CN101646978B - 感光性树脂组合物 - Google Patents

感光性树脂组合物 Download PDF

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Publication number
CN101646978B
CN101646978B CN2008800101518A CN200880010151A CN101646978B CN 101646978 B CN101646978 B CN 101646978B CN 2008800101518 A CN2008800101518 A CN 2008800101518A CN 200880010151 A CN200880010151 A CN 200880010151A CN 101646978 B CN101646978 B CN 101646978B
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group
composition
alkyl
photosensitive
compound
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Expired - Fee Related
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CN2008800101518A
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Chinese (zh)
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CN101646978A (zh
Inventor
赖末友裕
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Asahi Kasei Corp
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Asahi Kasei E Materials Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/148—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/08—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/58—Metal-containing linkages
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/14—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Silicon Polymers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
CN2008800101518A 2007-04-04 2008-03-25 感光性树脂组合物 Expired - Fee Related CN101646978B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007098088 2007-04-04
JP098088/2007 2007-04-04
PCT/JP2008/055480 WO2008123210A1 (ja) 2007-04-04 2008-03-25 感光性樹脂組成物

Publications (2)

Publication Number Publication Date
CN101646978A CN101646978A (zh) 2010-02-10
CN101646978B true CN101646978B (zh) 2011-11-02

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CN2008800101518A Expired - Fee Related CN101646978B (zh) 2007-04-04 2008-03-25 感光性树脂组合物

Country Status (8)

Country Link
US (1) US8557498B2 (enExample)
EP (1) EP2133744B1 (enExample)
JP (1) JP5144646B2 (enExample)
KR (1) KR101121936B1 (enExample)
CN (1) CN101646978B (enExample)
AT (1) ATE516519T1 (enExample)
TW (1) TW200905400A (enExample)
WO (1) WO2008123210A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101802033B (zh) * 2007-12-14 2013-03-13 旭化成电子材料株式会社 感光性树脂组合物
JP5607898B2 (ja) * 2008-07-01 2014-10-15 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
JP5576622B2 (ja) * 2008-07-01 2014-08-20 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
US8372504B2 (en) * 2009-01-13 2013-02-12 Korea Advanced Institute Of Science And Technology Transparent composite compound
JP5636869B2 (ja) * 2010-10-20 2014-12-10 Jsr株式会社 感放射線性組成物、硬化膜、及びそれらの形成方法
EP2665762B1 (en) * 2011-01-21 2020-12-02 Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung e.V. Polymerizable compositions, cured products obtained therewith, and use of these materials
KR102232349B1 (ko) 2013-05-31 2021-03-26 롬엔드하스전자재료코리아유한회사 고내열성 네거티브형 감광성 수지 조성물 및 이로부터 제조된 경화막
CN105723261A (zh) * 2013-10-21 2016-06-29 学校法人东海大学 光波导的制造方法
JP6603115B2 (ja) * 2015-11-27 2019-11-06 信越化学工業株式会社 ケイ素含有縮合物、ケイ素含有レジスト下層膜形成用組成物、及びパターン形成方法
EP3243845A1 (en) 2016-05-13 2017-11-15 Ricoh Company, Ltd. Active energy ray curable composition, cured product, composition storage container, two-dimensional or three-dimensional image forming apparatus, and two-dimensional or three-dimensional image forming method
CN110221731B (zh) * 2018-03-02 2023-03-28 宸鸿光电科技股份有限公司 触控面板的直接图案化方法及其触控面板
KR20250001148A (ko) 2023-06-28 2025-01-06 주식회사 창발켐텍 새로운 글리시딜옥시프로필 유기 실록산 공중합체 및 이의 제조방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5158988A (en) * 1990-11-27 1992-10-27 Toshiba Silicone Co., Ltd. Photo-curable silicone compositions and adhesive silicone compositions
JPH05202146A (ja) 1991-12-27 1993-08-10 I C I Japan Kk 光硬化性樹脂組成物
US5861235A (en) * 1996-06-26 1999-01-19 Dow Corning Asia, Ltd. Ultraviolet-curable composition and method for patterning the cured product therefrom
CN1322225A (zh) * 1998-12-16 2001-11-14 旭化成株式会社 具有改进的熔体流动性的阻燃聚碳酸酯树脂组合物
WO2003031499A2 (de) * 2001-10-04 2003-04-17 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Photochemisch und/oder thermisch strukturierbare harze auf silanbasis, einstufiges verfahren zu deren herstellung, dabei einsetzbare ausgangsverbindungen und herstellungsverfahren für diese
JP2006045316A (ja) * 2004-08-03 2006-02-16 Nagase Chemtex Corp シルセスキオキサン含有化合物及びその製造方法

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JPS6167263A (ja) 1984-09-10 1986-04-07 Semiconductor Energy Lab Co Ltd 半導体装置作製方法
DE59107840D1 (de) * 1990-11-21 1996-06-27 Ciba Geigy Ag Silylierte Acylphosphinoxide
JPH1083080A (ja) * 1996-06-26 1998-03-31 Dow Corning Asia Kk 紫外線硬化性組成物およびこれを用いた硬化物パターンの形成方法
JPH1010741A (ja) * 1996-06-27 1998-01-16 Dow Corning Asia Kk 紫外線硬化性ポリシロキサン組成物およびこれを用いた硬化物パターンの製造方法
DE19932629A1 (de) * 1999-07-13 2001-01-18 Fraunhofer Ges Forschung Organisch modifizierte, lagerstabile, UV-härtbare, NIR-durchlässige und in Schichtdicken von 1 bis 150 mum fotostrukturierbare Kieselsäurepolykondensate, deren Herstellung und deren Verwendung
JP3904518B2 (ja) * 2001-04-09 2007-04-11 積水化学工業株式会社 光反応性組成物
US6627672B1 (en) 2001-05-16 2003-09-30 Henkel Loctite Corporation UV/moisture dual cure silicone potting compound with improved depth of cure
KR100614976B1 (ko) * 2004-04-12 2006-08-25 한국과학기술원 광소자 또는 디스플레이에 이용되는 무기/유기혼성올리고머, 나노혼성고분자 및 그 제조방법
WO2007086323A1 (ja) * 2006-01-24 2007-08-02 Asahi Kasei Emd Corporation 感光性樹脂組成物
JP4912058B2 (ja) * 2006-06-29 2012-04-04 旭化成イーマテリアルズ株式会社 ハイブリッド感光性樹脂組成物

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5158988A (en) * 1990-11-27 1992-10-27 Toshiba Silicone Co., Ltd. Photo-curable silicone compositions and adhesive silicone compositions
JPH05202146A (ja) 1991-12-27 1993-08-10 I C I Japan Kk 光硬化性樹脂組成物
US5861235A (en) * 1996-06-26 1999-01-19 Dow Corning Asia, Ltd. Ultraviolet-curable composition and method for patterning the cured product therefrom
CN1322225A (zh) * 1998-12-16 2001-11-14 旭化成株式会社 具有改进的熔体流动性的阻燃聚碳酸酯树脂组合物
WO2003031499A2 (de) * 2001-10-04 2003-04-17 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Photochemisch und/oder thermisch strukturierbare harze auf silanbasis, einstufiges verfahren zu deren herstellung, dabei einsetzbare ausgangsverbindungen und herstellungsverfahren für diese
JP2006045316A (ja) * 2004-08-03 2006-02-16 Nagase Chemtex Corp シルセスキオキサン含有化合物及びその製造方法

Also Published As

Publication number Publication date
EP2133744A1 (en) 2009-12-16
CN101646978A (zh) 2010-02-10
US20100104827A1 (en) 2010-04-29
JP5144646B2 (ja) 2013-02-13
EP2133744B1 (en) 2011-07-13
KR20100009536A (ko) 2010-01-27
TWI375125B (enExample) 2012-10-21
ATE516519T1 (de) 2011-07-15
EP2133744A4 (en) 2010-06-16
JPWO2008123210A1 (ja) 2010-07-15
US8557498B2 (en) 2013-10-15
KR101121936B1 (ko) 2012-03-09
WO2008123210A1 (ja) 2008-10-16
TW200905400A (en) 2009-02-01

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Effective date of registration: 20160503

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Patentee after: Asahi Kasei Kogyo K. K.

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Patentee before: Asahi Chemical Corp.

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CF01 Termination of patent right due to non-payment of annual fee