CN101551533A - 电光装置及电子设备 - Google Patents
电光装置及电子设备 Download PDFInfo
- Publication number
- CN101551533A CN101551533A CNA2009101282818A CN200910128281A CN101551533A CN 101551533 A CN101551533 A CN 101551533A CN A2009101282818 A CNA2009101282818 A CN A2009101282818A CN 200910128281 A CN200910128281 A CN 200910128281A CN 101551533 A CN101551533 A CN 101551533A
- Authority
- CN
- China
- Prior art keywords
- wiring
- electro
- circuit board
- connection terminal
- panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- 230000015572 biosynthetic process Effects 0.000 claims description 52
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- 238000006243 chemical reaction Methods 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims 4
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 68
- 238000005755 formation reaction Methods 0.000 description 42
- 239000010408 film Substances 0.000 description 23
- 238000009434 installation Methods 0.000 description 20
- 239000011295 pitch Substances 0.000 description 14
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- 210000005069 ears Anatomy 0.000 description 6
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- 239000003086 colorant Substances 0.000 description 3
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- 239000012467 final product Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- KPHWPUGNDIVLNH-UHFFFAOYSA-M diclofenac sodium Chemical compound [Na+].[O-]C(=O)CC1=CC=CC=C1NC1=C(Cl)C=CC=C1Cl KPHWPUGNDIVLNH-UHFFFAOYSA-M 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 241000270295 Serpentes Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
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- 239000002772 conduction electron Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
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- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
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- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP097377/2008 | 2008-04-03 | ||
| JP2008097377A JP5157602B2 (ja) | 2008-04-03 | 2008-04-03 | 電気光学装置及び電子機器 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101551533A true CN101551533A (zh) | 2009-10-07 |
Family
ID=41132214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2009101282818A Pending CN101551533A (zh) | 2008-04-03 | 2009-03-30 | 电光装置及电子设备 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8319109B2 (enExample) |
| JP (1) | JP5157602B2 (enExample) |
| CN (1) | CN101551533A (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102200680A (zh) * | 2010-03-23 | 2011-09-28 | 精工爱普生株式会社 | 基板连接构造以及投影仪 |
| WO2017193654A1 (zh) * | 2016-05-12 | 2017-11-16 | 京东方科技集团股份有限公司 | 显示面板及显示装置 |
| CN108388053A (zh) * | 2017-02-02 | 2018-08-10 | 精工爱普生株式会社 | 电光装置、电子设备以及安装结构体 |
| WO2019127161A1 (zh) * | 2017-12-27 | 2019-07-04 | 深圳市柔宇科技有限公司 | 触控显示屏及其制作方法以及显示设备 |
| CN111292614A (zh) * | 2020-01-15 | 2020-06-16 | 京东方科技集团股份有限公司 | 显示模组、显示装置 |
| WO2021081957A1 (zh) * | 2019-10-31 | 2021-05-06 | 京东方科技集团股份有限公司 | 显示面板及其制备方法、显示装置 |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5428299B2 (ja) * | 2008-03-18 | 2014-02-26 | セイコーエプソン株式会社 | 電気光学装置及び電子機器 |
| JP5477626B2 (ja) * | 2009-10-30 | 2014-04-23 | 日本精機株式会社 | 有機elモジュール |
| WO2011070709A1 (ja) * | 2009-12-10 | 2011-06-16 | パナソニック株式会社 | 表示パネルモジュールおよび表示装置 |
| US8644025B2 (en) * | 2009-12-22 | 2014-02-04 | Mxtran Inc. | Integrated circuit film for smart card |
| US9148957B2 (en) * | 2011-03-04 | 2015-09-29 | Sharp Kabushiki Kaisha | Electronic circuit substrate, display device, and wiring substrate |
| KR101942918B1 (ko) * | 2012-05-03 | 2019-01-28 | 삼성전자주식회사 | 칩 온 필름 패키지 및 이를 포함하는 장치 어셈블리 |
| US9167687B2 (en) | 2012-05-16 | 2015-10-20 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Flexible printed circuit board, chip on film and manufacturing method |
| CN102686026B (zh) * | 2012-05-16 | 2014-12-10 | 深圳市华星光电技术有限公司 | 一种柔性电路板、覆晶薄膜及制作方法 |
| KR101954985B1 (ko) | 2012-09-17 | 2019-03-08 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
| KR20140038164A (ko) * | 2012-09-20 | 2014-03-28 | 삼성디스플레이 주식회사 | 액정 표시 장치 |
| KR102440487B1 (ko) * | 2015-04-30 | 2022-09-07 | 삼성전자주식회사 | 디스플레이 유닛 및 이를 가지는 디스플레이 장치 |
| KR102656068B1 (ko) * | 2016-10-28 | 2024-04-12 | 삼성디스플레이 주식회사 | 압착 장치 및 이의 압착 방법 |
| CN108398818B (zh) | 2017-02-06 | 2021-04-27 | 精工爱普生株式会社 | 电光装置以及电子设备 |
| KR102465556B1 (ko) * | 2017-12-08 | 2022-11-10 | 엘지디스플레이 주식회사 | 표시장치 구동용 필름 소자와 이를 이용한 표시장치 |
| KR102176089B1 (ko) * | 2018-04-17 | 2020-11-10 | (주)아이티버스 | 신호 입력 장치 및 이를 포함하는 휴대용 단말기 |
| CN208607473U (zh) * | 2018-07-02 | 2019-03-15 | 合肥鑫晟光电科技有限公司 | 阵列基板、显示面板和显示装置 |
| JP6673409B2 (ja) * | 2018-07-27 | 2020-03-25 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
| JP6870666B2 (ja) * | 2018-07-27 | 2021-05-12 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
| US12267062B2 (en) | 2020-06-17 | 2025-04-01 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonators with three-layer electrodes |
| CN115376941B (zh) * | 2022-08-09 | 2025-06-24 | 江苏上达半导体有限公司 | 一种集成摄像功能的显示驱动芯片与基板封装结构及方法 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05173166A (ja) * | 1991-12-26 | 1993-07-13 | Toshiba Corp | 液晶表示装置 |
| JP2801487B2 (ja) * | 1992-04-30 | 1998-09-21 | シャープ株式会社 | パネルの実装構造および実装方法並びに樹脂供給硬化方法 |
| JPH0643471A (ja) | 1992-07-24 | 1994-02-18 | Sanyo Electric Co Ltd | 液晶表示装置 |
| JPH06230728A (ja) * | 1993-02-03 | 1994-08-19 | Fuji Electric Co Ltd | フラットディスプレイ装置の接続構造 |
| JPH07253591A (ja) * | 1995-03-22 | 1995-10-03 | Seiko Epson Corp | 液晶パネル駆動用ic |
| JPH0990392A (ja) * | 1995-09-28 | 1997-04-04 | Nec Corp | 表示装置 |
| JPH10197841A (ja) * | 1997-01-10 | 1998-07-31 | Mitsubishi Electric Corp | 液晶表示装置 |
| JP3147815B2 (ja) * | 1997-04-28 | 2001-03-19 | セイコーエプソン株式会社 | フレキシブル回路基板および液晶表示装置 |
| JP3886307B2 (ja) * | 1999-10-22 | 2007-02-28 | ソニーケミカル&インフォメーションデバイス株式会社 | フレキシブル配線板パッケージ及びその製造方法 |
| TW487896B (en) * | 2000-02-24 | 2002-05-21 | Seiko Epson Corp | Mounting structure for semiconductor device, electro-optical device, and electronic apparatus |
| JP3741005B2 (ja) * | 2000-09-13 | 2006-02-01 | セイコーエプソン株式会社 | 配線基板、その製造方法、表示装置および電子機器 |
| JP3669351B2 (ja) * | 2001-10-04 | 2005-07-06 | セイコーエプソン株式会社 | 電気光学装置及び電子機器 |
| JP2004087940A (ja) | 2002-08-28 | 2004-03-18 | Seiko Epson Corp | 電子部品の実装基板、電気光学装置、電気光学装置の製造方法及び電子機器 |
| JP2004177578A (ja) | 2002-11-26 | 2004-06-24 | Sharp Corp | 電子モジュール |
| JP4483177B2 (ja) * | 2003-02-21 | 2010-06-16 | セイコーエプソン株式会社 | 光変調装置、表示装置、及び電子機器 |
| JP4290070B2 (ja) * | 2003-06-06 | 2009-07-01 | キヤノン株式会社 | 面状ケーブル部材の接続部の補強方法及び画像表示装置の製造方法 |
| JP2005292284A (ja) | 2004-03-31 | 2005-10-20 | Seiko Epson Corp | 実装構造体、電気光学装置、および電子機器 |
| JP2006030727A (ja) | 2004-07-20 | 2006-02-02 | Sony Corp | 液晶表示装置 |
| JP4281656B2 (ja) * | 2004-09-22 | 2009-06-17 | セイコーエプソン株式会社 | 電子部品の実装構造、電子部品の実装方法、電気光学装置および電子機器 |
| JP4534972B2 (ja) * | 2005-03-30 | 2010-09-01 | エプソンイメージングデバイス株式会社 | 電気光学装置、及び電子機器 |
| JP4885516B2 (ja) * | 2005-11-08 | 2012-02-29 | セイコーインスツル株式会社 | 表示装置 |
| KR101199250B1 (ko) * | 2005-12-12 | 2012-11-09 | 삼성디스플레이 주식회사 | 연성회로필름 및 이를 갖는 표시패널 어셈블리 |
| JP4635915B2 (ja) | 2006-03-08 | 2011-02-23 | エプソンイメージングデバイス株式会社 | 電気光学装置及び電子機器 |
| JP4945311B2 (ja) * | 2007-05-18 | 2012-06-06 | 株式会社 日立ディスプレイズ | 液晶表示装置 |
-
2008
- 2008-04-03 JP JP2008097377A patent/JP5157602B2/ja active Active
-
2009
- 2009-02-20 US US12/389,755 patent/US8319109B2/en active Active
- 2009-03-30 CN CNA2009101282818A patent/CN101551533A/zh active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102200680A (zh) * | 2010-03-23 | 2011-09-28 | 精工爱普生株式会社 | 基板连接构造以及投影仪 |
| US8517544B2 (en) | 2010-03-23 | 2013-08-27 | Seiko Epson Corporation | Substrate connection structure and projector |
| CN102200680B (zh) * | 2010-03-23 | 2013-12-11 | 精工爱普生株式会社 | 基板连接构造以及投影仪 |
| WO2017193654A1 (zh) * | 2016-05-12 | 2017-11-16 | 京东方科技集团股份有限公司 | 显示面板及显示装置 |
| US10288930B2 (en) | 2016-05-12 | 2019-05-14 | Boe Technology Group Co., Ltd. | Display panel and display device |
| CN108388053A (zh) * | 2017-02-02 | 2018-08-10 | 精工爱普生株式会社 | 电光装置、电子设备以及安装结构体 |
| WO2019127161A1 (zh) * | 2017-12-27 | 2019-07-04 | 深圳市柔宇科技有限公司 | 触控显示屏及其制作方法以及显示设备 |
| CN111448539A (zh) * | 2017-12-27 | 2020-07-24 | 深圳市柔宇科技有限公司 | 触控显示屏及其制作方法以及显示设备 |
| WO2021081957A1 (zh) * | 2019-10-31 | 2021-05-06 | 京东方科技集团股份有限公司 | 显示面板及其制备方法、显示装置 |
| CN113133321A (zh) * | 2019-10-31 | 2021-07-16 | 京东方科技集团股份有限公司 | 显示面板及其制备方法、显示装置 |
| CN111292614A (zh) * | 2020-01-15 | 2020-06-16 | 京东方科技集团股份有限公司 | 显示模组、显示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090250250A1 (en) | 2009-10-08 |
| JP5157602B2 (ja) | 2013-03-06 |
| JP2009251182A (ja) | 2009-10-29 |
| US8319109B2 (en) | 2012-11-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20091007 |
|
| C20 | Patent right or utility model deemed to be abandoned or is abandoned |