CN101615446B - 内含导电性粒子的树脂膜片及由其电连接的电子部件 - Google Patents

内含导电性粒子的树脂膜片及由其电连接的电子部件 Download PDF

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Publication number
CN101615446B
CN101615446B CN2009101503914A CN200910150391A CN101615446B CN 101615446 B CN101615446 B CN 101615446B CN 2009101503914 A CN2009101503914 A CN 2009101503914A CN 200910150391 A CN200910150391 A CN 200910150391A CN 101615446 B CN101615446 B CN 101615446B
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CN
China
Prior art keywords
resin film
layer
particles
resin
particle
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Expired - Fee Related
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CN2009101503914A
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English (en)
Chinese (zh)
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CN101615446A (zh
Inventor
河野务
小林宏治
小岛和良
美野真行
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Resonac Corp
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Hitachi Chemical Co Ltd
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Priority to CN201110251065.XA priority Critical patent/CN102298988B/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
CN2009101503914A 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件 Expired - Fee Related CN101615446B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110251065.XA CN102298988B (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2008167454 2008-06-26
JP2008-167454 2008-06-26
JP2008167454 2008-06-26
JP2009148551 2009-06-23
JP2009148551A JP4623224B2 (ja) 2008-06-26 2009-06-23 樹脂フィルムシート及び電子部品
JP2009-148551 2009-06-23

Related Child Applications (3)

Application Number Title Priority Date Filing Date
CN2011102510630A Division CN102298987A (zh) 2008-06-26 2009-06-25 树脂膜片的用途
CN201110251065.XA Division CN102298988B (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件
CN2011102511046A Division CN102298989A (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件

Publications (2)

Publication Number Publication Date
CN101615446A CN101615446A (zh) 2009-12-30
CN101615446B true CN101615446B (zh) 2013-07-17

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Family Applications (4)

Application Number Title Priority Date Filing Date
CN2009101503914A Expired - Fee Related CN101615446B (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件
CN201110251065.XA Expired - Fee Related CN102298988B (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件
CN2011102510630A Pending CN102298987A (zh) 2008-06-26 2009-06-25 树脂膜片的用途
CN2011102511046A Pending CN102298989A (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件

Family Applications After (3)

Application Number Title Priority Date Filing Date
CN201110251065.XA Expired - Fee Related CN102298988B (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件
CN2011102510630A Pending CN102298987A (zh) 2008-06-26 2009-06-25 树脂膜片的用途
CN2011102511046A Pending CN102298989A (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件

Country Status (4)

Country Link
JP (9) JP4623224B2 (cg-RX-API-DMAC7.html)
KR (8) KR101038614B1 (cg-RX-API-DMAC7.html)
CN (4) CN101615446B (cg-RX-API-DMAC7.html)
TW (3) TWI396626B (cg-RX-API-DMAC7.html)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4623224B2 (ja) * 2008-06-26 2011-02-02 日立化成工業株式会社 樹脂フィルムシート及び電子部品
CN106424711B (zh) * 2012-03-06 2019-02-15 东洋油墨Sc控股株式会社 导电性微粒及其制造方法、导电性树脂组成物、导电性薄片、以及电磁波屏蔽薄片
JP6221285B2 (ja) * 2013-03-21 2017-11-01 日立化成株式会社 回路部材の接続方法
JP6069153B2 (ja) * 2013-09-27 2017-02-01 デクセリアルズ株式会社 アンダーフィル材、及びこれを用いた半導体装置の製造方法
JP6645730B2 (ja) * 2014-01-28 2020-02-14 デクセリアルズ株式会社 接続体及び接続体の製造方法
JP6307308B2 (ja) * 2014-03-06 2018-04-04 デクセリアルズ株式会社 接続構造体の製造方法、及び回路接続材料
CN106415938B (zh) * 2014-03-31 2019-09-06 迪睿合株式会社 各向异性导电膜及其制备方法
KR101737173B1 (ko) 2014-07-24 2017-05-17 삼성에스디아이 주식회사 이방 도전성 필름, 이의 제조 방법, 및 이를 포함하는 반도체 장치
CN107001865B (zh) * 2014-11-12 2020-08-21 迪睿合株式会社 光固化类各向异性导电粘接剂、连接体的制造方法及电子部件的连接方法
JP6661886B2 (ja) * 2015-03-11 2020-03-11 日立化成株式会社 フィルム状回路接続材料及び回路部材の接続構造体の製造方法
KR101684144B1 (ko) 2015-07-08 2016-12-07 울산대학교 산학협력단 무단변속기를 이용한 고효율 파력발전기 및 그 제어방법
JP6327630B1 (ja) * 2017-04-28 2018-05-23 リンテック株式会社 フィルム状焼成材料、支持シート付フィルム状焼成材料、フィルム状焼成材料の製造方法、及び支持シート付フィルム状焼成材料の製造方法
KR102631317B1 (ko) * 2017-09-11 2024-02-01 가부시끼가이샤 레조낙 회로 접속용 접착제 필름 및 그의 제조 방법, 회로 접속 구조체의 제조 방법, 그리고 접착제 필름 수용 세트
KR102794873B1 (ko) * 2017-09-11 2025-04-11 가부시끼가이샤 레조낙 회로 접속용 접착제 필름 및 그의 제조 방법, 회로 접속 구조체의 제조 방법, 그리고 접착제 필름 수용 세트
TWI846756B (zh) 2018-11-21 2024-07-01 日商信越化學工業股份有限公司 異向性薄膜、及異向性薄膜的製造方法
JP2020024937A (ja) * 2019-10-28 2020-02-13 日立化成株式会社 フィルム状回路接続材料及び回路部材の接続構造体の製造方法
KR102914642B1 (ko) 2020-06-11 2026-01-19 현대자동차주식회사 리튬이온 이차전지 및 그 제조방법
KR20220019470A (ko) 2020-08-10 2022-02-17 현대자동차주식회사 리튬이온 이차전지 제조 시스템 및 그 제조 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1210614A (zh) * 1996-02-08 1999-03-10 旭化成工业株式会社 各向异性导电组合物

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63102110A (ja) * 1986-10-17 1988-05-07 富士ゼロックス株式会社 異方導電体及びその製法
JPH03107888A (ja) * 1989-09-21 1991-05-08 Sharp Corp 回路基板の接続構造
JPH0645204A (ja) * 1992-07-21 1994-02-18 Nippon Chemicon Corp 固体電解コンデンサ
JPH0645024A (ja) * 1992-07-22 1994-02-18 Hitachi Chem Co Ltd 異方導電性接着フィルム
JPH08148213A (ja) * 1994-11-25 1996-06-07 Hitachi Chem Co Ltd 接続部材、該接続部材を用いた電極の接続構造及び接続方法
GB2296845A (en) * 1995-01-04 1996-07-10 Plessey Semiconductors Ltd Frequency shift keyed radio receivers
JP3656768B2 (ja) * 1995-02-07 2005-06-08 日立化成工業株式会社 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
JP4032439B2 (ja) * 1996-05-23 2008-01-16 日立化成工業株式会社 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
JPH10200243A (ja) * 1997-01-13 1998-07-31 Toshiba Chem Corp 異方性導電ペーストによる電気接続方法
JP2000182691A (ja) * 1998-12-17 2000-06-30 Hitachi Chem Co Ltd 回路の接続部材及びこれを用いた接続方法
EP1189308B1 (en) * 2000-03-23 2007-03-07 Sony Corporation Electrical connection material and electrical connection method
JP2004006417A (ja) 2003-08-22 2004-01-08 Hitachi Chem Co Ltd 接続部材及びこれを用いた電極の接続構造
JP2005146044A (ja) * 2003-11-12 2005-06-09 Sumitomo Electric Ind Ltd 異方導電性接着剤
JP4728665B2 (ja) * 2004-07-15 2011-07-20 積水化学工業株式会社 導電性微粒子、導電性微粒子の製造方法、及び異方性導電材料
JP2006233202A (ja) * 2005-01-31 2006-09-07 Asahi Kasei Electronics Co Ltd 回路接続用異方導電性接着フィルム
WO2007058159A1 (ja) * 2005-11-18 2007-05-24 Hitachi Chemical Company, Ltd. 接着剤組成物、回路接続材料、接続構造及び回路部材の接続方法
JP4967482B2 (ja) * 2006-02-27 2012-07-04 日立化成工業株式会社 導電粒子、接着剤組成物及び回路接続材料
KR101359065B1 (ko) * 2006-04-11 2014-02-05 제이에스알 가부시끼가이샤 이방 도전성 커넥터 및 이방 도전성 커넥터 장치
WO2007125993A1 (ja) * 2006-04-27 2007-11-08 Asahi Kasei Emd Corporation 導電粒子配置シート及び異方導電性フィルム
JP2008112732A (ja) * 2007-11-19 2008-05-15 Hitachi Chem Co Ltd 電極の接続方法
JP4623224B2 (ja) * 2008-06-26 2011-02-02 日立化成工業株式会社 樹脂フィルムシート及び電子部品

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1210614A (zh) * 1996-02-08 1999-03-10 旭化成工业株式会社 各向异性导电组合物

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP昭63－102110A 1988.05.07
JP特开平10－200243A 1998.07.31
JP特开平9－312176A 1997.12.02

Also Published As

Publication number Publication date
KR20110130376A (ko) 2011-12-05
CN101615446A (zh) 2009-12-30
TWI396626B (zh) 2013-05-21
TWI415144B (zh) 2013-11-11
JP2011003544A (ja) 2011-01-06
JP2010267627A (ja) 2010-11-25
JP4766185B2 (ja) 2011-09-07
JP4661986B2 (ja) 2011-03-30
JP4970574B2 (ja) 2012-07-11
KR101120277B1 (ko) 2012-03-07
CN102298988A (zh) 2011-12-28
KR101200148B1 (ko) 2012-11-12
KR20100002196A (ko) 2010-01-06
TW201101343A (en) 2011-01-01
JP2011233529A (ja) 2011-11-17
KR20110084488A (ko) 2011-07-25
CN102298988B (zh) 2016-09-07
KR20110084492A (ko) 2011-07-25
KR20110084489A (ko) 2011-07-25
JP2011233528A (ja) 2011-11-17
KR20110084491A (ko) 2011-07-25
JP2011233530A (ja) 2011-11-17
KR20110084490A (ko) 2011-07-25
JP2010284973A (ja) 2010-12-24
CN102298987A (zh) 2011-12-28
JP2010278013A (ja) 2010-12-09
TW201215504A (en) 2012-04-16
KR101120253B1 (ko) 2012-03-16
JP2011198767A (ja) 2011-10-06
KR101038614B1 (ko) 2011-06-03
CN102298989A (zh) 2011-12-28
KR20100102571A (ko) 2010-09-24
JP2010034037A (ja) 2010-02-12
JP4623224B2 (ja) 2011-02-02
JP4661985B2 (ja) 2011-03-30
TW201013710A (en) 2010-04-01

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