CN101516527B - 涂敷装置以及涂敷方法 - Google Patents

涂敷装置以及涂敷方法 Download PDF

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Publication number
CN101516527B
CN101516527B CN2007800353270A CN200780035327A CN101516527B CN 101516527 B CN101516527 B CN 101516527B CN 2007800353270 A CN2007800353270 A CN 2007800353270A CN 200780035327 A CN200780035327 A CN 200780035327A CN 101516527 B CN101516527 B CN 101516527B
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CN
China
Prior art keywords
applying
pallet
die
pad
plate
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Active
Application number
CN2007800353270A
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English (en)
Chinese (zh)
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CN101516527A (zh
Inventor
山田健央
小岛和也
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Fujifilm Corp
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Fujifilm Corp
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Publication date
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Publication of CN101516527A publication Critical patent/CN101516527A/zh
Application granted granted Critical
Publication of CN101516527B publication Critical patent/CN101516527B/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0254—Coating heads with slot-shaped outlet
    • B05C5/0262—Coating heads with slot-shaped outlet adjustable in width, i.e. having lips movable relative to each other in order to modify the slot width, e.g. to close it
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0254—Coating heads with slot-shaped outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0245—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to a moving work of indefinite length, e.g. to a moving web

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  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CN2007800353270A 2006-09-26 2007-09-20 涂敷装置以及涂敷方法 Active CN101516527B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP261381/2006 2006-09-26
JP2006261381A JP5114037B2 (ja) 2006-09-26 2006-09-26 塗布装置及び塗布方法
PCT/JP2007/068262 WO2008038563A1 (fr) 2006-09-26 2007-09-20 Appareil d'application, et procédé d'application

Publications (2)

Publication Number Publication Date
CN101516527A CN101516527A (zh) 2009-08-26
CN101516527B true CN101516527B (zh) 2012-01-11

Family

ID=39229999

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800353270A Active CN101516527B (zh) 2006-09-26 2007-09-20 涂敷装置以及涂敷方法

Country Status (5)

Country Link
JP (1) JP5114037B2 (fr)
KR (1) KR20090057011A (fr)
CN (1) CN101516527B (fr)
TW (1) TWI403366B (fr)
WO (1) WO2008038563A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5114037B2 (ja) * 2006-09-26 2013-01-09 富士フイルム株式会社 塗布装置及び塗布方法
WO2010027001A1 (fr) * 2008-09-04 2010-03-11 富士フイルム株式会社 Elément hydrophile et son procédé de fabrication
KR101175029B1 (ko) * 2010-12-29 2012-08-17 삼성에스디아이 주식회사 슬러리 도포 장치 및 그 제조방법
US9295590B2 (en) 2012-11-27 2016-03-29 The Procter & Gamble Company Method and apparatus for applying an elastic material to a moving substrate in a curved path
US9265672B2 (en) 2012-11-27 2016-02-23 The Procter & Gamble Company Methods and apparatus for applying adhesives in patterns to an advancing substrate
US9248054B2 (en) 2012-11-27 2016-02-02 The Procter & Gamble Company Methods and apparatus for making elastic laminates
JP5667226B2 (ja) * 2013-02-25 2015-02-12 古河電気工業株式会社 薄膜形成方法及び薄膜形成装置
CN109107829A (zh) * 2018-09-26 2019-01-01 深圳市曼恩斯特科技有限公司 涂布模头及涂布机
CN114653521B (zh) * 2022-03-11 2023-06-09 河北世纪恒泰富塑业有限公司 一种包装容器生产用表面导电树脂均匀涂装设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0113979A1 (fr) * 1982-12-16 1984-07-25 Matsushita Electric Industrial Co., Ltd. Procédé de fabrication de motifs de circuits pour couches épaisses avec bande de largeur suffisante et d'épaisseur régulière
US5876500A (en) * 1995-07-06 1999-03-02 Toray Engineering Co., Ltd Coating apparatus
CN1756605A (zh) * 2003-03-03 2006-04-05 东丽株式会社 狭缝模具、和具有涂膜的基体材料的制造方法以及制造装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06142588A (ja) * 1992-11-12 1994-05-24 Mitsubishi Kasei Corp 塗布ダイ
JPH09136046A (ja) * 1995-11-10 1997-05-27 Dainippon Screen Mfg Co Ltd 気体噴射ノズルおよび基板の液切り装置
US6231671B1 (en) * 1998-11-04 2001-05-15 3M Innovative Properties Company Floating coating die mounting system
JP4438169B2 (ja) * 2000-03-21 2010-03-24 東レ株式会社 塗布装置および塗布部材の製造方法ならびにカラーフィルタの製造装置および製造方法
JP2001286805A (ja) * 2000-04-05 2001-10-16 Yasui Seiki:Kk 塗工剤供給ノズル
JP3899485B2 (ja) * 2002-03-22 2007-03-28 富士フイルム株式会社 塗布方法及び装置
JP3960519B2 (ja) * 2002-01-29 2007-08-15 株式会社東京自働機械製作所 糊噴射ノズル及び糊塗布装置
JP2004321915A (ja) * 2003-04-24 2004-11-18 Fuji Photo Film Co Ltd 塗布方法及び塗布装置
JP2006255646A (ja) * 2005-03-18 2006-09-28 Tdk Corp 塗布装置および塗布方法
JP4819464B2 (ja) * 2005-09-30 2011-11-24 富士フイルム株式会社 塗布方法、並びに光学フィルム及び反射防止フィルムの製造方法
JP5114037B2 (ja) * 2006-09-26 2013-01-09 富士フイルム株式会社 塗布装置及び塗布方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0113979A1 (fr) * 1982-12-16 1984-07-25 Matsushita Electric Industrial Co., Ltd. Procédé de fabrication de motifs de circuits pour couches épaisses avec bande de largeur suffisante et d'épaisseur régulière
US5876500A (en) * 1995-07-06 1999-03-02 Toray Engineering Co., Ltd Coating apparatus
CN1756605A (zh) * 2003-03-03 2006-04-05 东丽株式会社 狭缝模具、和具有涂膜的基体材料的制造方法以及制造装置

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP平6-142588A 1994.05.24
JP平9-136046A 1997.05.27
王文斌.《连接与紧固》.《机械设计手册》.2005,第6-97至6-114页. *

Also Published As

Publication number Publication date
TWI403366B (zh) 2013-08-01
JP2008080212A (ja) 2008-04-10
WO2008038563A1 (fr) 2008-04-03
JP5114037B2 (ja) 2013-01-09
CN101516527A (zh) 2009-08-26
KR20090057011A (ko) 2009-06-03
TW200827044A (en) 2008-07-01

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