孔底切区域的器件和工艺

Country Status (6)

Country Link
US (1) US7821068B2 (enExample)
EP (1) EP2157629A3 (enExample)
JP (1) JP2010045369A (enExample)
KR (1) KR20100021975A (enExample)
CN (1) CN101656294A (enExample)
CA (1) CA2675083C (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108039338A (zh) * 2017-11-24 2018-05-15 华中科技大学 一种消除介质层针孔缺陷影响的方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101070289B1 (ko) * 2009-12-30 2011-10-06 주식회사 하이닉스반도체 반도체 장치 제조방법
US9076975B2 (en) 2010-04-27 2015-07-07 Xerox Corporation Dielectric composition for thin-film transistors
TWI445180B (zh) * 2011-09-28 2014-07-11 E Ink Holdings Inc 陣列基板及使用其之顯示裝置

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US20070018240A1 (en) * 2005-07-25 2007-01-25 Freescale Semiconductor, Inc. Electronic device including discontinuous storage elements
US20070063180A1 (en) * 2005-09-07 2007-03-22 Elpida Memory, Inc. Electrically rewritable non-volatile memory element and method of manufacturing the same
US20070128758A1 (en) * 2005-12-01 2007-06-07 Keisuke Tanaka Semiconductor device and method for fabricating the same
US20070145453A1 (en) * 2005-12-23 2007-06-28 Xerox Corporation Dielectric layer for electronic devices
US20070247064A1 (en) * 2000-02-16 2007-10-25 Idemitsu Kosan Co., Ltd. Actively driven organic el device and manufacturing method thereof
CN101093861A (zh) * 2006-06-21 2007-12-26 国际商业机器公司 Mim电容器器件及其制造方法

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DE2707959A1 (de) 1977-02-24 1978-08-31 Eberhard Loeffelholz Skistock und skihandschuh halte- und fangvorrichtung
JPS61183972A (ja) * 1985-02-08 1986-08-16 Matsushita Electric Ind Co Ltd 薄膜半導体装置の製造方法
US5354695A (en) * 1992-04-08 1994-10-11 Leedy Glenn J Membrane dielectric isolation IC fabrication
JP3200639B2 (ja) * 1992-05-19 2001-08-20 カシオ計算機株式会社 薄膜トランジスタパネルの製造方法
TW232751B (en) * 1992-10-09 1994-10-21 Semiconductor Energy Res Co Ltd Semiconductor device and method for forming the same
US5424233A (en) * 1994-05-06 1995-06-13 United Microflectronics Corporation Method of making electrically programmable and erasable memory device with a depression
US6107117A (en) 1996-12-20 2000-08-22 Lucent Technologies Inc. Method of making an organic thin film transistor
US6331722B1 (en) * 1997-01-18 2001-12-18 Semiconductor Energy Laboratory Co., Ltd. Hybrid circuit and electronic device using same
JP2001281695A (ja) * 2000-03-30 2001-10-10 Sharp Corp 薄膜静電容量の製造方法および液晶表示装置
JP4854866B2 (ja) * 2001-04-27 2012-01-18 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6949762B2 (en) 2002-01-11 2005-09-27 Xerox Corporation Polythiophenes and devices thereof
US6621099B2 (en) 2002-01-11 2003-09-16 Xerox Corporation Polythiophenes and devices thereof
US6770904B2 (en) 2002-01-11 2004-08-03 Xerox Corporation Polythiophenes and electronic devices generated therefrom
US20030227014A1 (en) 2002-06-11 2003-12-11 Xerox Corporation. Process for forming semiconductor layer of micro-and nano-electronic devices
JP3532188B1 (ja) 2002-10-21 2004-05-31 沖電気工業株式会社 半導体装置及びその製造方法
US20060073613A1 (en) * 2004-09-29 2006-04-06 Sanjeev Aggarwal Ferroelectric memory cells and methods for fabricating ferroelectric memory cells and ferroelectric capacitors thereof
JP2007005782A (ja) * 2005-05-27 2007-01-11 Semiconductor Energy Lab Co Ltd 半導体装置及び半導体装置の作製方法
WO2008059633A1 (en) * 2006-11-15 2008-05-22 Sharp Kabushiki Kaisha Semiconductor element, method for fabricating the same and display
US7855097B2 (en) * 2008-07-11 2010-12-21 Organicid, Inc. Method of increasing yield in OFETs by using a high-K dielectric layer in a dual dielectric layer

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070247064A1 (en) * 2000-02-16 2007-10-25 Idemitsu Kosan Co., Ltd. Actively driven organic el device and manufacturing method thereof
US20070018240A1 (en) * 2005-07-25 2007-01-25 Freescale Semiconductor, Inc. Electronic device including discontinuous storage elements
US20070063180A1 (en) * 2005-09-07 2007-03-22 Elpida Memory, Inc. Electrically rewritable non-volatile memory element and method of manufacturing the same
US20070128758A1 (en) * 2005-12-01 2007-06-07 Keisuke Tanaka Semiconductor device and method for fabricating the same
US20070145453A1 (en) * 2005-12-23 2007-06-28 Xerox Corporation Dielectric layer for electronic devices
CN101093861A (zh) * 2006-06-21 2007-12-26 国际商业机器公司 Mim电容器器件及其制造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108039338A (zh) * 2017-11-24 2018-05-15 华中科技大学 一种消除介质层针孔缺陷影响的方法

Also Published As

Publication number Publication date
CA2675083C (en) 2013-03-12
JP2010045369A (ja) 2010-02-25
KR20100021975A (ko) 2010-02-26
EP2157629A3 (en) 2015-05-13
EP2157629A2 (en) 2010-02-24
CA2675083A1 (en) 2010-02-18
US7821068B2 (en) 2010-10-26
US20100038714A1 (en) 2010-02-18

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