CN101547885B - 金刚烷衍生物、其制造方法以及含金刚烷衍生物的树脂组合物 - Google Patents

金刚烷衍生物、其制造方法以及含金刚烷衍生物的树脂组合物 Download PDF

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CN101547885B
CN101547885B CN200780043783XA CN200780043783A CN101547885B CN 101547885 B CN101547885 B CN 101547885B CN 200780043783X A CN200780043783X A CN 200780043783XA CN 200780043783 A CN200780043783 A CN 200780043783A CN 101547885 B CN101547885 B CN 101547885B
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adamantyl
bis
etheroxybenzene
integer
adamantane derivative
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CN101547885A (zh
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伊藤克树
冈田保也
山根秀树
小岛明雄
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Osaka Organic Chemical Industry Co Ltd
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Idemitsu Kosan Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C08F20/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F20/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C37/00—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring
    • C07C37/11—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring by reactions increasing the number of carbon atoms
    • C07C37/18—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring by reactions increasing the number of carbon atoms by condensation involving halogen atoms of halogenated compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C39/00—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring
    • C07C39/12—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings
    • C07C39/17—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings containing other rings in addition to the six-membered aromatic rings, e.g. cyclohexylphenol
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C67/00—Preparation of carboxylic acid esters
    • C07C67/24—Preparation of carboxylic acid esters by reacting carboxylic acids or derivatives thereof with a carbon-to-oxygen ether bond, e.g. acetal, tetrahydrofuran
    • C07C67/26—Preparation of carboxylic acid esters by reacting carboxylic acids or derivatives thereof with a carbon-to-oxygen ether bond, e.g. acetal, tetrahydrofuran with an oxirane ring
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • C07D303/28—Ethers with hydroxy compounds containing oxirane rings
    • C07D303/30—Ethers of oxirane-containing polyhydroxy compounds in which all hydroxyl radicals are etherified with oxirane-containing hydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2603/00—Systems containing at least three condensed rings
    • C07C2603/56—Ring systems containing bridged rings
    • C07C2603/58—Ring systems containing bridged rings containing three rings
    • C07C2603/70—Ring systems containing bridged rings containing three rings containing only six-membered rings
    • C07C2603/74—Adamantanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Epoxy Compounds (AREA)
  • Epoxy Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
CN200780043783XA 2006-11-29 2007-11-21 金刚烷衍生物、其制造方法以及含金刚烷衍生物的树脂组合物 Active CN101547885B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP322044/2006 2006-11-29
JP2006322044A JP5134233B2 (ja) 2006-11-29 2006-11-29 アダマンタン誘導体、その製造方法及びアダマンタン誘導体を含む樹脂組成物
PCT/JP2007/072507 WO2008065939A1 (en) 2006-11-29 2007-11-21 Adamantane derivative, method for producing the same, and resin composition containing adamantane derivative

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CN101547885A CN101547885A (zh) 2009-09-30
CN101547885B true CN101547885B (zh) 2012-11-28

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US (1) US8110614B2 (enExample)
EP (1) EP2090563A1 (enExample)
JP (1) JP5134233B2 (enExample)
KR (1) KR101440769B1 (enExample)
CN (1) CN101547885B (enExample)
TW (1) TWI434824B (enExample)
WO (1) WO2008065939A1 (enExample)

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JP5122229B2 (ja) * 2007-09-28 2013-01-16 クラレノリタケデンタル株式会社 重合性アダマンタン誘導体及び歯科用組成物
JP5548136B2 (ja) * 2008-12-19 2014-07-16 出光興産株式会社 アダマンタン誘導体、その製造方法及びアダマンタン誘導体を含む硬化物
JP5641943B2 (ja) * 2009-01-21 2014-12-17 大阪有機化学工業株式会社 アダマンタン化合物
JP5229044B2 (ja) * 2009-03-26 2013-07-03 Ｊｓｒ株式会社 レジスト下層膜形成用組成物、レジスト下層膜、レジスト下層膜の形成方法、及びパターン形成方法
JP5396120B2 (ja) * 2009-03-26 2014-01-22 出光興産株式会社 アダマンタン誘導体
JP5700209B2 (ja) 2010-03-09 2015-04-15 Jsr株式会社 光電変換素子およびその製造方法、並びに、光導波路形成用組成物およびその硬化物
JP2011219508A (ja) * 2010-04-02 2011-11-04 Idemitsu Kosan Co Ltd 樹脂組成物および光半導体用反射材
RU2544676C2 (ru) 2010-04-16 2015-03-20 Вэлспар Сорсинг, Инк. Составы для покрытий для упаковочных изделий и способы нанесения покрытий
JP5758634B2 (ja) * 2011-01-21 2015-08-05 大阪有機化学工業株式会社 アダマンタン誘導体及びその製造方法
PL3425011T3 (pl) 2011-02-07 2021-05-17 Swimc Llc Kompozycje powłokowe do pojemników i innych wyrobów i sposoby powlekania
WO2012111314A1 (ja) * 2011-02-18 2012-08-23 出光興産株式会社 電子素子用絶縁材料形成用組成物、電子素子用絶縁材料、電子素子及び薄膜トランジスタ
RU2458905C1 (ru) * 2011-06-17 2012-08-20 Федеральное Государственное Бюджетное Учреждение Науки Институт Химии И Химической Технологии Сибирского Отделения Российской Академии Наук (Иххт Со Ран) Способ получения адамантилсодержащих производных галоидфенолов
CN102311346B (zh) * 2011-06-20 2014-06-25 常州大学 一种金刚烷类树脂、制备方法及其应用
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JP5829849B2 (ja) * 2011-07-06 2015-12-09 大阪有機化学工業株式会社 アダマンタン誘導体の製造方法
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AU2013217087B2 (en) * 2012-02-07 2015-10-22 Swimc Llc Compositions for containers and other articles and methods of using same
KR102093405B1 (ko) 2012-08-09 2020-03-25 에스더블유아이엠씨 엘엘씨 용기 코팅 시스템
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JP5723958B1 (ja) * 2013-12-02 2015-05-27 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
CN103965144B (zh) * 2014-04-02 2016-09-28 复旦大学 金刚烷基多官能团环氧树脂单体、其制备方法和应用
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CN104530020B (zh) * 2014-12-17 2017-11-28 成都师范学院 一种含马来酰亚胺环氧树脂固化剂的制备方法
TWI614275B (zh) 2015-11-03 2018-02-11 Valspar Sourcing Inc 用於製備聚合物的液體環氧樹脂組合物
CN105467767B (zh) * 2015-12-11 2019-12-13 阜阳欣奕华材料科技有限公司 金刚烷衍生物单体、彩色光阻剂及其制备方法、彩色滤光片
US20200146166A1 (en) * 2018-11-07 2020-05-07 Covidien Lp Hermetically sealed printed circuit boards
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JP7610510B2 (ja) * 2019-07-30 2025-01-08 株式会社ダイセル 単量体、フォトレジスト用樹脂、フォトレジスト用樹脂組成物、及びパターン形成方法
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CN101547885A (zh) 2009-09-30
TW200835677A (en) 2008-09-01
TWI434824B (zh) 2014-04-21
JP2008133246A (ja) 2008-06-12
WO2008065939A1 (en) 2008-06-05
US8110614B2 (en) 2012-02-07
KR101440769B1 (ko) 2014-09-23
JP5134233B2 (ja) 2013-01-30
US20100056663A1 (en) 2010-03-04
KR20090085031A (ko) 2009-08-06
EP2090563A1 (en) 2009-08-19

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