WO2011070709A1 - 表示パネルモジュールおよび表示装置 - Google Patents
表示パネルモジュールおよび表示装置 Download PDFInfo
- Publication number
- WO2011070709A1 WO2011070709A1 PCT/JP2010/006389 JP2010006389W WO2011070709A1 WO 2011070709 A1 WO2011070709 A1 WO 2011070709A1 JP 2010006389 W JP2010006389 W JP 2010006389W WO 2011070709 A1 WO2011070709 A1 WO 2011070709A1
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- WIPO (PCT)
- Prior art keywords
- display panel
- flexible printed
- panel module
- printed circuit
- circuit board
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
Definitions
- the present invention relates to a display panel module, and in particular, for the purpose of reducing the number of circuit elements (hereinafter referred to as drive circuit elements) on which a drive circuit for a display panel such as a liquid crystal panel is mounted and reducing the cost of the display panel module.
- the present invention relates to a display panel module.
- FIG. 1 a plan view showing a schematic configuration of a general display panel module used for a liquid crystal panel or the like is shown in FIG.
- a circuit element hereinafter referred to as controller circuit element 1 on which a controller circuit for controlling the drive circuit element 6 is mounted is mounted on a wiring board (hereinafter referred to as controller board) 2.
- controller board a wiring board
- a signal output from the controller circuit element 1 is input to the film package 5 via a wiring board (hereinafter referred to as a source board) 4 different from the cable 3 and the controller board 2.
- a plurality of film packages 5 are connected to the source substrate 4. Further, the signal output from the controller circuit element 1 is input to the drive circuit element 6 through the wiring in the film package 5.
- the drive signal output from the drive circuit element 6 is input to the display panel 9 via the wiring in the film package 5, passes through the wiring area 7 in the display panel 9, and is displayed in a matrix in the display area 8. This is input to a control line for driving the arranged pixels. An image is displayed on the display panel 9 by driving the pixel with the drive signal.
- two cables 3 and two source boards 4 are used is shown, but there may be one or three or more, respectively.
- reducing the number of drive circuit elements 6 means that the number of outputs per drive circuit element 6 is increased. . That is, the circuit scale per one drive circuit element 6 increases and the power consumption increases. As a result, the self-heating temperature of the drive circuit element 6 rises, exceeds the guaranteed temperature as the drive circuit element 6, or deteriorates the characteristics as the drive circuit element 6, thereby reducing the display image quality.
- the present invention has been made in view of the above problems, and enables reduction in the number of drive circuit elements without reducing the number of panels that can be taken on the same glass substrate.
- An object of the present invention is to provide a display panel module and a display device that can be enhanced.
- a display panel module includes a first flexible printed circuit board on which circuit elements that output pixel data are mounted, a display panel, and a plurality of first terminals connected to the first flexible printed circuit board.
- a plurality of second terminals disposed corresponding to the first terminals at a wider pitch than the first terminals, and connected to the display panel and the corresponding first terminals, and the first flexible print.
- a second flexible printed board that relays the pixel data between the board and the display panel is provided.
- the display panel module connects the electrode of the film package on which the circuit element is mounted and the electrode of the display panel via one or more flexible printed boards,
- the connection area between the flexible printed circuit board and the display panel is wider than the connection area between the film package and the flexible printed circuit board.
- the first flexible printed board on which the circuit element is mounted is preferably a film package with respect to the display panel module.
- the second flexible printed circuit board is made of the same material as the first flexible printed circuit board, specifically, the same film package as the film package as the first flexible printed circuit board (however, a film package in which no chip is mounted). It is preferable.
- This configuration has the effect of reducing the area of the wiring region on the display panel and increasing the number of display panels that can be taken.
- the display panel module according to an aspect of the present invention is characterized in that a plurality of circuit elements are mounted on one of the first flexible printed boards with respect to the display panel module.
- This configuration has the effect of reducing the package cost.
- a display circuit module includes a driver circuit element on which the plurality of circuit elements are mounted with a driving circuit for the display panel, and a controller circuit that controls the driving circuit. And a circuit element on which a power supply circuit for generating a power supply voltage to be supplied to the driving circuit is mounted.
- This configuration has the effect that the operation characteristics of the drive circuit can be stabilized, and members such as a wiring board for configuring the display panel module can be reduced.
- the display panel module which concerns on 1 aspect of this invention is arrange
- One side is provided with a notch.
- Such a configuration has the effect that the reliability of the connection between the second flexible printed circuit board and the display panel can be increased.
- the display panel module according to an aspect of the present invention is characterized in that the cut is in a direction of 90 degrees with respect to one side of the second flexible printed board with respect to the display panel module.
- This configuration has the effect of improving the efficiency of wiring between the second flexible printed circuit board and the display panel.
- the display panel module according to an aspect of the present invention is characterized in that, with respect to the display panel module, one side of the second flexible printed board is divided into sides having equal lengths by the cut.
- This configuration has the effect of facilitating the connection process between the second flexible printed circuit board and the display panel and reducing the number of steps.
- the shape of the second flexible printed circuit board with respect to the display panel module is such that the side where the first terminals are arranged side by side is an upper bottom, and the second terminals It is a trapezoid which makes the edge
- Such a configuration has the effect of minimizing the size of the second flexible printed circuit board and reducing the cost of the second flexible printed circuit board.
- the display panel module which concerns on 1 aspect of this invention is equipped with the said 2nd flexible printed circuit board with respect to the said display panel module,
- the 2nd terminal of the said 2nd 2nd flexible printed circuit board is common in the said display panel. It is connected to one side.
- the shape of the two second flexible printed circuit boards with respect to the display panel module is such that the side where the first terminals are arranged side by side is an upper bottom, A trapezoid whose bottom is the side where two terminals are arranged side by side, and one of the two sides connecting the top and bottom bottoms forms an angle of 90 degrees with the top and bottom bottoms;
- This configuration has the effect of further increasing the number of second flexible printed circuit boards that can be taken and reducing costs.
- the display panel module according to an aspect of the present invention is characterized in that the plurality of first terminals are staggered with respect to the display panel module.
- the display panel module which concerns on 1 aspect of this invention is the said 2nd flexible printed circuit board with respect to the said display panel module,
- the wirings connected to the predetermined columns and different columns are respectively directed in opposite directions.
- the wiring pitch of the film package can be reduced to half of the wiring pitch of the second flexible printed circuit board, and the size of the film package can be reduced, so that the package cost can be reduced.
- the display panel module according to an aspect of the present invention is characterized in that the plurality of first terminals are connected to two different sides of the first flexible printed board with respect to the display panel module.
- the display panel module according to an aspect of the present invention is characterized in that, with respect to the display panel module, the plurality of first terminals are connected to three different sides of the first flexible printed board.
- Such a configuration can cope with an increase in the number of first terminals for connecting the film package and the second flexible printed circuit board without increasing the width of the film package, so that the package cost can be reduced.
- the resistance value from the first terminal to the second terminal of the plurality of wirings in the second flexible printed circuit board is different from the display panel module in the plurality of wirings. It is characterized by being in a uniform or nearly uniform state.
- the display panel module which concerns on 1 aspect of this invention differs in the length of wiring in the said 2nd flexible printed circuit board with respect to the said display panel module, and the length of wiring differs in the said 2nd flexible printed circuit board.
- the length of the long wiring is larger than the width of the short wiring.
- a display device includes the display panel module and a highly heat-dissipating substance that is in contact with the circuit element.
- the heat dissipation characteristics of the drive circuit elements can be improved, the circuit scale per drive circuit element can be increased, that is, the number of outputs can be increased, and the number of drive circuit elements can be reduced. Has the effect of being able to.
- the display device is characterized in that the substance having high heat dissipation is a chassis portion with respect to the display device.
- the heat dissipation characteristic of the drive circuit element can be improved without adding a new heat dissipation member, and the circuit scale per drive circuit element can be increased, that is, the number of outputs can be increased. And the effect that the number of drive circuit elements can be reduced.
- the display device is characterized in that, with respect to the display device, the chassis portion has a protrusion at a contact portion with the circuit element.
- the contact between the chassis portion and the drive circuit element can be improved, the heat dissipation characteristics of the drive circuit element can be further improved, and the circuit scale per drive circuit element, that is, the number of outputs is increased. This has the effect that the number of drive circuit elements can be reduced.
- the display panel module and the display device without increasing the wiring area on the display panel, that is, without reducing the number of panels that can be taken on the same glass substrate, By making it possible to reduce the number of drive circuit elements in the display panel module, an effect of reducing the cost of the display panel module is obtained.
- the display panel drive circuit element mounted on the film package can be brought into contact with a highly heat-dissipating substance such as a chassis portion of the display panel module.
- a highly heat-dissipating substance such as a chassis portion of the display panel module.
- FIG. 1 is a plan view showing a schematic configuration of a display panel module according to Embodiment 1 of the present invention.
- FIG. 2A is a cross-sectional view showing a schematic configuration of the display device in the embodiment.
- FIG. 2B is a cross-sectional view showing a schematic configuration of a conventional display device having a general configuration.
- FIG. 2C is a cross-sectional view illustrating a schematic configuration of the display panel module according to the embodiment in which a protrusion is provided on the chassis.
- FIG. 3 is a plan view showing the arrangement of terminals of the flexible printed circuit board in the same embodiment.
- FIG. 4 is a plan view showing a schematic configuration of a display panel module in a modification of the embodiment in which the shape of one flexible printed board is a trapezoid.
- FIG. 5 is a plan view showing a schematic configuration of a display panel module in a modification of the embodiment in which a plurality of circuit elements are mounted on one film package.
- FIG. 6 is a plan view showing a schematic configuration of a display panel module in a modification of the embodiment using one flexible printed board having a connection region with a film package extending over three sides.
- FIG. 7 is a plan view showing wiring in the flexible printed circuit board in a modification of the embodiment.
- FIG. 8 is a plan view showing a schematic configuration of a display panel module in Embodiment 2 of the present invention using two divided flexible printed boards.
- FIG. 9A is a plan view showing a schematic configuration of a display panel module in a modification of the embodiment in which the shapes of two divided flexible printed boards are trapezoidal.
- FIG. 9B is a diagram for explaining the arrangement of the divided flexible printed circuit board on the base material in a modification of the embodiment.
- FIG. 10 is a plan view showing a schematic configuration of a display panel module in a modification of the embodiment using two divided flexible printed boards each having a connection region with a film package extending over two sides.
- FIG. 11 is a plan view showing a schematic configuration of a display panel module according to Embodiment 3 of the present invention in which a slit is provided in a flexible printed board.
- FIG. 12 is a plan view showing a schematic configuration of a display panel module in a modification of the embodiment in which a slit is provided in a flexible printed board.
- FIG. 13 is a plan view showing a schematic configuration of a display panel module in a modification of the embodiment in which a slit is provided in each of two divided flexible printed boards.
- FIG. 14A is a plan view (enlarged view showing only a film package and a flexible printed board) showing a schematic configuration of a display panel module in Embodiment 4 of the present invention.
- FIG. 14B is a plan view (enlarged view of the connecting portion) showing a schematic configuration of the display panel module in the embodiment in which electrodes for connecting to the film package are arranged in a staggered manner on the flexible printed board.
- FIG. 14C is a plan view (enlarged view of a connecting portion) showing a schematic configuration of a display panel module in a comparative example of the embodiment in which electrodes for connecting to a film package are arranged in a row on a flexible printed circuit board.
- FIG. 15A is a plan view showing a schematic configuration of a display panel module in the same embodiment in which electrodes at a connection portion between a film package and a flexible printed board are arranged in a staggered manner (a diagram showing an example of a wiring pattern on a flexible printed board) ).
- FIG. 15A is a plan view showing a schematic configuration of a display panel module in the same embodiment in which electrodes at a connection portion between a film package and a flexible printed board are arranged in a staggered manner (a diagram showing an example of a wiring pattern on a flexible printed board) ).
- FIG. 15B is a plan view showing a schematic configuration of the display panel module in the embodiment in which the electrodes at the connection portion between the film package and the flexible printed board are arranged in a staggered manner (of the connection portion between the flexible printed circuit board and the film package). (Enlarged view).
- FIG. 16 is a plan view showing a schematic configuration of a display panel module in a modification of the embodiment of the present invention.
- FIG. 17 is a plan view showing a schematic configuration of a display panel module in an example of a conventional general configuration.
- FIG. 18 is a plan view showing a schematic configuration of a display panel module in an example of a conventional configuration different from FIG.
- FIG. 1 is a plan view showing a configuration of a display panel module in the present embodiment.
- This display panel module includes a film package 5, a display panel 9, and a flexible printed board 10.
- the electrode (terminal) of the film package 5 and the electrode (terminal) of the display panel 9 are connected to a flexible printed circuit board. 10 is connected.
- the width X102 of the connecting portion 102 between the flexible printed circuit board 10 and the display panel 9 is made longer than the width X101 of the connecting portion 101 between the film package 5 and the flexible printed circuit board 10, whereby the film package 5 is attached to the display panel 9.
- the vertical length Y of the wiring region 7 on the display panel 9 can be reduced as compared with the case of direct bonding, and the cost of the display panel module can be reduced.
- the drive circuit element 6 is a semiconductor integrated circuit element for a display circuit on which the drive circuit for the display panel 9 is mounted.
- the film package 5 includes a drive circuit element 6, an electrode, a wiring connecting the electrode and the drive circuit element 6, and a flexible wiring board on which the drive circuit element 6 is mounted.
- the drive circuit element 6 was illustrated as a circuit element which outputs pixel data, such as a scanning signal and a pixel signal, it is not restricted to this.
- FIG. 2A is a cross-sectional view of the display device in the present embodiment.
- the display device includes the display panel module of FIG. 1 and a chassis portion 11 as a highly heat-dissipating material that comes into contact with the drive circuit element 6 of the film package 5.
- the drive circuit element 6 comes out to the chassis part 11 side in the display panel module with respect to the film package 5.
- the chassis part 11 is comprised with the material with high heat conductivity, such as a metal.
- the self-heating in the drive circuit element 6 can be efficiently radiated to the chassis part 11 compared to the conventional configuration in which the film package 5 is inserted between the drive circuit element 6 and the chassis part 11. Made possible.
- This configuration can be realized by using a flexible printed circuit board 10 between the film package 5 and the display panel 9.
- the drive circuit element 6 is added without adding a new heat dissipation member. Temperature rise due to self-heating of the display panel can be suppressed, and the cost of the display panel module can be reduced. Further, as shown in FIG. 2C, the protrusions 12 are provided at locations where the chassis portion 11 contacts the drive circuit element 6 (contact portions with the drive circuit element 6), so that the contact between the chassis portion 11 and the drive circuit element 6 is achieved. When the property is improved, a higher heat dissipation effect can be obtained.
- FIG. 3 is a plan view showing the arrangement of electrodes (terminals) of the flexible printed circuit board 10 in the present embodiment.
- the flexible printed circuit board 10 includes a plurality of electrodes (first terminals) 301 that are connected to the film package 5 and a plurality of electrodes (second terminals) 302 that are arranged at a wider pitch than the electrodes 301 and are connected to the display panel 9. And a wiring for connecting the electrodes 301 and 302 and a flexible wiring board on which the wiring is formed.
- the pitch refers to a distance between the center of the width in the arrangement direction of the predetermined electrodes and the center of the width in the arrangement direction of the electrodes positioned next to the predetermined electrodes.
- the flexible printed circuit board 10 has a rectangular shape, and relays pixel data from the film package 5 between the film package 5 and the display panel 9.
- the plurality of electrodes 301 are arranged side by side on a predetermined side of the flexible printed circuit board 10, and the predetermined side constitutes the connection unit 101.
- the plurality of electrodes 302 are arranged side by side on the other side facing the predetermined side of the flexible printed circuit board 10, and the other side constitutes the connection unit 102.
- the flexible printed circuit board 10 has a trapezoidal shape, thereby minimizing the area of the flexible printed circuit board 10 and reducing the cost of the display panel module. can do.
- a plurality of electrodes 301 connected to the film package 5 are arranged side by side on the upper bottom of the trapezoidal flexible printed board 10, and a plurality of electrodes 302 connected to the display panel 9 are arranged on the bottom bottom of the flexible printed board 10. Arranged. Note that the lower base of the trapezoidal shape is a side longer than the upper base.
- the display panel module of the present modification includes a circuit element (controller circuit element) 1 and a drive circuit in which a controller circuit for controlling the drive circuit of the display panel 9 is mounted (mounted) on one film package 5. It has a configuration in which the element 6 is mounted, that is, a configuration in which a plurality of circuit elements are mounted in one film package 5. With the configuration of the present embodiment, it is possible to reduce the number of drive circuit elements 6 to one in the display panel module. As a result, in the configuration of the conventional display panel module as shown in FIG. 17, the cable 3, the source substrate 4, and the controller that are used to connect the controller circuit element 1 and the plurality of drive circuit elements 6. By reducing the substrate 2, the cost as a display panel module can be reduced.
- the controller circuit element 1 in FIG. 5 may be configured to be a power circuit element on which a power circuit for generating power to be supplied to the drive circuit element 6 is mounted, or both. .
- the controller circuit element 1 and the drive circuit element 6 are mounted on one film package 5.
- the drive circuit element 6 and at least one of the controller circuit element 1 and the power supply circuit element are mounted, the circuit elements mounted on one film package 5 are limited to the controller circuit element 1 and the drive circuit element 6. Absent.
- the region of the connection portion 101 for connecting to the flexible printed board 10 extends over three sides. Thereby, it is possible to cope with an increase in the number of electrodes 301 for connecting the film package 5 and the flexible printed circuit board 10 with an increase in the number of outputs of the drive circuit element 6 without increasing the width of the film package 5.
- Package cost can be reduced.
- the plurality of electrodes 301 connected to the film package 5 of the flexible printed circuit board 10 are connected to two different sides of the film package 5, specifically, three different sides of the film package 5.
- the three sides include a side facing a predetermined side of the flexible printed board 10 of the film package 5 and two sides sandwiching the side.
- the wiring pattern on the flexible printed circuit board 10 is routed with different wiring lengths.
- the distance from the connection part 101 to the film package 5 to the connection part 102 to the display panel 9 is as short as the wiring 201 at the center of the flexible printed circuit board 10.
- the wiring 201 becomes longer.
- the plurality of wirings 201 in the flexible printed board 10 are wirings that mainly transmit drive signals for driving the pixels of the display panel 9 from the film package 5 to the display panel 9.
- the resistance variation of the plurality of wirings 201 on the flexible printed circuit board 10 is large, the influence on the drive signal such as a voltage drop varies, and the display panel 9 causes display unevenness such as display unevenness.
- this problem can be suppressed by increasing the width of the wiring 201 as the length of the wiring 201 increases to reduce the variation in resistance value of each wiring.
- the resistance value be uniform, it is needless to say that the display characteristics can be improved by bringing the resistance values close to uniform even if they are not completely uniform.
- the resistance value from the electrode 301 to the electrode 302 of the plurality of wirings 201 in the flexible printed circuit board 10 is uniform or nearly uniform in the plurality of wirings 201.
- the plurality of wirings 201 in the flexible printed circuit board 10 have different lengths of the wirings 201.
- the width of the wiring 201 having the long wiring 201 is larger than the width of the wiring 201 having the short wiring 201. thick.
- FIG. 8 is a plan view showing the configuration of the display panel module in the present embodiment.
- the electrodes 302 and the display of the flexible printed circuit board 10 are displayed by thermocompression using an anisotropic conductive film (hereinafter referred to as ACF), which is generally used as a method for joining electronic components.
- ACF anisotropic conductive film
- the flexible printed circuit board 10 according to the first embodiment is divided into two parts to form two divided flexible printed circuit boards 10a and 10b as shown in FIG.
- two divided flexible printed boards 10a and 10b are provided for one common side of the display panel 9, and the electrodes 302 of the two divided flexible printed boards 10a and 10b are connected to one common side of the display panel 9. .
- the connection portion 102 between the flexible printed circuit board and the display panel 9 into two connection portions 102a and 102b, the difficulty of adjusting the correction value is reduced, and consequently the display panel 9 and the divided flexible printed circuit board 10a. 10b, the reliability of connection with 10b can be increased.
- the drive circuit element 6 mounted on the film package 5 is brought into contact with the chassis portion 11 of the display panel module in the same manner as in the first embodiment, so that heat dissipation is achieved.
- the shapes of the divided flexible printed boards 10a and 10b are each trapezoidal.
- the cost for the divided flexible printed circuit boards 10a and 10b can be reduced.
- the shape of each of the divided flexible printed boards 10a and 10b is a trapezoid whose upper surface is the bonding surface with the film package 5 and whose lower surface is the bonding surface with the display panel 9. Increasing the number of pieces from the base material of the divided flexible printed boards 10a and 10b as shown in FIG. Can do.
- a plurality of electrodes 301 connected to the film package 5 are arranged side by side on the upper bases of the trapezoidal divided flexible printed boards 10a and 10b, and a plurality of electrodes 302 connected to the display panel 9 are divided flexible printed boards 10a, 10b are arranged side by side on the bottom.
- One of the two sides connecting the upper and lower bases of the divided flexible printed circuit boards 10a and 10b forms an angle of 90 degrees with the upper and lower bases.
- the regions of the connection portions 101 a and 101 b for connecting to the divided flexible printed circuit boards 10 a and 10 b in the film package 5 extend over three sides of the film package 5. Yes. Thereby, without increasing the width of the film package 5, it is possible to cope with an increase in the number of electrodes 301 that connect the film package 5 and the divided flexible printed boards 10 a and 10 b, that is, an increase in the number of outputs of the drive circuit elements 6.
- FIG. 11 is a plan view showing the configuration of the display panel module in the present embodiment.
- a slit 103 as a cut is formed on one side of the flexible printed circuit board 10 on which a plurality of electrodes 302 are arranged, and the connection portion 102 with the display panel 9 is divided by the slit 103 in the flexible printed circuit board 10. It has a configuration. By dividing the connection portion 102 between the flexible printed circuit board 10 and the display panel 9 into four parts having widths X102a, X102b, X102c, and X102d, the flexible printed circuit board 10 and the display panel 9 are divided as in the second embodiment. Can be reduced the difficulty of fitting correction values, which should be considered when thermocompression bonding is performed using an ACF, and the connection reliability between the flexible printed circuit board 10 and the display panel 9 can be improved. it can.
- the flexible printed circuit board 10 has a trapezoidal shape or is mounted on the film package 5 as in the first or second embodiment.
- the drive circuit element 6 is brought into contact with the chassis portion 11 of the display panel module so that heat dissipation is improved, a plurality of circuit elements are mounted on one film package 5, and the flexible in the film package 5
- the connection part 101 for connecting to the printed circuit board 10 can be formed in a form extending over three sides of the film package 5 or a form in which variations in resistance values of a plurality of wirings in the flexible printed circuit board 10 are reduced.
- the wiring efficiency between the flexible printed circuit board 10 and the display panel 9 can be improved.
- the side connected to the display panel 9 of the flexible printed circuit board 10 is divided into two equal sides by the slit 103, so that the connection part 102 is divided into two parts having uniform widths X102 a and X102 b. Divided.
- the flexible printed circuit board 10 and the display panel 9 can be obtained by eliminating the need to individually consider the correction value for each location of the connection portion 102 and by eliminating the need to divide the equipment used for connection for each location. The connection process can be facilitated.
- the display panel module of this modification has a configuration in which slits 103a and 103b are provided in the divided flexible printed circuit boards 10a and 10b of the second embodiment described above.
- FIG. 14A and 14B are plan views showing the configuration of the display panel module in the present embodiment.
- FIG. 14A is an enlarged view of the film package 5 and the flexible printed board 10 on which the drive circuit element 6 is mounted.
- FIG. 14B is an enlarged view of the connection portion 101 in a form in which the electrodes 301 connected to the film package 5 in the flexible printed board 10 are arranged in a staggered manner.
- FIG. 14C is a plan view showing a configuration of a display panel module in a comparative example of the present embodiment. Specifically, FIG. 14C is an enlarged view of the connection portion 101 in a form in which the electrodes 301 connected to the film package 5 in the flexible printed board 10 are arranged in a line.
- a plurality of electrodes 301 of the flexible printed circuit board 10 that connects the film package 5 and the flexible printed circuit board 10 are arranged in a staggered manner, and configured by two different columns of electrodes 301 a and 301 b, thereby forming a single line.
- the electrode spacing W remains the same and the area of the connecting portion 101 is not enlarged, that is, the number of electrodes is arranged without increasing the size of the film package 5. Cost can be reduced.
- FIG. 15A and 15B are plan views showing the configuration of the display panel module in the present embodiment.
- FIG. 15A is an enlarged view showing the routing of the wiring 201 in the flexible printed circuit board 10 when the electrodes 301 in the connection portion 101 of the film package 5 and the flexible printed circuit board 10 are arranged in a staggered manner as shown in FIG. 14B.
- FIG. 15B is an enlarged view of the connection portion 101 with the film package 5 in the flexible printed circuit board 10.
- the minimum wiring pitch in TCP (Tape Career Package) or COF (Chip On Film) used as the film package 5 is currently in mass production level, and is about 25 ⁇ m to 30 ⁇ m.
- the minimum wiring pitch in the flexible printed circuit board 10 is approximately 50 ⁇ m to 60 ⁇ m.
- the wiring 201 on the flexible printed circuit board 10 is routed upward from the electrode 301a in the upper row and downward from the electrode 301b in the lower row.
- the pitch of the wiring 201 on the substrate 10 can be double that of the film package 5, that is, it is not necessary to make the wiring pitch on the film package 5 rough according to the wiring pitch on the flexible printed circuit board 10. In the film package 5, it is possible to reduce the package cost by eliminating the need to widen the width of the film package 5 in order to secure the area of the connection portion 101 connected to the flexible printed circuit board 10.
- wirings connected to a predetermined row (a row of electrodes 301a) of a plurality of electrodes 301 arranged in a staggered manner and a row different from the predetermined row (a row of electrodes 301b) ) Are connected in opposite directions.
- the film package 5 and the display panel 9 are connected via the two divided flexible printed boards 10a and 10b as in the second embodiment.
- the side connected to the display panel 9 may be divided by a slit.
- the flexible printed circuit board 10 or the divided flexible printed circuit boards 10a and 10b have a trapezoidal shape, or a drive circuit element mounted on the film package 5. 6 is brought into contact with the chassis portion 11 of the display panel module so that heat dissipation is improved, a plurality of circuit elements are mounted on one film package 5, and a flexible printed circuit board in the film package 5.
- connection part 101 for connecting to the terminal 10 or the area of the connecting parts 101a, 101b for connecting to the divided flexible printed circuit boards 10a, 10b is formed over the three sides of the film package 5, the flexible printed circuit board 10, or the divided part.
- Flexible printed circuit board 1 a it may be a variation with reduced form of resistance values of a plurality of wires in 10b.
- the display panel module and the display device of the present invention have been described based on the embodiments.
- the present invention is not limited to these embodiments.
- the present invention includes various modifications made by those skilled in the art without departing from the scope of the present invention.
- region of the connection part 101 for connecting with the flexible printed circuit board 10 of the film package 5 was provided over one side or three sides. That is, the plurality of electrodes 301 of the flexible printed board 10 are connected to different one side or three sides of the film package 5.
- the region of the connection portion 101 for connecting to the flexible printed board 10 of the film package 5 may be provided over two sides. That is, the plurality of electrodes 301 connected to the film package 5 of the flexible printed board 10 may be connected to two different sides of the film package 5.
- the two sides include two sides sandwiching a side facing a predetermined side of the flexible printed circuit board 10 of the film package 5.
- the film package 5 is exemplified as the flexible printed board on which the circuit element for outputting pixel data is mounted.
- the present invention is not limited to this.
- the chassis portion 11 as a highly heat-dissipating material that comes into contact with the drive circuit element 6 of the film package 5 is exemplified, but a heat-dissipating sheet provided in the display device may be used.
- the present invention reduces the number of drive circuit elements in the display panel module in order to reduce the cost of the display panel module, and the problem of increasing the wiring area on the display panel, which is a problem in the conventional technology,
- the problem of heat generation in the drive circuit element of the display panel module can be solved at the same time, which is useful for flat panel display devices such as liquid crystal panels.
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Abstract
Description
図1は、本実施の形態における、表示パネルモジュールの構成を示す平面図である。
次に、本実施の形態に係る表示パネルモジュールの変形例について、図4を用いて説明する。
次に、本実施の形態に係る表示パネルモジュールの他の変形例について、図5を用いて説明する。
次に、本実施の形態に係る表示パネルモジュールの他の変形例について、図6を用いて説明する。
次に、本実施の形態に係る表示パネルモジュールの他の変形例について、図7を用いて説明する。
図8は、本実施の形態における、表示パネルモジュールの構成を示す平面図である。
次に、本実施の形態に係る表示パネルモジュールの変形例について、図9A及び図9Bを用いて説明する。
次に、本実施の形態に係る表示パネルモジュールの他の変形例について、図10を用いて説明する。
図11は、本実施の形態における、表示パネルモジュールの構成を示す平面図である。
次に、本実施の形態に係る表示パネルモジュールの変形例について、図12を用いて説明する。
次に、本実施の形態に係る表示パネルモジュールの他の変形例について、図13を用いて説明する。
図14A及び図14Bは、本実施の形態における、表示パネルモジュールの構成を示す平面図である。具体的に、図14Aは駆動回路素子6を実装したフィルムパッケージ5とフレキシブルプリント基板10とを抜き出した拡大図である。図14Bは、フレキシブルプリント基板10におけるフィルムパッケージ5と接続する電極301を千鳥配置とした形態の、接続部101の拡大図である。
2、4 配線基板
3 ケーブル
5 フィルムパッケージ
6 駆動回路素子
7 配線領域
8 表示領域
9 表示パネル
10 フレキシブルプリント基板
10a、10b 分割フレキシブルプリント基板
11 シャーシ部
12 突起部
101、101a、101b、102、102a、102b 接続部
103、103a、103b スリット
201 配線
301、301a、301b、302 電極
Claims (19)
- 画素データを出力する回路素子が実装された第1フレキシブルプリント基板と、
表示パネルと、
前記第1フレキシブルプリント基板と接続された複数の第1端子と、前記第1端子より広いピッチで前記第1端子に対応して配設され、前記表示パネル及び対応する前記第1端子と接続された複数の第2端子とを有し、前記第1フレキシブルプリント基板と前記表示パネルとの間で前記画素データの中継を行う第2フレキシブルプリント基板とを備える
表示パネルモジュール。 - 1つの前記第1フレキシブルプリント基板には複数の回路素子が実装される
請求項1に記載の表示パネルモジュール。 - 前記複数の回路素子は、
前記表示パネルの駆動回路を搭載した駆動回路素子と、
前記駆動回路を制御するコントローラ回路を搭載した回路素子、および前記駆動回路に供給される電源電圧を生成する電源回路を搭載した回路素子のいずれかとを含む
請求項2に記載の表示パネルモジュール。 - 前記第2端子は、前記第2フレキシブルプリント基板の一辺に並んで配設されており、
前記第2フレキシブルプリント基板の一辺には、切れ込みが設けられている
請求項1から3のいずれか1項に記載の表示パネルモジュール。 - 前記切れ込みが、前記第2フレキシブルプリント基板の一辺に対し、90度の方向である
請求項4に記載の表示パネルモジュール。 - 前記第2フレキシブルプリント基板の一辺は、前記切れ込みにより長さが均等な辺に分割されている
請求項4または5に記載の表示パネルモジュール。 - 前記第2フレキシブルプリント基板の形状が、前記第1端子が並んで配設された辺を上底、前記第2端子が並んで配設された辺を下底とする台形である
請求項1から3のいずれか1項に記載の表示パネルモジュール。 - 前記表示パネルモジュールは、2つの前記第2フレキシブルプリント基板を備え、
前記2つの第2フレキシブルプリント基板の第2端子は、前記表示パネルの共通の一辺と接続される
請求項1から3のいずれか1項に記載の表示パネルモジュール。 - 前記2つの第2フレキシブルプリント基板の形状は、前記第1端子が並んで配設された辺を上底、前記第2端子が並んで配設された辺を下底とする台形であり、
前記上底及び前記下底をつなぐ2つの辺の一方は、前記上底および前記下底と90度の角を成す
請求項8に記載の表示パネルモジュール。 - 前記複数の第1端子が、千鳥配置されている
請求項1から9のいずれか1項に記載の表示パネルモジュール。 - 前記第2フレキシブルプリント基板において、前記千鳥配置された複数の第1端子の所定の列に接続される配線と、前記所定の列と異なる列に接続される配線とが、それぞれ相反する方向へ向かう
請求項10に記載の表示パネルモジュール。 - 前記複数の第1端子は、前記第1フレキシブルプリント基板の異なる2辺と接続される
請求項1から11のいずれか1項に記載の表示パネルモジュール。 - 前記複数の第1端子は、前記第1フレキシブルプリント基板の異なる3辺と接続される
請求項12に記載の表示パネルモジュール。 - 前記第2フレキシブルプリント基板における複数の配線の前記第1端子から前記第2端子までの抵抗値は、前記複数の配線で均一あるいは均一に近い状態である
請求項1から13のいずれか1項に記載の表示パネルモジュール。 - 前記第2フレキシブルプリント基板における複数の配線は、配線の長さが異なり、
前記第2フレキシブルプリント基板において、配線の長さが長い配線の幅は、配線の長さの短い配線の幅より太い
請求項14に記載の表示パネルモジュール。 - 前記回路素子が実装された第1フレキシブルプリント基板は、フィルムパッケージである
請求項1から15のいずれか1項に記載の表示パネルモジュール。 - 請求項1から15のいずれか1項に記載の表示パネルモジュールと、
前記回路素子と接触する放熱性の高い物質とを備える
表示装置。 - 前記放熱性の高い物質は、シャーシ部である
請求項17に記載の表示装置。 - 前記シャーシ部は、前記回路素子との接触部に突起部を有する
請求項18に記載の表示装置。
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JP2011516907A JPWO2011070709A1 (ja) | 2009-12-10 | 2010-10-29 | 表示パネルモジュールおよび表示装置 |
CN2010800035335A CN102246218A (zh) | 2009-12-10 | 2010-10-29 | 显示屏模块以及显示装置 |
US13/155,815 US20110235286A1 (en) | 2009-12-10 | 2011-06-08 | Display panel module and display apparatus |
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US13/155,815 Continuation US20110235286A1 (en) | 2009-12-10 | 2011-06-08 | Display panel module and display apparatus |
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US20110235286A1 (en) | 2011-09-29 |
CN102246218A (zh) | 2011-11-16 |
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