CN101447276B - 电子器件 - Google Patents

电子器件 Download PDF

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Publication number
CN101447276B
CN101447276B CN2008101497904A CN200810149790A CN101447276B CN 101447276 B CN101447276 B CN 101447276B CN 2008101497904 A CN2008101497904 A CN 2008101497904A CN 200810149790 A CN200810149790 A CN 200810149790A CN 101447276 B CN101447276 B CN 101447276B
Authority
CN
China
Prior art keywords
coil
conductive pattern
inductor
electronic device
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008101497904A
Other languages
English (en)
Chinese (zh)
Other versions
CN101447276A (zh
Inventor
上田知史
高桥岳雄
松本刚
横山刚
宓晓宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Fujitsu Ltd
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd, Taiyo Yuden Co Ltd filed Critical Fujitsu Ltd
Publication of CN101447276A publication Critical patent/CN101447276A/zh
Application granted granted Critical
Publication of CN101447276B publication Critical patent/CN101447276B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/06—Frequency selective two-port networks including resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
    • H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0391—Using different types of conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Structure Of Printed Boards (AREA)
  • Semiconductor Integrated Circuits (AREA)
CN2008101497904A 2007-09-28 2008-09-27 电子器件 Expired - Fee Related CN101447276B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007254661A JP5090117B2 (ja) 2007-09-28 2007-09-28 電子部品
JP2007-254661 2007-09-28
JP2007254661 2007-09-28

Publications (2)

Publication Number Publication Date
CN101447276A CN101447276A (zh) 2009-06-03
CN101447276B true CN101447276B (zh) 2012-06-06

Family

ID=40661215

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008101497904A Expired - Fee Related CN101447276B (zh) 2007-09-28 2008-09-27 电子器件

Country Status (4)

Country Link
US (1) US8259459B2 (enExample)
JP (1) JP5090117B2 (enExample)
KR (1) KR101150638B1 (enExample)
CN (1) CN101447276B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7927975B2 (en) 2009-02-04 2011-04-19 Micron Technology, Inc. Semiconductor material manufacture
KR101366992B1 (ko) * 2009-07-27 2014-02-24 가부시키가이샤 도요다 지도숏키 배선 기판 및 배선 기판의 제조 방법
FR2961345A1 (fr) 2010-06-10 2011-12-16 St Microelectronics Tours Sas Circuit integre passif
CN103094695B (zh) * 2011-10-31 2016-05-04 深圳光启高等理工研究院 一种超材料的封装方法
JP2017063146A (ja) * 2015-09-25 2017-03-30 パナソニックＩｐマネジメント株式会社 トランス装置およびその製造方法
CN105679711A (zh) * 2016-01-15 2016-06-15 上海华虹宏力半导体制造有限公司 射频工艺中减小带电感器件的芯片面积的方法及应用
JP6593209B2 (ja) * 2016-02-05 2019-10-23 株式会社村田製作所 電子部品
JP6889399B2 (ja) * 2017-08-08 2021-06-18 大日本印刷株式会社 貫通電極基板
US11605492B2 (en) * 2017-11-13 2023-03-14 Tdk Corporation Coil component
JP7266996B2 (ja) 2018-11-20 2023-05-01 太陽誘電株式会社 インダクタ、フィルタおよびマルチプレクサ
KR102671967B1 (ko) * 2019-03-05 2024-06-05 삼성전기주식회사 코일 부품
JP6634184B1 (ja) * 2019-09-30 2020-01-22 株式会社フジクラ フレキシブルプリント配線板及びその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1476636A (zh) * 2001-10-15 2004-02-18 ���µ�����ҵ��ʽ���� 模块部件

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JPS6133623Y2 (enExample) * 1980-03-19 1986-10-01
JPH04228135A (ja) * 1990-12-26 1992-08-18 Sony Corp 磁界変調型光磁気ヘッドの組立方法
US5420757A (en) * 1993-02-11 1995-05-30 Indala Corporation Method of producing a radio frequency transponder with a molded environmentally sealed package
JP3177954B2 (ja) * 1997-11-20 2001-06-18 日本電気株式会社 半導体装置およびその製造方法
KR20000011585A (ko) 1998-07-28 2000-02-25 윤덕용 반도체소자및그제조방법
JP2000058329A (ja) * 1998-08-17 2000-02-25 Fuji Elelctrochem Co Ltd 積層インダクタ並びにその整列測定装置および整列測定方法
JP2001044105A (ja) 1999-07-28 2001-02-16 Hitachi Ltd 半導体装置の製造方法
JP4619551B2 (ja) * 2000-11-30 2011-01-26 株式会社トッパンＴｄｋレーベル 書き換え可能な情報表示部を有する非接触ｉｃカード
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Non-Patent Citations (1)

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Also Published As

Publication number Publication date
KR101150638B1 (ko) 2012-05-25
JP5090117B2 (ja) 2012-12-05
CN101447276A (zh) 2009-06-03
KR20090033115A (ko) 2009-04-01
US8259459B2 (en) 2012-09-04
JP2009088162A (ja) 2009-04-23
US20090237894A1 (en) 2009-09-24

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C06 Publication
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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: TAIYO YUDEN CO., LTD.

Free format text: FORMER OWNER: FUJITSU MEDIA DEVICES LTD

Effective date: 20101228

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

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Applicant after: TAIYO YUDEN Co.,Ltd.

Co-applicant after: FUJITSU Ltd.

Address before: Kanagawa

Applicant before: Fujitsu Media Devices Ltd.

Co-applicant before: Fujitsu Ltd.

C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20180228

Address after: Tokyo, Japan

Patentee after: TAIYO YUDEN Co.,Ltd.

Address before: Tokyo, Japan

Co-patentee before: Fujitsu Ltd.

Patentee before: TAIYO YUDEN Co.,Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120606