CN101482698B - 抗蚀剂组合物 - Google Patents

抗蚀剂组合物 Download PDF

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Publication number
CN101482698B
CN101482698B CN2008100022560A CN200810002256A CN101482698B CN 101482698 B CN101482698 B CN 101482698B CN 2008100022560 A CN2008100022560 A CN 2008100022560A CN 200810002256 A CN200810002256 A CN 200810002256A CN 101482698 B CN101482698 B CN 101482698B
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CN
China
Prior art keywords
esters
sour
acid
group
butoxy
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN2008100022560A
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English (en)
Chinese (zh)
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CN101482698A (zh
Inventor
堀口明
赤井泰之
片山彻
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Daicel Chemical Industries Ltd
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Publication date
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Publication of CN101482698A publication Critical patent/CN101482698A/zh
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Publication of CN101482698B publication Critical patent/CN101482698B/zh
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN2008100022560A 2007-01-18 2008-01-08 抗蚀剂组合物 Expired - Fee Related CN101482698B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007009258A JP5148882B2 (ja) 2007-01-18 2007-01-18 レジスト組成物
JP009258/07 2007-01-18

Publications (2)

Publication Number Publication Date
CN101482698A CN101482698A (zh) 2009-07-15
CN101482698B true CN101482698B (zh) 2012-07-04

Family

ID=39703116

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008100022560A Expired - Fee Related CN101482698B (zh) 2007-01-18 2008-01-08 抗蚀剂组合物

Country Status (4)

Country Link
JP (1) JP5148882B2 (ja)
KR (1) KR101405552B1 (ja)
CN (1) CN101482698B (ja)
TW (1) TWI417652B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2774071A1 (en) * 2009-09-15 2011-03-24 Ube Industries, Ltd. Nonaqueous electrolyte solution and electrochemical element using same
KR101737567B1 (ko) * 2010-11-19 2017-05-18 주식회사 동진쎄미켐 포토레지스트 조성물
JP6420634B2 (ja) * 2014-03-26 2018-11-07 株式会社Adeka レジスト組成物、カラーレジスト組成物及び該組成物を用いたカラーフィルタ

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003330170A (ja) * 2002-05-16 2003-11-19 Sumitomo Chem Co Ltd 感放射線性樹脂組成物
JP2005195964A (ja) * 2004-01-08 2005-07-21 Fuji Photo Film Co Ltd 水分散型光重合性樹脂組成物及びそれを用いたドライフィルムレジスト
CN1732409A (zh) * 2002-12-26 2006-02-08 东京应化工业株式会社 正性抗蚀剂组合物和形成抗蚀剂图案的方法
CN1813221A (zh) * 2003-07-08 2006-08-02 昭和电工株式会社 抗蚀剂组合物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3245207B2 (ja) * 1992-01-29 2002-01-07 ジェイエスアール株式会社 感放射線性樹脂組成物
JP3291872B2 (ja) * 1993-10-28 2002-06-17 ジェイエスアール株式会社 化学増幅型感放射線性樹脂組成物
JP3948506B2 (ja) * 1999-11-11 2007-07-25 富士フイルム株式会社 ポジ型フォトレジスト組成物
JP2002014470A (ja) * 2000-06-28 2002-01-18 Fuji Photo Film Co Ltd 電子線又はｘ線用ネガ型レジスト組成物
JP4365235B2 (ja) * 2004-02-20 2009-11-18 富士フイルム株式会社 液浸露光用レジスト組成物及びそれを用いたパターン形成方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003330170A (ja) * 2002-05-16 2003-11-19 Sumitomo Chem Co Ltd 感放射線性樹脂組成物
CN1732409A (zh) * 2002-12-26 2006-02-08 东京应化工业株式会社 正性抗蚀剂组合物和形成抗蚀剂图案的方法
CN1813221A (zh) * 2003-07-08 2006-08-02 昭和电工株式会社 抗蚀剂组合物
JP2005195964A (ja) * 2004-01-08 2005-07-21 Fuji Photo Film Co Ltd 水分散型光重合性樹脂組成物及びそれを用いたドライフィルムレジスト

Also Published As

Publication number Publication date
TW200844654A (en) 2008-11-16
JP5148882B2 (ja) 2013-02-20
JP2008176046A (ja) 2008-07-31
KR20080068565A (ko) 2008-07-23
KR101405552B1 (ko) 2014-06-10
TWI417652B (zh) 2013-12-01
CN101482698A (zh) 2009-07-15

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C06 Publication
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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: Osaka Japan

Patentee after: Daicel Chem

Address before: Osaka Japan

Patentee before: Daicel Chemical Industries Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120704

Termination date: 20200108

CF01 Termination of patent right due to non-payment of annual fee