CN101546803A - 光学半导体器件 - Google Patents
光学半导体器件 Download PDFInfo
- Publication number
- CN101546803A CN101546803A CN200910134760A CN200910134760A CN101546803A CN 101546803 A CN101546803 A CN 101546803A CN 200910134760 A CN200910134760 A CN 200910134760A CN 200910134760 A CN200910134760 A CN 200910134760A CN 101546803 A CN101546803 A CN 101546803A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- coating
- silver
- semiconductor device
- alloy coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 51
- 230000003287 optical effect Effects 0.000 title claims abstract description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052709 silver Inorganic materials 0.000 claims abstract description 24
- 239000004332 silver Substances 0.000 claims abstract description 24
- 229910001316 Ag alloy Inorganic materials 0.000 claims abstract description 19
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052737 gold Inorganic materials 0.000 claims abstract description 19
- 239000010931 gold Substances 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 17
- 238000000576 coating method Methods 0.000 claims description 96
- 239000011248 coating agent Substances 0.000 claims description 86
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 44
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 34
- 229910052763 palladium Inorganic materials 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 18
- 229910052759 nickel Inorganic materials 0.000 claims description 17
- 238000005538 encapsulation Methods 0.000 claims description 14
- 229910045601 alloy Inorganic materials 0.000 claims description 13
- 239000000956 alloy Substances 0.000 claims description 13
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 10
- 239000011247 coating layer Substances 0.000 abstract 4
- 229910001020 Au alloy Inorganic materials 0.000 abstract 1
- 239000003353 gold alloy Substances 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 21
- 238000001579 optical reflectometry Methods 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- -1 wherein Substances 0.000 description 3
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910001254 electrum Inorganic materials 0.000 description 2
- XXOYNJXVWVNOOJ-UHFFFAOYSA-N fenuron Chemical compound CN(C)C(=O)NC1=CC=CC=C1 XXOYNJXVWVNOOJ-UHFFFAOYSA-N 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001021 Ferroalloy Inorganic materials 0.000 description 1
- 239000004954 Polyphthalamide Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006375 polyphtalamide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49582—Metallic layers on lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/85399—Material
- H01L2224/854—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/85438—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/85439—Silver (Ag) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/85399—Material
- H01L2224/854—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/85463—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
- H01L2224/85464—Palladium (Pd) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Abstract
Description
Claims (4)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-007988 | 2003-01-16 | ||
JP2003007988 | 2003-01-16 | ||
JP2003007988 | 2003-01-16 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004800021943A Division CN100499099C (zh) | 2003-01-16 | 2004-01-13 | 半导体器件的引线框 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101546803A true CN101546803A (zh) | 2009-09-30 |
CN101546803B CN101546803B (zh) | 2010-12-08 |
Family
ID=32709142
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009101347600A Expired - Lifetime CN101546803B (zh) | 2003-01-16 | 2004-01-13 | 光学半导体器件 |
CNB2004800021943A Expired - Lifetime CN100499099C (zh) | 2003-01-16 | 2004-01-13 | 半导体器件的引线框 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004800021943A Expired - Lifetime CN100499099C (zh) | 2003-01-16 | 2004-01-13 | 半导体器件的引线框 |
Country Status (7)
Country | Link |
---|---|
US (3) | US7692277B2 (zh) |
KR (1) | KR101059361B1 (zh) |
CN (2) | CN101546803B (zh) |
DE (1) | DE112004000155B4 (zh) |
MY (1) | MY144642A (zh) |
TW (1) | TWI264105B (zh) |
WO (1) | WO2004064154A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101867009A (zh) * | 2010-05-07 | 2010-10-20 | 厦门永红科技有限公司 | 一种led引线框架及其电镀方法和电镀设备 |
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KR101154801B1 (ko) * | 2004-12-03 | 2012-07-03 | 엔지케이 스파크 플러그 캄파니 리미티드 | 세라믹 기판 및 발광 소자 수납용 세라믹 패키지 |
JP2006344925A (ja) * | 2005-05-11 | 2006-12-21 | Sharp Corp | 発光素子搭載用フレームおよび発光装置 |
JP4820616B2 (ja) * | 2005-10-20 | 2011-11-24 | パナソニック株式会社 | リードフレーム |
JP2008091818A (ja) * | 2006-10-05 | 2008-04-17 | Matsushita Electric Ind Co Ltd | 光半導体装置用リードフレームおよびこれを用いた光半導体装置、並びにこれらの製造方法 |
TW200834968A (en) * | 2007-02-13 | 2008-08-16 | Harvatek Corp | Method of making light-emitting diode structure with high heat dissipation effect and structure made thereby |
JP4834022B2 (ja) * | 2007-03-27 | 2011-12-07 | 古河電気工業株式会社 | 可動接点部品用銀被覆材およびその製造方法 |
KR101485319B1 (ko) * | 2008-06-30 | 2015-01-22 | 서울반도체 주식회사 | 발광 장치 |
JP2010045140A (ja) * | 2008-08-11 | 2010-02-25 | Nec Electronics Corp | リードフレーム、リードフレームの製造方法及び半導体装置の製造方法 |
KR101509228B1 (ko) * | 2008-09-17 | 2015-04-10 | 서울반도체 주식회사 | 내부 리드에 비해 얇은 외부 리드를 갖는 측면 발광 다이오드 패키지 및 그것을 제조하는 방법 |
WO2010035944A2 (ko) * | 2008-09-29 | 2010-04-01 | 서울반도체 주식회사 | 발광 장치 |
KR101267718B1 (ko) * | 2008-12-19 | 2013-05-24 | 후루카와 덴키 고교 가부시키가이샤 | 광반도체 장치용 리드 프레임 및 그 제조방법 |
CN102265417B (zh) * | 2008-12-26 | 2013-10-23 | 古河电气工业株式会社 | 光半导体装置用引线框、其制造方法及光半导体装置 |
KR101081920B1 (ko) * | 2009-07-07 | 2011-11-10 | 서울반도체 주식회사 | 발광 장치 |
EP2584621A4 (en) * | 2010-06-15 | 2015-12-16 | Furukawa Electric Co Ltd | PCB FOR AN OPTICAL SEMICONDUCTOR COMPONENT, METHOD FOR PRODUCING THE PCB FOR AN OPTICAL SEMICONDUCTOR COMPONENT AND OPTICAL SEMICONDUCTOR COMPONENT |
KR101802850B1 (ko) | 2011-01-11 | 2017-11-29 | 해성디에스 주식회사 | 반도체 패키지 |
TW201230417A (en) * | 2011-01-11 | 2012-07-16 | Lextar Electronics Corp | Leadframe, packaging cup incorporating the leadframe and light emitting diode lamp having the leadframe |
JP5682341B2 (ja) * | 2011-02-01 | 2015-03-11 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
US8846421B2 (en) * | 2011-03-10 | 2014-09-30 | Mds Co. Ltd. | Method of manufacturing lead frame for light-emitting device package and light-emitting device package |
KR101217308B1 (ko) * | 2011-05-27 | 2012-12-31 | 앰코 테크놀로지 코리아 주식회사 | 반도체 디바이스용 리드 프레임 |
DE102011083691B4 (de) * | 2011-09-29 | 2020-03-12 | Osram Gmbh | Optoelektronisches halbleiterbauteil |
US20130098659A1 (en) * | 2011-10-25 | 2013-04-25 | Yiu Fai KWAN | Pre-plated lead frame for copper wire bonding |
TWI483437B (zh) * | 2012-03-27 | 2015-05-01 | Lextar Electronics Corp | 發光二極體封裝體及其製造方法 |
TWI447961B (zh) * | 2012-04-16 | 2014-08-01 | Lextar Electronics Corp | 發光二極體封裝體 |
CN102956795A (zh) * | 2012-07-17 | 2013-03-06 | 孙百贵 | 一种top led金属支架及其制造方法 |
CN102903823A (zh) * | 2012-07-17 | 2013-01-30 | 孙百贵 | 新型top led金属支架及其制造方法 |
KR101802851B1 (ko) | 2013-03-11 | 2017-11-29 | 해성디에스 주식회사 | 리드 프레임, 이를 포함하는 반도체 패키지, 및 리드 프레임의 제조 방법 |
KR101511032B1 (ko) * | 2013-09-25 | 2015-04-10 | 앰코 테크놀로지 코리아 주식회사 | Led 패키지 제조용 리드프레임을 이용한 led 패키지 |
DE102014101154A1 (de) * | 2014-01-30 | 2015-07-30 | Osram Opto Semiconductors Gmbh | Optoelektronische Anordnung |
DE102014101155A1 (de) * | 2014-01-30 | 2015-07-30 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
CN110265376A (zh) | 2018-03-12 | 2019-09-20 | 意法半导体股份有限公司 | 引线框架表面精整 |
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-
2004
- 2004-01-13 KR KR1020057012373A patent/KR101059361B1/ko active IP Right Grant
- 2004-01-13 CN CN2009101347600A patent/CN101546803B/zh not_active Expired - Lifetime
- 2004-01-13 WO PCT/JP2004/000152 patent/WO2004064154A1/en active Application Filing
- 2004-01-13 US US10/542,419 patent/US7692277B2/en active Active
- 2004-01-13 DE DE112004000155.2T patent/DE112004000155B4/de not_active Expired - Lifetime
- 2004-01-13 CN CNB2004800021943A patent/CN100499099C/zh not_active Expired - Lifetime
- 2004-01-15 TW TW093101058A patent/TWI264105B/zh not_active IP Right Cessation
- 2004-01-15 MY MYPI20040108A patent/MY144642A/en unknown
-
2009
- 2009-07-24 US US12/509,065 patent/US7994616B2/en not_active Expired - Lifetime
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2010
- 2010-03-03 US US12/716,938 patent/US8541871B2/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101867009A (zh) * | 2010-05-07 | 2010-10-20 | 厦门永红科技有限公司 | 一种led引线框架及其电镀方法和电镀设备 |
CN101867009B (zh) * | 2010-05-07 | 2014-10-15 | 厦门永红科技有限公司 | 一种led引线框架及其电镀方法和电镀设备 |
Also Published As
Publication number | Publication date |
---|---|
DE112004000155B4 (de) | 2019-06-19 |
TWI264105B (en) | 2006-10-11 |
DE112004000155T5 (de) | 2008-03-20 |
US20060102936A1 (en) | 2006-05-18 |
US7994616B2 (en) | 2011-08-09 |
KR101059361B1 (ko) | 2011-08-24 |
MY144642A (en) | 2011-10-31 |
CN1795554A (zh) | 2006-06-28 |
CN100499099C (zh) | 2009-06-10 |
US8541871B2 (en) | 2013-09-24 |
WO2004064154A1 (en) | 2004-07-29 |
US20100155770A1 (en) | 2010-06-24 |
US20090283791A1 (en) | 2009-11-19 |
US7692277B2 (en) | 2010-04-06 |
KR20050097926A (ko) | 2005-10-10 |
TW200416993A (en) | 2004-09-01 |
CN101546803B (zh) | 2010-12-08 |
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