WO2008007787A1 - Procédé de liaison de résines par irradiation lumineuse et procédé de fabrication d'articles en résine - Google Patents

Procédé de liaison de résines par irradiation lumineuse et procédé de fabrication d'articles en résine Download PDF

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Publication number
WO2008007787A1
WO2008007787A1 PCT/JP2007/064023 JP2007064023W WO2008007787A1 WO 2008007787 A1 WO2008007787 A1 WO 2008007787A1 JP 2007064023 W JP2007064023 W JP 2007064023W WO 2008007787 A1 WO2008007787 A1 WO 2008007787A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
bonding
bonded
resins
adhering
Prior art date
Application number
PCT/JP2007/064023
Other languages
English (en)
Japanese (ja)
Inventor
Hiroyuki Sugimura
Kyung-Hwang Lee
Yoshinao Taniguchi
Yoshihiro Taguchi
Original Assignee
Kyoto University
Alps Electric Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyoto University, Alps Electric Co., Ltd. filed Critical Kyoto University
Priority to CN2007800265778A priority Critical patent/CN101495582B/zh
Publication of WO2008007787A1 publication Critical patent/WO2008007787A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406—Ultraviolet [UV] radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1432—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface direct heating of the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/024—Thermal pre-treatments
    • B29C66/0242—Heating, or preheating, e.g. drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/026—Chemical pre-treatments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/028—Non-mechanical surface pre-treatments, i.e. by flame treatment, electric discharge treatment, plasma treatment, wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/03—After-treatments in the joint area
    • B29C66/034—Thermal after-treatments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
    • B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • B29C66/83221—Joining or pressing tools reciprocating along one axis cooperating reciprocating tools, each tool reciprocating along one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
    • B29C66/91411—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the parts to be joined, e.g. the joining process taking the temperature of the parts to be joined into account
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9161—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux
    • B29C66/91641—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time
    • B29C66/91643—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time following a heat-time profile
    • B29C66/91645—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time following a heat-time profile by steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1496—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
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    • B29C66/73117—Tg, i.e. glass transition temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
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    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C66/90—Measuring or controlling the joining process
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    • B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B29C66/9192—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
    • B29C66/91921—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
    • B29C66/91941—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to Tg, i.e. the glass transition temperature, of the material of one of the parts to be joined
    • B29C66/91945—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to Tg, i.e. the glass transition temperature, of the material of one of the parts to be joined lower than said glass transition temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/924—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/9241—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force or the mechanical power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2069/00—Use of PC, i.e. polycarbonates or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
    • B29K2995/0026—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0037—Other properties
    • B29K2995/0039—Amorphous
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/756—Microarticles, nanoarticles

Definitions

  • the present invention relates to a method for adhering a resin by irradiation with light (ultraviolet light), and a method for producing a resin article such as a microchip using the method.
  • adhesion by heat fusion or adhesion by application of an organic solvent or an adhesive is generally used. Bonding by thermal fusion is usually performed at a temperature above the glass transition point of the resin.
  • a microchip that typically has a structure in which a pair of substrates are bonded to face each other and has a fine flow path formed on the surface of at least one of the substrates has attracted attention.
  • the microphone mouth chip is also called a microfluidic device.
  • a chip suitable for various applications can be configured by providing regions having various functions such as a reaction region in which a reagent is arranged in a flow path also called a microchannel.
  • Typical applications for microchips include gene analysis, clinical diagnosis, drug screening, chemistry, biochemistry, pharmacy, medicine, veterinary analysis, compound synthesis, and environmental measurements. .
  • microchips are used for these applications, for example, (1) the amount of samples and reagents required for prayer can be reduced compared to the case of using a conventional analyzer suitable for similar applications. (2) The analysis time can be shortened. (3) Since the chip can be disposable, it is possible to obtain effects such as improvement of safety and measurement accuracy in the medical field.
  • a glass substrate has been mainly used for a microchip because it can be easily manufactured and optically detected.
  • microchips such as glass substrates are damaged by impacts from the outside and immediately become a problem in terms of weight during transportation and disposal. Therefore, development of a microchip using a resin substrate, which is lightweight but difficult to break and cheaper than a glass substrate, is underway.
  • an adhesion method between the resin substrates is important.
  • a general resin adhesion method for adhesion between the resin substrates, a general resin adhesion method, for example, heat fusion, can be applied.
  • heat fusion since bonding by heat fusion is usually performed at a temperature higher than the glass transition point of the resin, the substrate may be deformed during bonding, and the function as a microchip may be lost.
  • the influence of the deformation of the substrate becomes more conspicuous when the width of the flow path is narrowed or when the flow path pattern is complicated, it is difficult to increase the functionality of the microchip by bonding by heat fusion. is there.
  • JP 2005-80569 A discloses that a substrate having a fine channel on the surface is coated with an organic solvent on a portion without a channel, and then the substrate and a flat surface are bonded.
  • a method for joining microchips is disclosed, in which a substrate having a plurality of layers is fused by overlapping.
  • Japanese Unexamined Patent Application Publication No. 2005-257283 (Document 2) describes a production of a microchip in which a polydimethylsiloxane (PDMS) substrate is bonded to a resin substrate (facing substrate) made of a material other than PDMS.
  • a method is disclosed. In this manufacturing method, after preparing a PDMS substrate having a fine channel formed on the surface and a facing substrate having an oxide silicon film formed on the surface, the bonding surface of both substrates is modified. Then, the substrates are bonded to each other through the silicon oxide film.
  • Examples of the modification treatment of the bonding surface include oxygen plasma treatment, more specifically, oxygen plasma treatment in which excimer ultraviolet light is irradiated in an oxygen atmosphere (for example, literature)
  • Japanese Unexamined Patent Application Publication No. 2005-171164 (Reference 3) and Japanese Unexamined Patent Application Publication No. 2004-43662 (Reference 4) disclose the surface of olefin-based resin.
  • the surface is activated by irradiating light (in Reference 3, the surface-modifying resin having photopolymerizability is used in combination), and the hot-melt adhesive or UV-curing type is applied to the activated surface.
  • a method is disclosed in which a resin composition such as resin is applied and the resin is bonded via the composition.
  • the method of Document 2 does not use an organic solvent and an adhesive, and therefore, unlike the method of Document 1, blockage of the flow path and deterioration of the characteristics of the microchip are less likely to occur.
  • the method of Document 2 is a method used for bonding to a PDMS substrate that is a silicone resin containing a Si—O bond and having a strong affinity with an oxide silicon film. Bonding between substrates is not possible.
  • the present invention is not limited to the bonding between the resin substrates at the time of manufacturing the microchip (that is, not limited to the manufacturing method of the microchip), and the temperature is lower than the bonding by thermal fusion!
  • An object of the present invention is to provide an adhesion method capable of adhering resin and resin with high productivity.
  • the resin bonding method (first bonding method) of the present invention is a resin bonding method for bonding the first resin and the second resin, and is (I) an adhesive surface. Irradiating the surfaces of the first and second resin with ultraviolet light; and (II) raising the temperature in a state where the surfaces after the irradiation are in contact with each other, thereby using the surfaces as adhesive surfaces. Adhering the first resin and the second resin.
  • the resin bonding method of the present invention (second bonding method) viewed from a viewpoint different from the first bonding method is a resin that bonds the first resin and the second resin.
  • Adhesive surface A step of irradiating the surfaces of the first and second resin with ultraviolet light; (ii) a step of surface-treating the surface after the irradiation with a silane coupling agent; and (iii) a step after the treatment.
  • the bonding method of the present invention can be applied to a method for manufacturing a resin article having a portion where a resin and a resin are bonded. That is, the method for producing a resin article according to the present invention is a method for producing a resin article comprising two or more parts having a resin part, wherein the two or more articles are bonded to each other in the resin part. In this method, the resin parts are bonded together by the bonding method of the present invention.
  • the method for producing a resin article of the present invention can be applied to a method for producing various resin articles, for example, microchips. That is, the microchip manufacturing method of the present invention is a microchip manufacturing method including a pair of resin substrates bonded to each other so as to face each other, and having a flow path formed in at least one of the resin substrates. Then, the resin substrates are bonded to each other by the bonding method of the present invention.
  • the resin and the resin can be bonded with high productivity at a temperature lower than the bonding by thermal fusion.
  • the surface treatment of the surfaces of the first and second resin with the silane coupling agent In this surface treatment, the surfaces of the first and second resins.
  • a silane coupling agent layer (typically a monomolecular layer) having a thickness of about several nm is formed.
  • a resin layer having a thickness of at least several meters is formed on the surface of the resin. Will be.
  • a channel having a width of several / zm is usually formed on the surface thereof.
  • the resin to be bonded is a resin substrate used for the microchip
  • the flow path is blocked unless an adhesive or a resin composition is applied so as to avoid the flow path.
  • the thickness of the silane coupling agent layer formed by the treatment is very small with respect to the size of the flow path. Even if it is not performed, blockage of the channel is unlikely to occur. For this reason, even with the second bonding method, the above-mentioned resin substrates are bonded to each other at a lower temperature than the bonding by thermal fusion. Adhesive with good productivity.
  • the bonding method of the present invention is applied to a microchip manufacturing method, that is, in the microchip manufacturing method of the present invention, a pair of resin substrates each having a flow path formed at least on one side are heat-sealed. Since the bonding can be performed at a temperature lower than the bonding by, the deformation of the resin substrate during bonding can be suppressed. In addition, since it is not necessary to apply an organic solvent and a resin composition to the adhesive surface of the substrate, it is possible to make the manufacturing method excellent in productivity, and it is possible to suppress blockage of the flow path and deterioration of the characteristics of the microchip during the manufacturing In addition, if the channel width is narrowed, it becomes easier to cope with the complexity of the channel pattern.
  • FIG. 1A is a process chart schematically showing an example of the bonding method of the present invention.
  • FIG. 1B is a process diagram schematically showing an example of the bonding method of the present invention.
  • FIG. 2 is a schematic diagram showing an example of the bonding method of the present invention.
  • FIG. 3A is a process diagram schematically showing an example of the bonding method of the present invention.
  • FIG. 3B is a process chart schematically showing an example of the bonding method of the present invention.
  • FIG. 3C is a process diagram schematically showing an example of the bonding method of the present invention.
  • FIG. 4 is a schematic view showing an example of a method for producing a microchip according to the present invention.
  • the surfaces 3a and 3b of the first and second resins 1 and 2 to be bonded surfaces are irradiated with ultraviolet light 4 (step (1 )).
  • the surfaces 3a and 3b after ultraviolet light irradiation are heated in a state where they are in contact with each other, so that the surfaces 3a and 3b are used as adhesive surfaces, and the first resin 1 and the first resin 1 Bond 2 of 2 with grease (process ( ⁇ )).
  • the reason why the first and second resins are bonded by the steps (1) and (II) is not clear.
  • the following principle can be considered: First and second When ultraviolet light is irradiated on the surface of each of the resin, the surface energy (irradiated surface) of the surface irradiated with ultraviolet light in each resin increases (activated) before irradiation with ultraviolet light. Hydroxyl, carbonyl, cal A functional group such as a boxyl group is generated.
  • the temperature of the irradiated surfaces of the first and second resins is brought into contact with each other, some bond via the functional group is formed between the irradiated surfaces of the first and second resins. It is considered that the first and second resins are bonded with the irradiated surface as the bonding surface.
  • Irradiation with ultraviolet light in the step (I) may be performed based on a general method.
  • the force that simultaneously irradiates the first resin 1 with the ultraviolet light 4 and the second resin 2 with the ultraviolet light 4 is applied to each resin separately. May be.
  • the wavelength of the ultraviolet light to be irradiated is not particularly limited. For example, if it is 300 nm or less, 200 nm or less is preferable in order to more reliably adhere the resin. Note that ultraviolet rays having a wavelength of 200 nm or less are generally called vacuum ultraviolet rays.
  • the light source of the ultraviolet light can be selected without any particular limitation.
  • the atmosphere to be irradiated with ultraviolet light is preferably an oxygen-containing atmosphere such as air.
  • the irradiated surface of each resin may be oxidized to generate a functional group containing an oxygen atom.
  • the shape of the irradiated surface may be controlled by a technique such as masking.
  • the temperature increase in step (II) may be performed by increasing the temperature of the entire first and second resins, or only in the vicinity of the irradiated surface in the first and second resins. May be.
  • the means for raising the temperature is not particularly limited, and a heater, a heating furnace or the like may be selected as appropriate!
  • the temperature of the temperature rise may be, for example, less than the glass transition point of the first and second resins, as long as the first resin and the second resin are not thermally fused. .
  • the specific temperature of the temperature rise may be appropriately set according to the types of the first and second resins.
  • the first and second resins may be cycloolefin polymers (Japan) described later in the examples.
  • ZEONEX33 OR manufactured by ZEON: glass transition point 123 ° C), 80 ° C to 120 ° C may be used! /.
  • the irradiation surface may be heated while applying a force 5 in a direction in which the (surface 3a) and the irradiation surface (surface 3b) of the second resin 2 are in close contact with each other. It is usually difficult to make the surface of greaves completely flat For example, since the surface of the resin substrate generally has a warp or the like, the first resin and the second resin are heated by increasing the temperature while applying a force in the above direction. Can be bonded more reliably.
  • the magnitude of the force applied in the above direction should be appropriately set according to the shapes of the first and second resins, particularly the shape of the adhesive surface of each of the resins.
  • At least one resin selected from the first and second resins may be optically transparent.
  • the first and second resins can be bonded without using an organic solvent and a resin composition, so that the at least one resin is optically transparent. Even in this case, it is possible to suppress a decrease in optical transparency of the resin due to adhesion.
  • the optically transparent resin is generally an amorphous resin.
  • the first and second resins are resins having a bond between at least one element of which carbon, oxygen and nitrogen forces are also selected and carbon in the main chain. Also good.
  • one substrate is a polydimethylsiloxane (PDMS) substrate that has a main chain that also has Si—O bonding strength and has a strong and affinity for an acidic silicon film.
  • PDMS polydimethylsiloxane
  • the first bonding method at least one element selected from carbon, oxygen, and nitrogen force can be bonded to the resin having a bond between carbon and the main chain. Adhesion between rosins that have a binding force is also possible.
  • the first and second resins may be other than silicone resins.
  • one substrate needs to be a PDMS substrate that is a kind of silicone resin.
  • the first bonding method it is possible to bond the non-silicone resins together.
  • At least one resin selected from the first and second resins may be at least one selected from a cycloolefin polymer and a polycarbonate.
  • cycloolefin polymers were difficult to adhere to each other due to their molecular structure, such as an adhesive having low adhesion to cycloolefin polymers or other resins.
  • such a cycloolefin polymer can be bonded.
  • the specific structure of the cycloolefin polymer is not particularly limited.
  • it is a polymer of a bicyclic cycloolefin (bicyclic cycloolefin polymer) such as norbornenes. May be.
  • Bicyclic cycloolefin polymers are generally amorphous polymers and have excellent properties such as optical transparency, low birefringence, high heat resistance, and low hygroscopicity. It is widely used for applications.
  • the first and second resins may be the same. That is, according to the first bonding method, the cycloolefin polymers can be bonded to each other.
  • the surfaces 3a and 3b of the first and second resins 1 and 2 to be bonded surfaces are irradiated with ultraviolet light 4 (step (i )).
  • the surfaces 3a and 3b after the ultraviolet light irradiation are each surface-treated with a silane coupling agent (step (ii)).
  • the surfaces 3a and 3b after the surface treatment are heated in a state where they are in contact with each other, so that the surfaces 3a and 3b are used as adhesive surfaces, and the first and second resins 1 and 2 Adhesive with rosin 2 (step (iii)).
  • Reference numeral 6 in FIG. 3B denotes the silane coupling agent layer 6 formed on the surfaces 3a and 3b by the surface treatment.
  • the irradiated surfaces of the first and second resins after the ultraviolet irradiation are surface-treated with a silane coupling agent.
  • a silane coupling agent is usually used to more firmly adhere organic substances such as a coating film to the surface of an inorganic substance containing a key such as glass.
  • the present inventors have found that a silane coupling agent can be used in combination with ultraviolet irradiation even in the case of bonding a resin and a resin.
  • Irradiation with ultraviolet rays in step (i) may be performed in the same manner as in step (I) of the first bonding method.
  • the surface treatment in the step (ii) is performed by applying a silane coupling agent, which may be performed by applying a solution containing a silane coupling agent to the irradiation surfaces of the first and second resins after the ultraviolet irradiation.
  • a silane coupling agent which may be performed by applying a solution containing a silane coupling agent to the irradiation surfaces of the first and second resins after the ultraviolet irradiation.
  • the application method of the solution that contains it should be based on general methods. If necessary, use a method such as masking to provide a portion on the irradiated surface where the silane coupling agent is applied and a portion where it is not applied!
  • the first silane coupling agent applied to the first resin and the second silane coupling agent applied to the second resin have a structure capable of being bonded to each other.
  • the silane coupling agent may have functional groups that can be bonded to each other at the terminal.
  • the first resin surface is treated with a silane coupling agent (aminosilane) having an amino group at the terminal, and the second resin surface is irradiated. May be surface-treated with a silane coupling agent having a functional group capable of bonding to an amino group at the terminal.
  • the bondable functional group include at least one selected from an epoxy group, a carboxyl group, and an aldehyde group.
  • Step (m) may be performed in the same manner as step (II) of the first bonding method.
  • the types of the first and second resins in the second bonding method may be the same as those in the first bonding method.
  • at least one resin selected from the first and second resins May be optically transparent.
  • the first and second resins can be bonded without using an organic solvent and a resin composition, and formed on the irradiated surfaces of the first and second resins. Since the silane coupling agent layer to be formed is very thin, it is possible to suppress a decrease in optical transparency of the resin due to adhesion.
  • the first and second resins in the second bonding method are resins having a bond between at least one element selected from carbon, oxygen and nitrogen and carbon in the main chain.
  • the first and second resin in the second bonding method may be a resin other than silicone resin.
  • the same grease can be bonded as in the first bonding method.
  • the resin parts of two or more parts included in the article are bonded to each other by the first bonding method or the second bonding method according to the present invention. Just do it.
  • first bonding method Specifically, by irradiating the surfaces of the first and second resin portions serving as adhesive surfaces with ultraviolet light and raising the temperature in a state where the irradiated surfaces are in contact with each other, The first resin part and the second resin part are bonded using the surface as an adhesive surface (first bonding method).
  • the surfaces of the first and second resin portions to be bonded surfaces are irradiated with ultraviolet light, the irradiated surfaces are surface-treated with a silane coupling agent, and the treated surfaces are mutually bonded.
  • second bonding method By raising the temperature in a state of being in contact with the surface, the first and second resin portions are bonded using the surface as an adhesive surface.
  • the type of the part having the resin part included in the resin article may be the same as that of the first and second rosins described above. Specifically, it may be at least one selected from a cycloolefin polymer and polycarbonate. Good.
  • the resin article is a microchip in the method for manufacturing a resin article of the present invention, that is, in the method for manufacturing a microchip of the present invention, at least one of the fine channels shown in FIG.
  • the pair of resin substrates (the first resin substrate 11 and the second resin substrate 12) formed with the above are bonded by the first bonding method or the second bonding method of the present invention. Good.
  • the flow path 13 is formed in the first resin substrate 11, the surface 14 of the first resin substrate 11 where the flow path 13 is formed, and the second resin substrate 11.
  • a microchip 16 having a flow path 13 is formed by bonding the surface 15 of the fat substrate 12.
  • the surfaces of the first and second resin substrates that are to be bonded surfaces are irradiated with ultraviolet light, and the first and second resin substrates are opposed to each other while the first and second resin substrates are opposed to each other.
  • first bonding method By heating the surfaces in contact with each other, the first resin substrate and the second resin substrate are bonded using the surface as an adhesive surface.
  • the surfaces of the first and second resin substrates to be bonded surfaces are irradiated with ultraviolet light, and the surface after the irradiation is surface-treated with a silane coupling agent, and the first and second resin substrates are subjected to surface treatment.
  • the first resin substrate and the second resin substrate are bonded to each other using the surface as a bonding surface by raising the temperature in a state where the surfaces after the treatment are in contact with each other.
  • the shape, size, and the like of the resin substrate are not particularly limited as long as the flow path is formed on at least one of the substrates. As shown in FIG. 4, the flow path may be formed on the adhesive surface (irradiation surface) of the resin substrate.
  • the channel when a channel is formed on the irradiation surface of the resin substrate, the channel may be irradiated with ultraviolet light.
  • the hydrophilicity of the flow path wall surface can be increased by irradiation with ultraviolet light depending on the type of the resin constituting the substrate.
  • a general method such as masking can be used to determine whether or not the flow path is irradiated with ultraviolet light.
  • a microchip having excellent optical characteristics can be produced. For example, even when optical detection is performed for the purpose of the chip, optical correction performed at the time of detection can be reduced.
  • the flow path is connected to the silane coupling agent along with the irradiation surface. May be surface treated.
  • the surface of the channel can be modified to make the channel functional. Although it depends on the type of resin constituting the substrate, aminosilane is generally easily modified by modifying the flow path surface.
  • an optical component such as a resin lens by bonding the resin components together. Bonding by heat fusion causes distortion in the manufactured resin lens and reduces its optical properties. In addition, in the case of adhesion using an organic solvent-resin composition, these coated materials remain on the adhesion surface and the optical characteristics are deteriorated.
  • the resin components constituting the resin lens can be bonded to each other at a temperature lower than that by heat fusion, and an organic solvent and a resin are bonded to the bonding surface. Since the composition does not remain, it is possible to suppress a decrease in optical characteristics of the manufactured lens. In addition, by combining two or more grease parts, it is possible to manufacture optical parts having complicated shapes that were difficult to manufacture.
  • a pair of resin substrates 70mm X 20mm, thickness 2mm
  • cycloolefin polymer ZONEX330R manufactured by Nippon Zeon Co., Ltd., glass transition point 123 ° C
  • Xe excimer lamp (UER20 manufactured by Ushio) — Irradiated with ultraviolet light (wavelength 172 nm) by 172A). Irradiation with ultraviolet light was performed in the atmosphere, the distance between the lamp and the substrate surface was 5 mm, the irradiation intensity was 10 mW / cm 2 , and the irradiation time was 10 minutes.
  • the irradiation surface of ultraviolet light is one main surface of each substrate Overall.
  • the substrates after the ultraviolet light irradiation are opposed to each other so that the respective irradiation surfaces are in contact with each other, and the force is applied at a pressure of 0.7 MPa in a direction in which the respective irradiation surfaces are in close contact with each other.
  • the whole was heated to 100 ° C. and held there for 1 hour.
  • Example 2 In the same manner as in Example 1, the surface of each of the pair of resin substrates having the cycloolefin polymer force used in Example 1 was irradiated with ultraviolet light.
  • N- (2 aminoethyl) 3 aminopropyltrimethoxysilane (a kind of aminosilane) is used as a silane coupling agent on the irradiated surface of one resin substrate (resin substrate A).
  • a EAPS was applied.
  • 3-glycidoxy monopropyltrimethoxysilane (GPS) having an epoxy group at the terminal was applied to the irradiated surface of the other resin substrate (resin substrate B).
  • the structural formulas of AEAPS and GPS are shown in the following formulas (1) and (2).
  • attachment method which can adhere
  • the bonding method of the present invention can be applied to various methods for manufacturing a resin article, for example, a microchip manufacturing method.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

Procédé de liaison par lequel une résine peut être liée à une autre résine à une température inférieure à celle de la liaison par fusion thermique, et ce avec une efficacité satisfaisante. Le procédé de liaison des résines, qui permet de lier une première résine à une seconde résine, comprend une étape (I) au cours de laquelle les surfaces des première et seconde résines correspondant aux surfaces de liaison sont irradiées par des ultraviolets, et une étape (II) au cours de laquelle les résines sont chauffées pendant que les surfaces irradiées sont maintenues en contact l'une avec l'autre de façon à lier la première résine à la seconde résine, ces surfaces étant utilisées en tant que surfaces de liaison. Ce procédé de liaison peut être appliqué, par exemple, à un procédé de production d'un article en résine comprenant au moins deux parties possédant chacune une zone en résine et qui ont été liées entre elles au niveau des zones en résine, ainsi qu'à un procédé de fabrication d'une micropuce comprenant une paire de substrats en résine liés l'un à l'autre en se faisant face, une fine rainure ayant été ménagée dans au moins l'un des substrats en résine.
PCT/JP2007/064023 2006-07-13 2007-07-13 Procédé de liaison de résines par irradiation lumineuse et procédé de fabrication d'articles en résine WO2008007787A1 (fr)

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EP2441518A3 (fr) * 2010-10-18 2013-12-04 Sony Corporation Procédé et dispositif pour soudage par thermocompression
JP2015051542A (ja) * 2013-09-05 2015-03-19 独立行政法人物質・材料研究機構 接合方法、及び接合装置
WO2019221288A1 (fr) * 2018-05-18 2019-11-21 国立研究開発法人物質・材料研究機構 Procédé de fabrication d'un article en couches, article en couches et dispositif de siège de toilettes chauffé
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WO2009084622A1 (fr) * 2007-12-27 2009-07-09 Alps Electric Co., Ltd. Procédé pour le collage d'une résine par irradiation d'un rayonnement ultraviolet extrême, procédé de fabrication d'un article de résine ou d'une micropuce de résine utilisant le procédé et article ou micropuce de résine obtenu par le procédé
US8784973B2 (en) 2007-12-27 2014-07-22 Alps Electric Co., Ltd. Resin bonding method by photoirradiation, method for producing resin article, resin article produced by the same method, method for producing microchip, and microchip produced by the same method
US8262834B2 (en) 2008-04-28 2012-09-11 Hon Hai Precision Industry Co., Ltd. Method for manufacturing lens
JP2013535541A (ja) * 2010-07-30 2013-09-12 ソニー株式会社 ガラス様表面を有する高分子化合物基板、および前記高分子化合物基板で作られたチップ
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CN104203573A (zh) * 2012-01-19 2014-12-10 优志旺电机株式会社 工件的贴合方法及触摸面板
JP2013149072A (ja) * 2012-01-19 2013-08-01 Ushio Inc ワークの貼り合わせ方法およびタッチパネル
WO2013108739A1 (fr) * 2012-01-19 2013-07-25 ウシオ電機株式会社 Procédé de liaison de pièces à usiner, et panneau tactile
WO2013175807A1 (fr) * 2012-05-22 2013-11-28 ウシオ電機株式会社 Procédé de stratification de pièces et écran tactile
JP2015051542A (ja) * 2013-09-05 2015-03-19 独立行政法人物質・材料研究機構 接合方法、及び接合装置
EP3488998A4 (fr) * 2016-07-15 2020-03-11 Ushio Denki Kabushiki Kaisha Procédé de liaison de substrats et procédé de fabrication de micropuce
WO2019221288A1 (fr) * 2018-05-18 2019-11-21 国立研究開発法人物質・材料研究機構 Procédé de fabrication d'un article en couches, article en couches et dispositif de siège de toilettes chauffé
JPWO2019221288A1 (ja) * 2018-05-18 2021-02-25 国立研究開発法人物質・材料研究機構 積層体の製造方法、積層体、及び、暖房便座装置
JP7018223B2 (ja) 2018-05-18 2022-02-10 国立研究開発法人物質・材料研究機構 積層体の製造方法、積層体、及び、暖房便座装置
WO2023234414A1 (fr) * 2022-06-02 2023-12-07 センエンジニアリング株式会社 Procédé de liaison de substrats contenant des polymères sur des surfaces de ceux-ci, appareil de liaison et stratifié

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