CN101495582B - 基于光照射的树脂粘接方法及树脂部件的制造方法 - Google Patents

基于光照射的树脂粘接方法及树脂部件的制造方法 Download PDF

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Publication number
CN101495582B
CN101495582B CN2007800265778A CN200780026577A CN101495582B CN 101495582 B CN101495582 B CN 101495582B CN 2007800265778 A CN2007800265778 A CN 2007800265778A CN 200780026577 A CN200780026577 A CN 200780026577A CN 101495582 B CN101495582 B CN 101495582B
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China
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resin
bonding
adhering method
substrate
microchip
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CN101495582A (zh
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杉村博之
李庚晃
谷口义尚
田口好弘
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406—Ultraviolet [UV] radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1432—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface direct heating of the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
    • B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
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    • B29C66/8322—Joining or pressing tools reciprocating along one axis
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/9161—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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Abstract

提供一种在比基于热融敷的粘接更低的温度下以高生产率能够将树脂与树脂粘接的粘接方法。该粘接方法用于对第一树脂和第二树脂进行粘接，且该粘接方法包括：(I)向成为粘接面的第一及第二树脂的表面照射紫外光的工序；和(II)通过使照射后的所述表面在相互接触的状态下进行升温，以所述表面为粘接面，对第一树脂和第二树脂进行粘接的工序。该粘接方法例如可以应用于包含具有树脂部的2个以上部件，所述2个以上部件在所述树脂部中相互粘接的树脂物品的制造方法；及含有按对置方式相互粘接的一对树脂基板，在树脂基板的至少一个形成有微细的流路的微芯片的制造方法中。

Description

基于光照射的树脂粘接方法及树脂部件的制造方法
技术领域
本发明涉及基于光(紫外光)照射的树脂粘接方法及利用了该方法的树脂物品例如微芯片的制造方法。
背景技术
作为树脂的粘接方法，通常有基于热融敷的粘接、或基于有机溶剂或粘接剂的涂敷的粘接。基于热融敷的粘接通常以树脂的玻化温度以上的温度进行。
另一方面，典型地具有一对基板对置粘接的构造，并在至少一个上述基板的表面形成有微细流路的微芯片正备受瞩目。微芯片有时也被称为微流体器件。
微芯片中，通过在被称作微通道的流路中设置配置有试剂的反应区域等具有各种功能的区域，可以构成适用于各种用途的芯片。作为微芯片的用途，代表性的有基因分析、临床诊断、药物筛选等化学、生物学、药学、医学、兽学等领域中的分析，或化合物的合成、环境计测等。当在这些用途中使用了微芯片时，与例如在同样的用途中利用了适用的现有分析装置的情况相比，由于(1)可以降低分析所需要的采样及试剂的量、(2)可以缩短分析时间、(3)能够实现芯片的一次性使用，所以，可以得到在医疗领域等中能够提高安全性及测定精度等效果。
以往，由于制造容易、且还能够实现光学性的检测，所以在微芯片中主要使用了玻璃基板。但是，由玻璃基板构成的微芯片因来自外部的冲击而容易破损，而且在输送时、废弃时等存在重量的问题。鉴于此，正在开发一种使用了轻量同时与玻璃基板相比不易破损、且廉价的树脂基板的微芯片。
在使用了树脂基板的微芯片中树脂基板彼此的粘接方法就变得重要。
在树脂基板彼此的粘接中，可以应用一般的树脂粘接方法，例如热融敷。不过，由于基于热融敷的粘接通常以树脂的玻化温度以上的温度进行，所以，粘接时基板会变形，有时会失去作为微芯片的功能。另外，由于基板变形的影响在流路宽度细的情况或流路模式复杂的情况下更显著，所以，难以通过基于热融敷的粘接实现微芯片的高功能化。
树脂基板的变形可以通过以更低温度的粘接来抑制。作为这样的粘接方法，特开2005-80569号公报(文献1)公开了一种对在表面具有微细流路的基板中的不存在流路的部分涂敷了有机溶剂后，将该基板与具有平坦面的基板重合融敷的微芯片接合方法。
特开2005-257283号公报(文献2)公开了一种使聚二甲基硅氧烷(PDMS)基板、与由PDMS以外的材料构成的树脂基板(对置基板)粘接的微芯片的制造方法。在该制造方法中，准备在表面形成了微细流路的PDMS基板、和在表面形成了氧化硅膜的对置基板，在对两方基板的粘贴面进行了改质处理后，借助上述氧化硅膜将基板之间粘接起来。作为贴合面的改质处理，例示了氧等离子处理，更具体地例示了在氧气环境下照射准分子紫外线的氧等离子处理(例如文献2的段落编号[0017])。
另外，虽然与微芯片的制造方法没有直接关系，但在特开2005-171164号公报(文献3)及特开2004-43662号公报(文献4)中公开了下述方法：对聚烯烃系树脂的表面照射光使该表面活化(在文献3中一并使用了具有光聚合性的表面改质用树脂)，并对活化后的该表面涂敷热金属粘接剂或紫外线固化型树脂等树脂组成物，借助该组成物来粘接树脂。
在文献1的方法中，如果有机溶剂进入到流路，则由于构成基板的树脂会被侵蚀、发生变性等，从而成为流路阻塞、微芯片发生特性劣化等的原因，所以，以避开流路的方式涂敷了有机溶剂。但是，这样的有机溶剂的涂敷工序，除了成为使微芯片的生产率降低的主要原因之外，在以高功能化等为目的使流路宽度狭小化、流路模式复杂化的微芯片的制造中，因其狭小化、复杂化的程度而难以对应。
在文献2的方法中，由于不使用有机溶剂及粘接剂，所以与文献1的方法相比，难以发生流路的闭塞、微芯片的特性劣化等。但文献2的方法始终只是在与含有Si-O键且与氧化硅膜具有强的亲和性的作为硅酮树脂的PDMS基板的粘接所采用的方法，无法实现PDMS基板以外的树脂基板彼此的粘接。
在文献3、4的方法中需要向基板表面涂敷树脂组成物，由于会发生流路的闭塞等，所以，难以将该方法直接应用到微芯片的制造方法中。与文献1同样，虽然也可以考虑避开流路地涂敷树脂组成物，但如上所述，这样的涂敷工序除了成为降低微芯片生产率的主要原因之外，还难以应对流路宽度的狭小化与流路模式的复杂化。
这样，在制造微芯片时，期待着一种不涂敷不仅会降低芯片的生产率、而且成为流路闭塞等主要原因的有机溶剂及树脂组成物，在比基于热融敷的粘接低的温度下，能够将树脂基板彼此粘接起来的树脂的粘接方法。而且，除了微芯片之外，还期待着这样的粘接方法在各种树脂物品的制造方法中应用。
发明内容
鉴于此，本发明不限定于微芯片制造时的树脂基板彼此的粘接(即不限定于微芯片的制造方法)，其目的在于，提供一种在比基于热融敷的粘接更低的温度下以高生产率能够将树脂与树脂粘接的粘接方法。
本发明的树脂的粘接方法(第一粘接方法)是将第一树脂与第二树脂粘接的树脂的粘接方法，包括：(I)向成为粘接面的所述第一及第二树脂的表面照射紫外光的工序；和(II)通过使所述照射后的所述表面在相互接触的状态下进行升温，以所述表面为粘接面，将所述第一树脂和所述第二树脂粘接的工序。
从与第一粘接方法不同的观点出发的本发明的树脂粘接方法(第二粘接方法)，是将第一树脂与第二树脂粘接的树脂的粘接方法，包括：(i)向成为粘接面的所述第一及第二树脂的表面照射紫外光的工序；(ii)利用硅烷耦合剂对所述照射后的所述表面进行表面处理的工序；和(iii)通过使所述处理后的所述表面在相互接触的状态下进行升温，以所述表面为粘接面，将所述第一树脂和所述第二树脂粘接的工序。
本发明的粘接方法能够应用到具有将树脂与树脂粘接的部分的树脂物品的制造方法中。即，本发明的树脂物品的制造方法是包含具有树脂部的部件2个以上、且所述2个以上物品在所述树脂部相互粘接的树脂物品的制造方法，通过上述本发明的粘接方法对所述树脂部彼此进行粘接。
本发明的树脂物品的制造方法可以适用于各种树脂物品，例如微芯片的制造方法。即，本发明的微芯片的制造方法是含有以对置方式相互粘接的一对树脂基板、且所述树脂基板的至少一方上形成有流路的微芯片的制造方法，通过上述本发明的粘接方法对所述树脂基板之间进行粘接。
根据本发明的粘接方法，在比基于热融敷的粘接低的温度下以高生产率能够将树脂与树脂粘接。
另外，在第二粘接方法中，利用硅烷耦合剂对第一及第二树脂的表面进行了表面处理，该表面处理中，在第一及第二树脂的表面形成厚度为几mm左右的硅烷耦合剂层(典型的是单分子层)。与之相对，当在树脂的表面涂敷了粘接剂、或文献3、4所示的树脂组成物时，在该树脂的表面会形成至少厚度为几μm以上的树脂层。另一方面，在微芯片所使用的树脂基板，通常在其表面形成有几μm宽度的流路。因此，当进行粘接的树脂是上述微芯片所使用的树脂基板时，如果不按照避开流路的方式涂敷粘接剂或树脂组成物，则会阻塞流路。与之相对，在第二粘接方法的表面处理中，由于通过该处理形成的硅烷耦合剂层的厚度相比于流路的尺寸非常小，所以，即使不按照避开流路的方式进行表面处理，上述流路也难以发生阻塞。因此，根据第二粘接方法，在比基于热融敷的粘接低的温度下以高生产率能够将上述树脂基板彼此粘接。
在将这样的粘接方法应用到树脂物品的制造方法中时，即在本发明的树脂物品的制造方法中，可以根据该物品的种类得到各种效果。
在将本发明的粘接方法应用到微芯片的制造方法中时，即在本发明的微芯片的制造方法中，由于在比基于热融敷的粘接低的温度下，能够将至少一方形成有流路的一对树脂基板进行粘接，所以，可抑制粘接时该树脂基板的变形。并且，由于不需要向基板的粘接面涂敷有机溶剂及树脂组成物，所以，可以成为生产率出色的制造方法，除了能够抑制制造时流路的闭塞、微芯片的特性劣化之外，还能够更加容易地对应流路宽度的狭小化、流路图案的复杂化。
附图说明
图1A是示意地表示本发明的粘接方法的一个例子的工序图。
图1B是示意地表示本发明的粘接方法的一个例子的工序图。
图2是表示本发明的粘接方法的一个例子的示意图。
图3A是示意地表示本发明的粘接方法的一个例子的工序图。
图3B是示意地表示本发明的粘接方法的一个例子的工序图。
图3C是示意地表示本发明的粘接方法的一个例子的工序图。
图4是表示本发明的微芯片的制造方法的一个例子的示意图。
具体实施方式
对本发明的第一粘接方法进行说明。
在第一粘接方法中，如图1A所示，对成为粘接面的第一树脂1及第二树脂2的表面3a、3b照射紫外光4(工序(I))。接着，如图1B所示，通过在使紫外光照射后的表面3a、3b相互接触的状态下进行升温，以表面3a、3b为粘接面，将第一树脂1和第二树脂2粘接(工序(II))。
根据工序(I)、(II)，虽然第一树脂与第二树脂被粘接的理由不是明确的，但可以考虑以下所示的原理：当向第一及第二树脂的表面照射紫外光时，各树脂的被紫外光照射的表面(照射面)的表面能量比紫外光照射前增加(活化)，在该照射面产生羟基、羰基、羧基等官能团。这里可以认为，如果使第一及第二树脂的各照射面在相互接触的状态下升温，则会在第一及第二树脂的照射面间产生借助上述官能团的某些键合，从而以该照射面作为粘接面而使第一树脂和第二树脂粘接。
工序(I)中的紫外光的照射只要基于一般的方法进行即可。在图1A中，同时进行了向第一树脂1照射紫外光4、和向第二树脂2照射紫外光4，但也可以独立进行对各树脂的照射。
所照射的紫外光的波长没有特别限定，例如可以是300nm以下，为了更可靠地进行树脂的粘接，优选为200nm以下。其中，波长200nm以下的紫外线一般被称为真空紫外线。
紫外光的光源没有特别限定，可任意选择，例如可以采用水银灯、氙灯、准分子(excimer)激光器或准分子灯。
照射紫外光的环境气氛优选是空气中等含有氧的环境气氛。当向第一及第二树脂的表面照射紫外光时，通过各树脂的照射面被氧化，有可能产生含有氧原子的官能团。
在照射紫外光时，可以通过掩模(masking)等方法控制照射面的形状。
工序(II)中的升温可以通过使第一及第二树脂整体升温来进行，也可以仅将第一及第二树脂的照射面附近进行升温。
升温的手段没有特别限定，可以适当选择加热器、加热炉等。
升温的温度例如只要是第一树脂和第二树脂不热融敷的温度即可，可以小于第一及第二树脂的玻化温度。具体的升温温度可以根据第一及第二树脂的种类适当设定，例如当第一及第二树脂是实施例中后面叙述的环烯聚合物(日本ゼオン公司制ZEONEX330R：玻化温度为123℃)时，设为80℃～120℃左右。
第一粘接方法中，在工序(II)中可以如图2所示，一边向第一树脂1的照射面(表面3a)与第二树脂2的照射面(表面3b)相互密接的方向施加力5，一边使照射面升温。通常难以使树脂的表面成为完全的平坦面，例如由于在树脂基板的表面一般存在翘曲等，所以，通过一边向上述方向施加力一边进行升温，能够将第一树脂和第二树脂更可靠地粘接。
向上述方向施加的力的大小可以根据第一及第二树脂的形状，尤其是各个树脂的粘接面的形状来适当设定。
在第一粘接方法中，从第一及第二树脂中选择的至少一个树脂为光学性透明。在第一粘接方法中，由于可以不使用有机溶剂及树脂组成物而将第一树脂和第二树脂粘接，所以，即使在上述至少一个树脂为光学性透明的情况下，也可抑制该树脂的光学透明性因粘接而降低。其中，光学性透明的树脂一般是非晶质的树脂。
在第一粘接方法中，第一及第二树脂可以是在主链上具有从碳、氧及氮中选择的至少一种元素与碳的键合的树脂。如上所述，在文献2的方法中，需要一方基板是具有由Si-O键构成的主链、与氧化硅膜具有强大亲和性的聚二甲基硅氧烷(PDMS)基板。与之相对，根据第一粘接方法，可以对主链上具有从碳、氧及氮中选择的至少一个元素与碳的键合的树脂彼此进行粘接，还能够把由主链为该键合构成的树脂彼此进行粘接。
在第一粘接方法中，第一及第二树脂可以是硅酮树脂以外的树脂。如上所述，在文献2的方法中，需要一方的基板是硅酮树脂的一种的PDMS基板。与之相对，根据第一粘接方法，可以将硅酮树脂以外的树脂彼此进行粘接。
在第一粘接方法中，从第一及第二树脂中选择的至少一个树脂，可以是从环烯聚合物及聚碳酸酯中选择的至少一个。尤其对于环烯聚合物而言，在其分子构造上环烯聚合物之间或与其他树脂的粘接性低，难以实现基于粘接剂等的粘接。根据第一粘接方法，还能够实现这种环烯聚合物的粘接。
环烯聚合物的具体构造没有特别限定，例如可以是如降冰片烯类那样的二环式环烯的多聚物(二环式环烯聚合物)。二环式环烯聚合物一般是非晶质的聚合物，具有光学性透明、低的双折射率、高的耐热性、低的吸湿性等出色的特性，近年来在光学部件等用途中广泛使用。
在第一粘接方法中，第一及第二树脂可以相同。即，根据第一粘接方法，可以将环烯聚合物彼此粘接。
下面说明本发明的第二粘接方法。
在第二粘接方法中，如图3A所示，向成为粘接面的第一树脂1及第二树脂2的表面3a、3b照射紫外光4(工序(i))。接着，如图3B所示，利用硅烷耦合剂分别对紫外光照射后的表面3a、3b进行表面处理(工序(ii))。接着，如图3C所示，通过使表面处理后的表面3a、3b在相互接触的状态下进行升温，以表面3a、3b为粘接面，将第一树脂1和第二树脂2进行粘接(工序(iii))。其中，图3B中的符号6是通过表面处理被形成于表面3a、3b的硅烷耦合剂层6。
在第二粘接方法中，利用硅烷耦合剂对紫外线照射后的第一及第二树脂的照射面进行表面处理。硅烷耦合剂通常用于使涂膜等有机物更牢固地附着于玻璃等含有硅的无机物的表面。本发明者们发现，在将树脂和树脂粘接时，也可以将硅烷耦合剂在与紫外线的照射组合下利用。
工序(i)中的紫外线的照射可以与第一粘接方法的工序(I)同样地进行。
工序(ii)中的表面处理可以通过对紫外线照射后的第一及第二树脂的照射面，涂敷含有硅烷耦合剂的溶液来进行，含有硅烷耦合剂的溶液的涂敷方法可以根据一般的方法来进行。还可以根据需要，通过掩模等方法设置照射面中的涂敷硅烷耦合剂的部分和不涂敷的部分。
向第一树脂涂敷的第一硅烷耦合剂、和向第二树脂涂敷的第二硅烷耦合剂可具有能够相互键合的构造，例如，可以在各个硅烷耦合剂的端基具有能够相互键合的官能团。
具体而言，可在工序(ii)中，利用在端基具有氨基的硅烷耦合剂(氨基硅烷)对第一树脂的照射面进行表面处理，利用在端基具有能与氨基键合的官能团的硅烷耦合剂对第二树脂的照射面进行表面处理。作为该能够键合的官能团，例如可举出从环氧基、羧基及醛基中选择的至少一种。
工序(iii)可以与第一粘接方法的工序(II)同样地进行。
第二粘接方法中的第一及第二树脂的种类与第一粘接方法相同即可，例如，从第一及第二树脂中选择的至少一个树脂是光学性透明的。在第二粘接方法中，不利用有机溶剂及树脂组成物而能够将第一树脂和第二树脂粘接，而且，由于形成于第一及第二树脂的照射面的硅烷耦合剂层非常薄，所以，可抑制该树脂的光学透明性因粘接而降低。
另外，例如第二粘接方法中的第一及第二树脂可以是在主链上具有从碳、氧及氮中选择的至少一种元素与碳的键合的树脂，第二粘接方法中的第一及第二树脂还可以是硅酮树脂以外的树脂。在第二粘接方法中，也能够对与第一粘接方法时同样的树脂彼此进行粘接。
在本发明的树脂物品的制造方法中，可以通过上述本发明的第一粘接方法或第二粘接方法，进行该物品所含有的2个以上部件中的各自树脂部彼此的粘接。
具体而言，向成为粘接面的第一及第二树脂部的表面照射紫外光，通过使所述照射后的所述表面在相互接触的状态下进行升温，以所述表面为粘接面，将所述第一树脂部和所述第二树脂部粘接(第一粘接方法)。或者，向成为粘接面的第一及第二树脂部的表面照射紫外光，利用硅烷耦合剂对所述照射后的所述表面进行表面处理，通过使所述处理后的所述表面在相互接触的状态下进行升温，以所述表面为粘接面，将所述第一树脂部和所述第二树脂部粘接(第二粘接方法)。
树脂物品所含有的具有树脂部的部件的种类没有特别限定。而且，构成该树脂部的树脂的种类只要与上述的第一及第二树脂同样即可，具体而言，可以是从环烯聚合物及聚碳酸酯中选择的至少一种。
在本发明的树脂物品的制造方法中，当该树脂物品是微芯片时即在本发明的微芯片的制造方法中，可以根据上述本发明的第一粘接方法或第二粘接方法，来进行图4所例示的、至少一方形成有微细流路的一对树脂基板(第一树脂基板11及第二树脂基板12)彼此的粘接。另外，在图4所示的例子中，第一树脂基板11上形成有流路13，通过将第一树脂基板11的形成有流路13的表面14、与第二树脂基板12的表面15进行粘接，可形成具有流路13的微芯片16。
具体而言，向成为粘接面的第一及第二树脂基板的表面照射紫外光，通过在使所述第一及第二树脂基板对置的同时使所述照射后的所述表面在相互接触的状态下进行升温，以所述表面为粘接面，将所述第一树脂基板和所述第二树脂基板粘接(第一粘接方法)。或者，向成为粘接面的第一及第二树脂基板的表面照射紫外光，利用硅烷耦合剂对所述照射后的所述表面进行表面处理，通过一边使所述第一及第二树脂基板对置，一边使所述处理后的所述表面在相互接触的状态下进行升温，以所述表面为粘接面，将所述第一树脂基板和所述第二树脂基板粘接(第二粘接方法)。
树脂基板的形状、尺寸等没有特别限定，只要在至少一方的基板上形成流路。如图4所示，该流路也可以形成在树脂基板的粘接面(照射面)。
在本发明的微芯片的制造方法中，当在树脂基板的照射面形成有流路时，可以向该流路照射紫外光。如后面在实施例中叙述那样，可以根据构成基板的树脂的种类，通过紫外光的照射增大流路壁面的亲水性。紫外光有无向流路照射能够利用掩模等一般的手法。
在本发明的微芯片的制造方法中，由于在树脂基板的粘接面不残留有机溶剂及树脂组成物，所以，可制造光学特性优异的微芯片，例如，在芯片的用途上即使要进行光学性检测时也，能够减轻该检测时实施的光学修正。
在利用了第二粘接方法的本发明微芯片的制造方法中，当在树脂基板的照射面形成有流路时，利用硅烷耦合剂对照射面和该流路进行表面处理。可以根据构成基板的树脂、或硅烷耦合剂的种类对流路表面进行改质，实现流路的功能化。虽然因构成基板的树脂种类而不同，但流路表面的改质一般容易通过氨基硅烷来进行。
作为可应用本发明的制造方法的树脂物品，除了微芯片以外，还可以考虑树脂透镜等光学部件等。
以往，就树脂透镜的光学部件而言，其树脂部件彼此粘接的制造是困难的。在基于热融敷的粘接中，所制造的树脂透镜会发生形变，导致光学特性降低。而且，在基于有机溶剂或树脂组成物的粘接中，会在粘接面残留它们的涂敷物，使得光学特性降低。
对此，在本发明的树脂物品的制造方法中，能够将构成树脂透镜的树脂部件彼此在比基于热融敷的粘接低的温度下进行粘接，由于不会在粘接面残留有机溶剂及树脂组成物，所以，可抑制所制造的透镜的光学特性降低。另外，通过两个以上树脂部件的组合，能够制造以往难以制造的具有复杂形状的光学部件。
实施例
下面，通过实施例对本发明进行更详细的说明。本发明不被限定于以下所示的实施例。
(实施例1)
利用Xe准分子灯(ウシオ电机制造，UER20-172A)向由环烯聚合物(日本ゼオン公司制的ZEONEX330R，玻化温度123℃)构成的一对树脂基板(70mm×20mm、厚2mm)各自的表面照射紫外光(波长172nm)。紫外光的照射在大气中进行，设灯与基板表面的距离为5mm、照射强度为10mW/cm2、照射时间为10分钟。紫外光的照射面为各个基板的一方主面整体。
当对紫外光照射前后的基板表面(照射面)进行X线激励光电子分光(XPS)测定时，可知：与照射紫外光之前相比，照射后Ols光谱中的来自氧的信号增加显著，而且，Cls光谱中的来自碳的信号减少，且新发现了来自处于与氧键合状态的碳的信号(键合能量为290eV附近)。根据该结果可以认为，通过紫外光的照射，基板表面形成了多个含有氧的官能团(羧基、醛基、羟基等)。
当与上述XPS测定独立地通过自动接触角计(DM500、协和界面科学公司制造)对紫外光照射前后的基板表面的水滴接触角进行测定时，可知该接触角从99°减少为19°，且通过紫外光的照射增大了基板表面的亲水性。
接着，使紫外光照射后的各基板以成为各自的照射面相接的状态对置，向各个照射面相互密接的方向以压力0.7MPa施加力，同时使整体升温至100℃，并这样保持1小时。
接着，在整体降温至室温后去除上述力并对基板之间是否粘接进行确认时发现，基板之间牢靠地粘接、没有破损，无法将两者剥离。
其中，在使用由与上述不同的环烯聚合物(日本ゼオン公司制的ZEONEX480R，玻化温度138℃)构成的树脂基板时、及使用了由聚碳酸酯(バイエル公司制的，玻化温度210℃)构成的树脂基板时，也得到了同样的结果。
另外，在将紫外光的照射时间设为5分钟的情况下，也得到了同样的结果。
(实施例2)
向实施例1中使用的由环烯聚合物构成的一对树脂基板各自的表面，与实施例1同样地照射紫外光。
接着，向一方树脂基板(树脂基板A)的照射面涂敷作为硅烷耦合剂的、氨基硅烷的一种的N-(2-氨乙基)-3-氨丙基三甲氧基硅烷(AEAPS)。与之不同，向另一树脂基板(树脂基板B)的照射面涂敷端基具有环氧基的3-缩水甘油醚氨丙基三甲氧基硅烷(GPS)。以下的式(1)、(2)表示了AEAPS及GPS的构造式。
【化学式1】
Figure G2007800265778D00111
【化学式2】
Figure G2007800265778D00121
将这样利用硅烷耦合剂进行了表面处理的树脂基板A、B对置，以成为各自的照射面(表面处理面)相接的状态，一边向各自的照射面相互密接的方向以压力0.7MPa施加力，一边将整体升温至100℃，并这样保持1小时。
接着，在整体降温至室温后去除上述力并确认基板之间是否粘接时发现，基板之间牢靠地粘接、没有破损，无法将两者剥离。
其中，在使用由与上述不同的环烯聚合物(日本ゼオン公司制的ZEONEX480R)构成的树脂基板时、及使用了实施例1中使用的由聚碳酸酯构成的树脂基板时，也得到了同样的结果。
只要不脱离本发明的意图及其本质特征，则能够将其应用到其他的实施方式。本说明书公开的实施方式只是用于说明，本发明不限定于此。本发明的范围由权利要求限定而不是上述说明，与权利要求均等的意思表示及属于其范围的所有变更都包含于本发明。
工业上的可利用性
根据本发明，可提供一种在比基于热融敷的粘接低的温度下以高生产率能够将树脂与树脂进行粘接的粘接方法。本发明的粘接方法可应用于各种树脂物品的制造方法中，例如可应用于微芯片的制造方法。

Claims (17)

1.一种树脂的粘接方法，用于粘接第一树脂和第二树脂，该树脂的粘接方法包括：
(i)向成为粘接面的所述第一及第二树脂的表面照射紫外光的工序；
(ii)利用硅烷耦合剂对所述照射后的所述表面进行表面处理的工序；和
(iii)通过使所述处理后的所述表面在相互接触的状态下进行升温，以所述表面为粘接面，将所述第一树脂和所述第二树脂进行粘接的工序。
2.根据权利要求1所述的树脂的粘接方法，其特征在于，
将所述工序(iii)中的所述升温的温度设为所述第一树脂与所述第二树脂不热融敷的温度。
3.根据权利要求1所述的树脂的粘接方法，其特征在于，
将所述工序(iii)中的所述升温的温度设为小于所述第一树脂及所述第二树脂的玻化温度。
4.根据权利要求1所述的树脂的粘接方法，其特征在于，
在所述工序(iii)中，一边向所述第一及第二树脂的所述表面相互密接的方向施加力，一边使所述表面升温。
5.根据权利要求1所述的树脂的粘接方法，其特征在于，
从所述第一及第二树脂中选择的至少一个树脂为光学性透明。
6.根据权利要求1所述的树脂的粘接方法，其特征在于，
所述第一及第二树脂在主链上具有由从碳、氧及氮中选择的至少一种元素与碳的键合。
7.根据权利要求1所述的树脂的粘接方法，其特征在于，
从所述第一及第二树脂中选择的至少一个树脂是从环烯聚合物及聚碳酸酯中选择的至少一个。
8.根据权利要求1所述的树脂的粘接方法，其特征在于，
从所述第一及第二树脂中选择的至少一个树脂是二环式环烯聚合物。
9.根据权利要求1所述的树脂的粘接方法，其特征在于，
所述第一及第二树脂的种类相同。
10.根据权利要求1所述的树脂的粘接方法，其特征在于，
所述紫外光是真空紫外线。
11.根据权利要求1所述的树脂的粘接方法，其特征在于，
所述紫外光的光源是水银灯、氙灯、准分子激光器或准分子灯。
12.根据权利要求1所述的树脂的粘接方法，其特征在于，
在所述工序(ii)中，
利用端基具有氨基的硅烷耦合剂对所述第一树脂的所述表面进行表面处理，
利用端基具有能够与所述氨基键合的官能团的硅烷耦合剂对所述第二树脂的所述表面进行表面处理。
13.根据权利要求12所述的树脂的粘接方法，其特征在于，
所述官能团是从环氧基、羧基及醛基中选择的至少一种。
14.一种树脂物品的制造方法，该树脂物品包含具有树脂部的部件2个以上，所述2个以上部件在所述树脂部相互粘接，
所述树脂物品的制造方法利用权利要求1所述的树脂的粘接方法将所述树脂部件彼此粘接。
15.根据权利要求14所述的树脂物品的制造方法，其特征在于，
所述树脂部是从环烯聚合物及聚碳酸酯中选择的至少一个。
16.一种微芯片的制造方法，该微芯片含有按对置方式相互粘接的一对树脂基板，在所述树脂基板的至少一方形成有微细的流路，
所述微芯片的制造方法利用权利要求1所述的树脂的粘接方法将所述树脂基板彼此粘接。
17.根据权利要求16所述的微芯片的制造方法，其特征在于，
所述流路形成在所述树脂基板的粘接面。
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