CN101441992A - 半导体器件及其制造方法 - Google Patents

半导体器件及其制造方法 Download PDF

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Publication number
CN101441992A
CN101441992A CNA2008101809569A CN200810180956A CN101441992A CN 101441992 A CN101441992 A CN 101441992A CN A2008101809569 A CNA2008101809569 A CN A2008101809569A CN 200810180956 A CN200810180956 A CN 200810180956A CN 101441992 A CN101441992 A CN 101441992A
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CN
China
Prior art keywords
semiconductor
semiconductor device
insulating barrier
forms
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2008101809569A
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English (en)
Chinese (zh)
Inventor
山野孝治
町田洋弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Co Ltd
Original Assignee
Shinko Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Co Ltd filed Critical Shinko Electric Co Ltd
Publication of CN101441992A publication Critical patent/CN101441992A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/129—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed forming a chip-scale package [CSP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/147—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being multilayered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Dicing (AREA)
  • Semiconductor Integrated Circuits (AREA)
CNA2008101809569A 2007-11-20 2008-11-20 半导体器件及其制造方法 Pending CN101441992A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007300790 2007-11-20
JP2007300790A JP5139039B2 (ja) 2007-11-20 2007-11-20 半導体装置及びその製造方法

Publications (1)

Publication Number Publication Date
CN101441992A true CN101441992A (zh) 2009-05-27

Family

ID=40298658

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2008101809569A Pending CN101441992A (zh) 2007-11-20 2008-11-20 半导体器件及其制造方法

Country Status (6)

Country Link
US (1) US7906833B2 (https=)
EP (1) EP2065928A3 (https=)
JP (1) JP5139039B2 (https=)
KR (1) KR20090052282A (https=)
CN (1) CN101441992A (https=)
TW (1) TW200931595A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109509725A (zh) * 2017-09-15 2019-03-22 东芝存储器株式会社 半导体装置
CN112542432A (zh) * 2019-09-20 2021-03-23 Nepes株式会社 半导体封装件及其制作方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4121542B1 (ja) * 2007-06-18 2008-07-23 新光電気工業株式会社 電子装置の製造方法
JP2012134270A (ja) * 2010-12-21 2012-07-12 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
US20130183823A1 (en) * 2012-01-18 2013-07-18 Chipbond Technology Corporation Bumping process
CN112885793B (zh) * 2021-03-12 2025-03-14 苏州晶方半导体科技股份有限公司 芯片封装结构及其制造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3129161B2 (ja) 1995-08-18 2001-01-29 松下電器産業株式会社 チップの実装装置および実装方法
US6707153B2 (en) * 2000-03-23 2004-03-16 Seiko Epson Corporation Semiconductor chip with plural resin layers on a surface thereof and method of manufacturing same
JP2002057252A (ja) * 2000-08-07 2002-02-22 Hitachi Ltd 半導体装置及びその製造方法
JP5070661B2 (ja) 2001-04-27 2012-11-14 パナソニック株式会社 半導体装置およびその製造方法
US6818475B2 (en) * 2001-10-22 2004-11-16 Wen-Kun Yang Wafer level package and the process of the same
JP3614828B2 (ja) 2002-04-05 2005-01-26 沖電気工業株式会社 チップサイズパッケージの製造方法
JP2004134709A (ja) * 2002-10-15 2004-04-30 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
JP2004193497A (ja) * 2002-12-13 2004-07-08 Nec Electronics Corp チップサイズパッケージおよびその製造方法
JP4322181B2 (ja) * 2004-07-29 2009-08-26 三洋電機株式会社 半導体装置の製造方法
JP3976043B2 (ja) * 2004-10-25 2007-09-12 セイコーエプソン株式会社 半導体装置及びその製造方法
KR100660868B1 (ko) * 2005-07-06 2006-12-26 삼성전자주식회사 칩의 배면이 몰딩된 반도체 패키지 및 그의 제조방법

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109509725A (zh) * 2017-09-15 2019-03-22 东芝存储器株式会社 半导体装置
CN109509725B (zh) * 2017-09-15 2022-10-14 铠侠股份有限公司 半导体装置
CN112542432A (zh) * 2019-09-20 2021-03-23 Nepes株式会社 半导体封装件及其制作方法
CN112542432B (zh) * 2019-09-20 2024-05-17 Nepes株式会社 半导体封装件及其制作方法

Also Published As

Publication number Publication date
US7906833B2 (en) 2011-03-15
JP5139039B2 (ja) 2013-02-06
KR20090052282A (ko) 2009-05-25
JP2009129982A (ja) 2009-06-11
US20090127665A1 (en) 2009-05-21
EP2065928A3 (en) 2011-01-26
TW200931595A (en) 2009-07-16
EP2065928A2 (en) 2009-06-03

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WD01 Invention patent application deemed withdrawn after publication

Open date: 20090527