JP2012086411A - 熱圧着方法及び熱圧着装置 - Google Patents
熱圧着方法及び熱圧着装置 Download PDFInfo
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- JP2012086411A JP2012086411A JP2010233935A JP2010233935A JP2012086411A JP 2012086411 A JP2012086411 A JP 2012086411A JP 2010233935 A JP2010233935 A JP 2010233935A JP 2010233935 A JP2010233935 A JP 2010233935A JP 2012086411 A JP2012086411 A JP 2012086411A
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- thermocompression bonding
- chip component
- chip
- heating
- resin member
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
- B29C65/1412—Infrared [IR] radiation
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- B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/72—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by combined operations or combined techniques, e.g. welding and stitching
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- B29C66/01—General aspects dealing with the joint area or with the area to be joined
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- B29C66/0242—Heating, or preheating, e.g. drying
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
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- B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
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- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
- B29K2995/0026—Transparent
- B29K2995/0027—Transparent for light outside the visible spectrum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/05—Microfluidics
- B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
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- B81C2203/033—Thermal bonding
- B81C2203/037—Thermal bonding techniques not provided for in B81C2203/035 - B81C2203/036
Abstract
【解決手段】赤外線照射手段を用いて樹脂部材を予備加熱する工程と、加熱及び加圧手段を用いて樹脂部材を熱圧着する工程とにより熱圧着を行う。熱圧着装置は、赤外線照射手段を有する予備加熱部と、加熱手段及び加圧手段を有する熱圧着部と、予備加熱状態を保持したまま予備加熱部から熱圧着部に樹脂部材を搬送する搬送手段を備える。
【選択図】図1
Description
また、上述の熱圧着方法では、樹脂部材の反りの低減、及び、熱圧着時間の短縮のため、ベアチップを支持するバックアップテーブルを予熱する方法がとられている。バックアップテーブルを予め加熱しておくことにより、バックアップテーブル上に載せたベアチップを、熱圧着前に予備加熱する。予備加熱により熱圧着時のベアチップの温度分布を均一化することができ、反りの発生を抑制することができる。
また、本発明の熱圧着装置は、赤外線照射手段を有する予備加熱部と、加熱手段及び加圧手段を有する熱圧着部と、予備加熱状態を保持したまま予備加熱部から熱圧着部に樹脂部材を搬送する搬送手段を備える。
なお、説明は以下の順序で行う。
1.熱圧着方法の実施の形態
2.熱圧着装置の実施の形態
3.熱圧着方法の実施例
以下本発明の熱圧着方法の具体的な実施の形態について説明する。
図1に、本実施の形態の熱圧着方法を適用したマイクロ流体チップの製造方法のフロー図を示す。マイクロ流体チップは、熱圧着する樹脂部材として、マイクロメートルサイズの流路を基板上に形成した樹脂製のチップ部品を用いる。樹脂製のマイクロ流体チップは、予め流路となる溝が形成された基板となるチップ部品に、蓋となるチップ部品を接合して形成される。この基板と蓋との接合に、本実施の形態の熱圧着方法を適用する。
マイクロ流体チップの製造工程は、チップ部品形成(ステップS1)、表面処理(ステップS2)、予備加熱(ステップS3)、熱圧着(ステップS4)、及び、検査(流路検査・欠陥検査)(ステップS5)とからなる。
ステップS2における表面処理は、チップ部品を接合する前に、チップ部品の接合面の洗浄及び表面改質を行う。
ステップS3における予備加熱は、熱圧着時の加熱時間の短縮のために、赤外線ランプヒータ(IRヒータ)を用いて、熱圧着の前処理工程として加熱を行う。
ステップS4における熱圧着は、チップ部品の接合面同士を接触させた状態で加熱及び加圧し、部品同士を熱圧着により接合する。
ステップS4における検査では、熱圧着により形成されたマイクロ流体チップの流路、形状等に欠陥の有無を判断する。
以下、上述の各工程について説明する。
チップ部品には、射出成形又はフィルム押し出し成形により作製され樹脂部材を用いる。
まず、マイクロ流体チップに用いるチップ部品に、流路等の細部形状を成形するためのスタンパを作製する。マイクロ流体チップの製造に使用するスタンパは、例えば、ガラス基板等を原盤として、電気化学的鋳造法(Ni電鋳法)により作製する。また、半導体の製造技術を応用することによってガラス基板やシリコン基板等からスタンパを製造する。
次に、作製したスタンパを用いて、射出成形等により形成された樹脂部材に、マイクロ流体チップ用の微小流路を形成する。
樹脂の材料によって赤外線透過率に波長依存性がある。このため、樹脂部材の赤外線透過率は、850nm以上2500nm以下の波長域において、吸収ピーク以外で80%以上100%未満、好ましく85%以上95%未満であることが好ましい。また、吸収ピークにおいて、赤外線透過率が40%以上100%未満、好ましくは50%以上95%未満であることが好ましい。
吸収率が高いと、照射面(表面)側と照射面の反対面(裏面)側とで、赤外線の照射量が大きく変わるため、全体を均一に照射することができない。従って、表面側と裏面側とで加熱に差が発生し、反りの発生原因となる。
赤外線透過率が100%に近く樹脂自体の赤外線吸収率が低い場合であっても、IRヒータの出力を上げ、樹脂に照射する赤外線量を増やすことにより速やかな加熱を行うことができる。
また、樹脂材料としては、マイクロ流体チップを用いた試験目視による評価が可能な程度に、可視光に対して透過率が高いことが好ましい。
チップ部品の熱圧着面を表面処理する。表面処理には、例えば、有機溶剤等の薬剤を用いる。また、プラズマ放電によりチップ部品の表面改質を行う。
有機溶剤を用いて表面を洗うことにより、チップ部品の表面を軟化(膨潤)させる。これにより、熱圧着時の樹脂の接着性を向上させる。或いは、プラズマ放電によるチップ部品の接着面の表面改質により、熱圧着時の接着性を向上させる。
薬剤による表面処理には、エタノール等の低級アルコール、酢酸ブチル等のエステルを含む有機溶剤を用いる。
なお、この表面処理工程は、マイクロ流体チップの密着性等を考慮し、必要に応じて行う。表面処理工程を行わずに、チップ部品同士を熱圧着させてマイクロ流体チップを製造することも可能である。
赤外線ランプヒータ(IRヒータ)を用いて、上述のチップ部品の予備加熱を行う。
熱圧着に用いるチップ部品は、上述のように赤外線に対して透過率が高い。このため、IRヒータからの赤外光が、チップ部品全体に対してほぼ均一に照射される。この均一な照射によってチップ部品内部に均一な温度上昇がおこる。ここで、IRヒータの照射面をチップ部品の表面とし、IRヒータの照射面の反対面をチップ部品の裏面とすると、樹脂の表面側温度、裏面側温度、及び、チップ部品全体の平均温度はほぼ同じになる。このため、予備加熱時にチップ部品内での温度差を抑制することができ、反りの発生を抑えることができる。
予備加熱でのチップ部品の加熱温度が高いほど、熱圧着時間を短縮できる。これは、チップ部品を熱圧着時の温度に対して近い温度まで加熱しておくことにより、熱圧着の際にチップ部品が圧着温度まで到達する時間が短くなるためである。
透明な樹脂からなるチップ部品を充分に加熱することができればIRヒータの種類、出力等は特に限定することなく使用することができる。
チップ部品を熱圧着(拡散接合)して微小流路を内部に形成する。圧着条件が適当でない場合、チップ部品の接合不良の発生や、微小流路が潰れて消失することがある。
マイクロ流体チップの製造では、試験サンプルへの混入を防ぐため接着剤等の接合剤を使用しない。チップ部品同士の接合は、接合面を直接接触させて行う。
熱圧着は、上下の圧着ヘッド等からなる熱圧着部にチップ部品を組み合わせた状態で保持し、この圧着ヘッドによりチップ部品を上下から加圧する。そして、圧力を保ったまま昇温し、熱圧着(拡散接合)を行う。さらに、加圧した状態でチップ部品を冷却した後、上下の圧着ヘッドを解放してチップ部品を減圧する。
熱圧着により、チップ部品が組み合わされてマイクロ流体チップが形成される。
チップ部品に加圧を開始する(10秒)。所定の圧力に達した状態(13秒)で保持する。図2の場合には、13kN程度に加圧している。
加圧開始後、チップ部品の加熱を開始するする(27秒)。チップ部品は予備加熱により85℃程度まで加熱されている。熱圧着の加熱では、荷重たわみ点からガラス転移点までの間を熱圧着温度に設定する。図2の場合には、熱圧着温度を125℃程度に設定して加熱している。加熱により徐々に温度が上昇し、所定の熱圧着温度に達した状態で、数秒間(82〜105秒)保持する。図2の場合には、設定温度での保持時間が23秒である。予備加熱を行うことにより、加熱時間の短縮が可能である。特に、所定の熱圧着温度に達した状態での保持時間を短縮することができる。
所定の温度及び時間でチップ部品を保持した後、上下圧着ヘッドの圧力を維持したまま冷却する(105秒以降)。そして、温度が充分に低下した後、加圧を停止し(123秒)、熱圧着部からチップ部品を開放する。
融点以上又はガラス転移点以上に加熱すると、チップ部品に形成されている微小流路の変形や消失の可能性がある。さらに、チップ部品同士の接合強度や接合時間等を考慮すると、荷重たわみ温度付近以上に加熱する必要がある。例えば、チップ部品材料の荷重たわみ点付近からガラス転位点までが目安となる。チップ部品に形成された微小流路の形状の安定性等を考慮すると、樹脂の荷重たわみ温度±5℃に加熱することが好ましく、さらに荷重たわみ温度±2℃に加熱することが好ましい。
チップ部品を熱圧着して形成したマイクロ流体チップに対し、検査を行う。検査は、複数の検査項目について適合の判定をする。例えば、汎用のレーザー変位センサを使用して、熱圧着後のマイクロ流体チップの内部に形成された微小流路の寸法を測定し、測定値が規定範囲内かを判定する。また、画像処理装置を用いて、マイクロ流体チップの欠陥の有無を判断する。
検査で異常の見つかったものは、正規品から分離され、廃棄処理等される。また、検査を通過したマイクロ流体チップには、必要に応じて滅菌処理や梱包等を行う。
図3に熱圧着装置の実施の形態を示す。図3に示す熱圧着装置は、上述の製造工程によりマイクロ流体チップを製造するための装置である。
マイクロ流体チップの製造装置は、チップ部品供給排出部11、表面処理部12、圧着部13、検査部14、及び、各構成間にチップ部品又はマイクロ流体チップを搬送する搬送手段を備える。チップ部品供給排出部11は、チップ部品供給部11Aと、チップ部品排出部11Bとからなる。圧着部13は、予備加熱部13Aと熱圧着部13Bとからなる。検査部14は、流路検査部14Aと欠陥検査部14Bとからなる。
表面処理装置において、チップ部品の熱圧着面をプラズマ放電、又は、有機溶剤に曝して、チップ部品の表面処理を行う。表面処理後のチップ部品は、搬送手段により表面処理部12から圧着部13の予備加熱部13Aに搬出される。
以下、実施例及び比較例により本発明を具体的に説明するが、本発明は、下記の実施例に限定されるものではない。下記の実施例及び比較例では、マイクロ流体チップの製造方法において、予備加熱によるチップ部品の温度と反り量について測定及び評価を行う。
図4に、赤外線ランプヒータ(IRヒータ)を用いた加熱によりチップ部品に発生する反り量の測定方法を示す。
図4に示すように、支持部23上にチップ部品21の端部が接するように載せ、チップ部品21の上方からIRヒータ22により加熱した。チップ部品21は、25×75mm、厚さ1mmの大きさのシクロオレフィンポリマー(日本ゼオン社製のZeonex(登録商標)480)を用いた。また、IRヒータ22の出力は1200wとし、IRヒータ22からチップ部品21の表面21Aまでの距離は80mmとした。
チップ部品21の加熱は、室温(約25℃)から約70℃まで行った。
以上の方法を用いて、チップ部品21の裏面21B側の温度と、チップ部品21の反り量を測定した。
図5A,Bに、実施例で使用するZeonex480の光線透過率[%]を示す。また、図5には、Zeonex480と一緒に、チップ部品として適用可能な樹脂の一例として、ZeonexE48R、Zeonex330R(共に日本ゼオン社製のシクロオレフィンポリマー)、ポリカーボネート樹脂(PC)、及び、ポリメチルメタクリレート樹脂(PMMA)の光線透過率[%]を示す。さらに、図6に一般的なIRヒータの代表特性として分光放射強度を示す。
そして、図5Bに示すように、Zeonex480、ZeonexE48R、及び、Zeonex330Rのシクロオレフィンポリマーは、1000nm以上の赤外光域において、1200nm付近と1400nm付近において吸収ピークを有する。1200nm付近の吸収ピークにおいて、上記シクロオレフィンポリマーは、透過率が90%から50%程度に低下する。また、1400nm付近の吸収ピークにおいて、上記シクロオレフィンポリマーは、透過率が90%から60%程度に低下する。
また、図6に示すように、IRヒータは、1200nm付近をピークになだらかに強度が低下する波長分布を有する。樹脂の吸収ピークの波長域では、照射面側での吸収が大きく、裏面側まで照射される赤外光の強度が低下し、均一な照射とはならないが、吸収ピーク以外の波長においても充分な赤外光を照射しているため、チップ部品に対して均一な照射が可能である。
図7に、熱板を用いた加熱によりチップ部品に発生する反り量の測定方法を示す。
図7に示すように、熱板24上にチップ部品21を載せ、チップ部品21の反り量を測定した。熱板24の表面温度は64℃とした。また、チップ部品21は、実施例と同じく、25×75mm、厚さ1mmの大きさの日本ゼオン社製のZeonex480を用いた。なお、図7において、チップ部品21の熱板24に接触する面を表面21Aとし、熱板24に接触しない面を裏面21Bとする。
以上の方法により測定した実施例のチップ部品21の反り量、及び、チップ部品21の裏面21B側の温度と、予備加熱時間との関係を図8に示す。また、比較例のチップ部品21の反り量、及び、チップ部品21の裏面21B側の温度と、予備加熱時間との関係を図9に示す。
このように、IRヒータを用いてチップ部品を加熱することにより、速やかに裏面側まで加熱することができる。さらに、短時間で所定温度まで加熱しても、反りの発生量が小さい。このため、IRヒータを用いた予備加熱では、チップ部品を均一に、且つ、短時間で加熱することができた。
これに対し、実施例のようにIRランプヒータを用いて予備加熱を行うことにより、短時間での予備加熱が可能であり、且つ、反りの発生を抑制することができる。
例えば、チップ部品が赤外光に対して吸収が少なく、全体を均一に照射することができ、赤外光の照射により加熱が可能な樹脂の熱圧着(拡散接合)であれば適用可能である。
また、上述の実施の形態では、赤外線ランプヒータを用いて樹脂の加熱を行っているが、赤外線の照射により樹脂を加熱可能な構成であれば、赤外線照射手段については特に限定することなく使用可能である。赤外線を照射する手段において、必要な強度の赤外線が含まれていれば、紫外及び可視光が赤外線と同時に射出されていてもよい。
Claims (6)
- 赤外線照射手段を用いて樹脂部材を予備加熱する工程と、
加熱及び加圧手段を用いて前記樹脂部材を熱圧着する工程と、
を有する
熱圧着方法。 - 前記予備加熱において、前記樹脂部材を荷重たわみ温度以下に加熱する請求項1に記載の熱圧着方法。
- 前記樹脂部材として、吸収ピーク波長域以外での赤外線透過率が80%以上100%未満である請求項1に記載の熱圧着方法。
- 前記樹脂部材として、マイクロ流体チップ製造用のチップ部品を用いる請求項1に記載の熱圧着方法。
- 前記熱圧着において、前記樹脂部材を融点又はガラス転移点未満に加熱する請求項1に記載の熱圧着方法。
- 赤外線照射手段を有する予備加熱部と、
加熱手段及び加圧手段を有する熱圧着部と、
予備加熱状態を保持したまま前記予備加熱部から前記熱圧着部に樹脂部材を搬送する搬送手段を備える
熱圧着装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2010233935A JP2012086411A (ja) | 2010-10-18 | 2010-10-18 | 熱圧着方法及び熱圧着装置 |
EP11182722.6A EP2441518B1 (en) | 2010-10-18 | 2011-09-26 | Method and device for thermocompression bonding |
US13/270,605 US8691039B2 (en) | 2010-10-18 | 2011-10-11 | Method and device for thermocompression bonding |
US14/245,566 US9956722B2 (en) | 2010-10-18 | 2014-04-04 | Method and device for thermocompression bonding |
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JP2012206026A (ja) * | 2011-03-30 | 2012-10-25 | Sumitomo Bakelite Co Ltd | マイクロ流路デバイスおよびマイクロ流路デバイスの製造方法 |
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JP2012086411A (ja) | 2010-10-18 | 2012-05-10 | Sony Corp | 熱圧着方法及び熱圧着装置 |
CN108162413A (zh) * | 2017-12-27 | 2018-06-15 | 北京百奥芯科技有限公司 | 一种利用溶剂键合制备聚合物微流控芯片的方法 |
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US8691039B2 (en) | 2014-04-08 |
US20140216659A1 (en) | 2014-08-07 |
EP2441518B1 (en) | 2020-03-18 |
US20120205040A1 (en) | 2012-08-16 |
EP2441518A3 (en) | 2013-12-04 |
EP2441518A2 (en) | 2012-04-18 |
US9956722B2 (en) | 2018-05-01 |
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