KR101150638B1 - 전자 부품 - Google Patents

전자 부품 Download PDF

Info

Publication number
KR101150638B1
KR101150638B1 KR1020080094707A KR20080094707A KR101150638B1 KR 101150638 B1 KR101150638 B1 KR 101150638B1 KR 1020080094707 A KR1020080094707 A KR 1020080094707A KR 20080094707 A KR20080094707 A KR 20080094707A KR 101150638 B1 KR101150638 B1 KR 101150638B1
Authority
KR
South Korea
Prior art keywords
coil
conductive pattern
inductor
substrate
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020080094707A
Other languages
English (en)
Korean (ko)
Other versions
KR20090033115A (ko
Inventor
사또시 우에다
다께오 다까하시
쯔요시 마쯔모또
쯔요시 요꼬야마
시아오유 미
Original Assignee
후지쯔 가부시끼가이샤
다이요 유덴 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지쯔 가부시끼가이샤, 다이요 유덴 가부시키가이샤 filed Critical 후지쯔 가부시끼가이샤
Publication of KR20090033115A publication Critical patent/KR20090033115A/ko
Application granted granted Critical
Publication of KR101150638B1 publication Critical patent/KR101150638B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/06—Frequency selective two-port networks including resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
    • H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/501—Inductive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0391—Using different types of conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/301—Marks applied to devices, e.g. for alignment or identification for alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Structure Of Printed Boards (AREA)
  • Semiconductor Integrated Circuits (AREA)
KR1020080094707A 2007-09-28 2008-09-26 전자 부품 Expired - Fee Related KR101150638B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007254661A JP5090117B2 (ja) 2007-09-28 2007-09-28 電子部品
JPJP-P-2007-00254661 2007-09-28

Publications (2)

Publication Number Publication Date
KR20090033115A KR20090033115A (ko) 2009-04-01
KR101150638B1 true KR101150638B1 (ko) 2012-05-25

Family

ID=40661215

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080094707A Expired - Fee Related KR101150638B1 (ko) 2007-09-28 2008-09-26 전자 부품

Country Status (4)

Country Link
US (1) US8259459B2 (enExample)
JP (1) JP5090117B2 (enExample)
KR (1) KR101150638B1 (enExample)
CN (1) CN101447276B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7927975B2 (en) 2009-02-04 2011-04-19 Micron Technology, Inc. Semiconductor material manufacture
WO2011013673A1 (ja) * 2009-07-27 2011-02-03 株式会社ティーアイビーシー 配線基板および配線基板の製造方法
FR2961345A1 (fr) 2010-06-10 2011-12-16 St Microelectronics Tours Sas Circuit integre passif
CN103094695B (zh) * 2011-10-31 2016-05-04 深圳光启高等理工研究院 一种超材料的封装方法
JP2017063146A (ja) * 2015-09-25 2017-03-30 パナソニックＩｐマネジメント株式会社 トランス装置およびその製造方法
CN105679711A (zh) * 2016-01-15 2016-06-15 上海华虹宏力半导体制造有限公司 射频工艺中减小带电感器件的芯片面积的方法及应用
JP6593209B2 (ja) * 2016-02-05 2019-10-23 株式会社村田製作所 電子部品
JP6889399B2 (ja) * 2017-08-08 2021-06-18 大日本印刷株式会社 貫通電極基板
US11605492B2 (en) * 2017-11-13 2023-03-14 Tdk Corporation Coil component
JP7266996B2 (ja) 2018-11-20 2023-05-01 太陽誘電株式会社 インダクタ、フィルタおよびマルチプレクサ
KR102671967B1 (ko) * 2019-03-05 2024-06-05 삼성전기주식회사 코일 부품
JP6634184B1 (ja) * 2019-09-30 2020-01-22 株式会社フジクラ フレキシブルプリント配線板及びその製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11154730A (ja) * 1997-11-20 1999-06-08 Nec Corp 半導体装置およびその製造方法
JP2001044105A (ja) * 1999-07-28 2001-02-16 Hitachi Ltd 半導体装置の製造方法
JP2001326517A (ja) * 2000-05-15 2001-11-22 Dainippon Printing Co Ltd アンテナシートおよび非接触式データキャリア
US20030184495A1 (en) 2002-04-01 2003-10-02 Isao Tomon Non-contact information communication apparatus

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6133623Y2 (enExample) * 1980-03-19 1986-10-01
JPH04228135A (ja) * 1990-12-26 1992-08-18 Sony Corp 磁界変調型光磁気ヘッドの組立方法
US5420757A (en) * 1993-02-11 1995-05-30 Indala Corporation Method of producing a radio frequency transponder with a molded environmentally sealed package
KR20000011585A (ko) * 1998-07-28 2000-02-25 윤덕용 반도체소자및그제조방법
JP2000058329A (ja) * 1998-08-17 2000-02-25 Fuji Elelctrochem Co Ltd 積層インダクタ並びにその整列測定装置および整列測定方法
JP4619551B2 (ja) * 2000-11-30 2011-01-26 株式会社トッパンＴｄｋレーベル 書き換え可能な情報表示部を有する非接触ｉｃカード
US6304232B1 (en) * 2000-02-24 2001-10-16 The Goodyear Tire & Rubber Company Circuit module
JP4641096B2 (ja) * 2000-12-07 2011-03-02 大日本印刷株式会社 非接触式データキャリア装置とブースターアンテナ部用配線部材
JP2003124429A (ja) * 2001-10-15 2003-04-25 Matsushita Electric Ind Co Ltd モジュール部品
JP3792635B2 (ja) * 2001-12-14 2006-07-05 富士通株式会社 電子装置
JP3881949B2 (ja) * 2002-10-17 2007-02-14 東洋アルミニウム株式会社 アンテナ回路構成体およびそれを備えた機能カードならびにアンテナ回路構成体の製造方法
JP4367013B2 (ja) * 2002-10-28 2009-11-18 セイコーエプソン株式会社 非接触通信媒体
JP2005045161A (ja) * 2003-07-25 2005-02-17 Toppan Forms Co Ltd アンテナシート
JP4762531B2 (ja) 2004-11-30 2011-08-31 太陽誘電株式会社 電子部品及びその製造方法
JP4707056B2 (ja) * 2005-08-31 2011-06-22 富士通株式会社 集積型電子部品および集積型電子部品製造方法
JP2007173759A (ja) * 2005-11-25 2007-07-05 Seiko Epson Corp 高周波モジュール及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11154730A (ja) * 1997-11-20 1999-06-08 Nec Corp 半導体装置およびその製造方法
JP2001044105A (ja) * 1999-07-28 2001-02-16 Hitachi Ltd 半導体装置の製造方法
JP2001326517A (ja) * 2000-05-15 2001-11-22 Dainippon Printing Co Ltd アンテナシートおよび非接触式データキャリア
US20030184495A1 (en) 2002-04-01 2003-10-02 Isao Tomon Non-contact information communication apparatus

Also Published As

Publication number Publication date
CN101447276B (zh) 2012-06-06
US8259459B2 (en) 2012-09-04
JP5090117B2 (ja) 2012-12-05
US20090237894A1 (en) 2009-09-24
CN101447276A (zh) 2009-06-03
KR20090033115A (ko) 2009-04-01
JP2009088162A (ja) 2009-04-23

Similar Documents

Publication Publication Date Title
KR101150638B1 (ko) 전자 부품
US7551054B2 (en) Electronic device and method of manufacturing the same
EP1760731B1 (en) Integrated electronic device
US7498919B2 (en) Thin film device
JP5090118B2 (ja) 電子部品
KR20160139968A (ko) 코일 전자부품
US20130271251A1 (en) Substrate-Less Electronic Component
KR20030054233A (ko) 무선통신 모듈용 마이크로 인덕터
US8018027B2 (en) Flip-bonded dual-substrate inductor, flip-bonded dual-substrate inductor, and integrated passive device including a flip-bonded dual-substrate inductor
CN113707423B (zh) 线圈组件
JPH1065476A (ja) Ｌｃローパスフィルタ
JP4675662B2 (ja) 半導体装置
JP5058770B2 (ja) 電子部品
WO2020209261A1 (ja) 非接触情報担体
JP2010268304A (ja) 樹脂多層デバイスおよびその製造方法
WO2023181806A1 (ja) 電子部品
JP2006108323A (ja) インダクタンス素子及びその製造方法
JP2007005702A (ja) 半導体装置およびその製造方法
JP2006228927A (ja) 半導体装置
CN101211689A (zh) 内藏电感组件及其制造方法

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R15-X000 Change to inventor requested

St.27 status event code: A-3-3-R10-R15-oth-X000

R16-X000 Change to inventor recorded

St.27 status event code: A-3-3-R10-R16-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R11-asn-PN2301

R19-X000 Request for party data change rejected

St.27 status event code: A-3-3-R10-R19-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

N231 Notification of change of applicant
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

J201 Request for trial against refusal decision
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PJ0201 Trial against decision of rejection

St.27 status event code: A-3-3-V10-V11-apl-PJ0201

PB0901 Examination by re-examination before a trial

St.27 status event code: A-6-3-E10-E12-rex-PB0901

B701 Decision to grant
PB0701 Decision of registration after re-examination before a trial

St.27 status event code: A-3-4-F10-F13-rex-PB0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20150416

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20160419

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20170420

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

FPAY Annual fee payment

Payment date: 20180503

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20250522

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

H13 Ip right lapsed

Free format text: ST27 STATUS EVENT CODE: N-4-6-H10-H13-OTH-PC1903 (AS PROVIDED BY THE NATIONAL OFFICE); TERMINATION CATEGORY : DEFAULT_OF_REGISTRATION_FEE

Effective date: 20250522

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20250522