CN101426875A - 粘合带、半导体封装件和电子设备 - Google Patents

粘合带、半导体封装件和电子设备 Download PDF

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Publication number
CN101426875A
CN101426875A CNA2007800146529A CN200780014652A CN101426875A CN 101426875 A CN101426875 A CN 101426875A CN A2007800146529 A CNA2007800146529 A CN A2007800146529A CN 200780014652 A CN200780014652 A CN 200780014652A CN 101426875 A CN101426875 A CN 101426875A
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China
Prior art keywords
adhesive tape
self adhesive
resin
epoxy
tape according
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Pending
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CNA2007800146529A
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English (en)
Inventor
桂山悟
山代智绘
宫本哲也
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Publication of CN101426875A publication Critical patent/CN101426875A/zh
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
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    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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Abstract

用于导电连接导电部件的粘合带，该粘合带包含树脂、焊料粉末、具有助焊活性的固化剂，其中焊料粉末以及具有助焊活性的固化剂包含在树脂中。

Description

粘合带、半导体封装件和电子设备
技术领域
[0001]
本发明涉及一种粘合带以及一种半导体封装件以及电子设备。
背景技术
[0002]
已知的用于连接导电部件(例如电极)的粘合带是一种含有焊料颗粒的粘合带(专利文献1)。专利文献1描述了一种包括焊料颗粒作为导电颗粒的各向异性的导电膜(ACF)。
[0003]
专利文献2描述了一种用含有导电颗粒和树脂组分的导电粘合剂连接端子的方法。根据该文献描述的方法，导电粘合剂被应用到端子之间，加热到高于导体颗粒的熔点但不能使树脂固化的温度，然后再固化树脂。该文献也描述了作为树脂，环氧树脂能够活化导电颗粒并且可在电极表面使用。该文献还描述了导电粘合剂可包含助焊剂。
[0004]
专利文献3描述了一种具有金属化图案的聚酰亚胺电路板，该电路板被焊料球、一种助焊剂(例如苹果酸)以及环氧树脂形成的混合物包覆。该文献还描述了在印刷电路板的金属图案上喷涂有苹果酸溶液，并在其外层覆有充满焊料球的环氧树脂膜，粘合料上同样喷涂有苹果酸溶液，然后将集成电路板以面朝下的方式设置。
专利文献1：日本公开专利NO.1986—276873
专利文献2：日本公开专利NO.2004—260131
专利文献3：日本公开专利NO.4—262890
发明内容
发明解决的技术问题
[0005]
然而，当使用专利文献1中所描述的包含焊料颗粒的粘合带时，无法在接合部一直实现低电阻，因此在连接的可靠性上还有改进的余地。
[0006]
而且，不仅限于那些含有焊料颗粒的粘合带，在ACF中，树脂的固化很难控制。也就是说，当树脂缓慢固化时，在电极间的导体颗粒被扩散得无法确保连接。另一方面，当树脂快速固化时，存在于导体颗粒和导电部件之间的树脂固化速度很快以致在导体颗粒和导电部件之间形成了绝缘层。
[0007]
一般地，在ACF中，导体颗粒是一种镀了Ni/Au的塑料芯，通过导体颗粒和导电材料之间的接触来实现在上下材料之间的导通。因此，周围树脂的热膨胀和收缩导致了导体颗粒与导电部件接触区域的波动，从而导致了连接电阻不稳定。
[0008]
专利文献2和3中所描述的导电粘合剂，粘合剂被应到电极和基板表面。因此，粘合过程是很麻烦的。而且，连接可靠性有进行改进的余地。
[0009]
考虑到以上情况，本发明提供了一种粘合带和一种具有很好的连接可靠性的半导体封装件。
解决问题的方法
[0010]
根据本发明，提供了一种电连接导电部件的粘合带，该粘合带包括
树脂
焊料粉末以及
具有助焊活性的固化剂
其中焊料粉末以及具有助焊活性的固化剂被包含在树脂中。
[0011]
本发明的粘合带中，焊料粉末以及具有助焊活性的固化剂被包含在树脂中。通过加热，树脂中的焊料粉末以自动对准(self-aligning)方式移动到导电部件的表面。
[0012]
进一步，在这个发明中，包含在树脂中的具有助焊活性的固化剂有效地移动到导电部件与焊料之间的界面，确保导电部件与焊料之间的导电连接。
[0013]
具有助焊活性的固化剂与焊料粉末混合起来使用。在背景技术中所描述的专利文献2中，环氧树脂本身具有表面活性。
[0014]
相反，在本发明中，在一个带状的粘合体中，具有助焊活性的固化剂包含在树脂中，因此与上面描述的结构相比较，在粘合过程中具有助焊活性的固化剂能够更加容易地移动到导电部件与焊料之间的界面。因此，根据本发明，可以在焊料粉末与导电部件之间形成可靠稳定的电连接。
[0015]
对于传统的ACF，如在发明解决的技术问题中所描述的那样，很难控制树脂的固化行为。相反，在本发明中，具有助焊活性的固化剂包含在树脂中，使得树脂的固化性能的可控性提高。此外，在本发明的粘合带中，由于自动对准作用，焊料颗粒集中到电极，从而形成稳定的金属连接。这是因为在本发明中，焊料粉末对所接触的金属区域表现出很好的浸润性并且集中到金属区域。
[0016]
除此之外，具有助焊活性的固化剂对于树脂具有反应性，因而除气作用较小并且因此避免了电子组件的污染。进一步，助焊活性剂不会作为离子杂质，因此可以避免腐蚀导电部件。
[0017]
因为在本发明中粘合材料为带状形式，所以不必将其涂布在待连接元件间的表面上。从而，简化了粘结工艺。
[0018]
任何前述的元件的组合或本发明在工艺、设备等的修饰后的表现在本发明中也同样有效。
[0019]
例如，根据本发明，提供了由上面所述的粘合带连接电子组件或电组件所形成的电子设备。
根据本发明，也提供了一种半导体封装件，包括
安装芯片的基板，以及
设置在安装芯片基板的一个表面上的第一和第二半导体芯片，
其中，第一和第二半导体芯片通过权利要求1所限定的粘合带而连接起来。
根据本发明，也提供了一种半导体封装件，包括
安装半导体芯片的第一基板以及
安装第一基板的第二基板
第一和第二基板通过权利要求1所限定的粘合带而连接起来。
本发明的优点
[0020]
如同上面所描述的，在本发明的粘合带中，焊料粉末以及具有助焊活性的固化剂包含在树脂中，所以能够改善导电部件间的连接可靠性。
附图说明
[0021]
通过后来合适的实施例及相应的附图，本发明的这些目的以及其它的目的、特点和优点会变得更加明了。
[0022]
[图1]图1描述了在一个实施例中一种用粘合带进行粘结的方法的截面图。
[图2]图2描述了在一个实施例中一种用粘合带进行粘结的方法的截面图。
[图3]图3描述了在一个实施例中一种用粘合带进行粘结的方法的截面图。
[图4]图4描述了在一个实施例中半导体封装件结构的截面图。
[图5]图5描述了在一个实施例中半导体封装件结构的截面图。
[图6]图6描述了在一个实施例中半导体封装件结构的截面图。
[图7]图7描述了在一个实施例中堆叠体结构的截面图。
[图8]图8描述了在一个实施例中堆叠体结构的截面图。
符号说明
[0023]
101：粘合带，103：焊料粉末，105：第三基板，107：第二基板，109：第一基板，111：焊料区域，113：第一电极，115：第二电极，117：通孔(via)，119：第三电极，121：第二电极，131：第二基料，132：树脂，133：第一基料，135：第二电极，137：第一电极，139：第二阻焊层，141：第一阻焊层，143：空隙，151：第一半导体芯片，153：第二半导体芯片，155：安装基板，157：基板，159：导线，161：凸电极(bump electrode)，163：密封树脂，165：凸电极，167：树脂，169：导线，以及171：导线。
本发明的最佳实施方式
[0024]
下面将参照附图描述本发明的实施方式。在所有附图中，由相同符号标记的同一部分不重复描述。
[0025]
本发明的粘合带形成了在导电部件间的导电连接，并且该粘合带包含树脂、焊料粉末以及具有助焊活性的固化剂。在这些组分之间，焊料粉末以及具有助焊活性的固化剂包含在树脂中。每一种组分将会具体的描述。
[0026]
树脂可以是，但不局限于，热塑性树脂、热固性树脂或者热塑性树脂与热固性树脂的混合物。其中，考虑到树脂的成膜性和熔融粘度，热塑性树脂与热固性树脂的混合物是比较合适的。
[0027]
热塑性树脂的实例包括，但不局限于，苯氧树脂、聚酯树脂、聚氨基酯树脂、聚酰亚胺树脂、硅氧烷改性的聚酰亚胺树脂、聚丁二烯、聚丙烯、苯乙烯-丁二烯-苯乙烯共聚物、苯乙烯-乙烯-丁烯-苯乙烯共聚物、聚缩醛树脂、聚乙烯基丁缩醛树脂、聚乙烯醇缩乙醛树脂、丁基橡胶、氯丁二烯橡胶、聚酰胺树脂、丙烯腈-丁二烯共聚物，丙烯腈-丁二烯-丙烯酸共聚物、丙烯腈-丁二烯-苯乙烯共聚物、聚乙烯乙酸酯、尼龙、丙烯酸酯橡胶(acrylicrubber)等等，这些树脂可以单独使用或者将两种或多种混合起来使用。
[0028]
这些热塑性树脂可以含有腈基、环氧基、羟基或者羧基，以此来达到改进与其它树脂的粘着性和相容性的目的，这样的树脂的一个实例是丙烯酸酯橡胶。
[0029]
热固性树脂的实例包括，但不局限于，环氧树脂、氧杂环丁烷树脂、酚醛树脂、(甲基)丙烯酸酯树脂、不饱和聚酯树脂、二芳基邻苯二甲酸酯树脂、马来酰亚胺树脂等等。在这些树脂当中，优选环氧树脂，它显示出优良的固化性能和改善的保存期限，其固化后的产品具有优秀的耐热性、防潮性、耐化学品性。
[0030]
在室温下，该环氧树脂可以是固态的或液体的环氧树脂。也可以是，在室温下，该环氧树脂包括固态的和液态的环氧树脂，这样的树脂进一步提高了树脂熔融行为(melting behavior)的设计自由度.
[0031]
室温下为固态的环氧树脂的实例是，但不限于，双酚-A型环氧树脂、双酚-S型环氧树脂、苯酚酚醛清漆型环氧树脂、甲酚酚醛清漆型环氧树脂、缩水甘油胺型环氧树脂、缩水甘油酯型环氧树脂、三官能环氧树脂和四官能环氧树脂。更特别地，该树脂可包括固态三官能环氧树脂和甲酚酚醛清漆型环氧树脂。固态三官能环氧树脂和甲酚酚醛清漆型环氧树脂的实例包括
2-[4-(2，3-环氧丙氧基)苯基]-2-[4-[1，1-双[4-(2，3-环氧丙氧基)苯基]丙烷
和1，3-双[4-[1-[4-(2，3-环氧丙氧基)苯基]-1-[4-[1-[4-(2，3-环氧丙氧基)苯基]-1-甲基]乙基]苯基]丙氧基]-2-丙醇，在后面所描述的实施例将会用到这些。
[0032]
室温下为液态的环氧树脂可为双酚-A型环氧树脂或双酚-F型环氧树脂。可选择地，也可为这些树脂的组合。
[0033]
可选择地，在室温下的固态环氧树脂可含固态三官能环氧树脂和甲酚酚醛清漆型环氧树脂，而在室温下的液态环氧树脂可为双酚-A型环氧树脂或双酚-F型环氧树脂。
[0034]
热塑性树脂与热固性树脂混合物具体的实例是在一个体系中的树脂包括环氧树脂和丙烯酸酯橡胶。树脂中包括丙烯酸酯橡胶的体系在制备带状粘合带期间可改进沉积稳定性。这样的体系可导致粘合带具有较低的弹性模量，减小了在被粘结物与粘合带之间剩余应力，从而改进了与被粘结物的粘结性。
[0035]
本发明粘合带中树脂的含量是，例如，丙烯酸酯橡胶占除了焊料粉末以外粘合带中所有组分的总重量的10-50％。当丙烯酸酯橡胶的含量占总重量的10％或更多时，能够避免粘合带成膜性的恶化以及固化后弹性模量的增加，从而进一步改进了与被粘着材料的粘着性。当丙烯酸酯橡胶的含量占总重量的50％或更少时，可以避免树脂熔体粘度的增加，从而进一步可靠地将焊料粉末传送到导电部件的表面。
[0036]
环氧树脂的含量是，例如，占除了焊料粉末以外粘合带中所有组分的总重量的20-80％。当环氧树脂的含量占总重量的20％或更多时，能够确保在粘着之后具有充分的弹性模量，从而改进了连接的可靠性。当环氧树脂的含量占总重量的80％或更少时，可进一步改善熔融粘度从而避免由于从粘合材料流失焊料粉末而导致的连接可靠性的恶化。
[0037]
另外的热塑性树脂与热固性树脂混合的实例是一个体系，该体系包括环氧树脂和苯氧树脂。粘合带固化后，该体系可达到较满意的耐热性和防潮性。
环氧树脂所包括的树脂的具体实例已经在上面描述过了。
苯氧树脂具体的实例包括双酚-A型、双酚-F型、双酚-S型以及含芴树脂。
[0038]
考虑到粘合带成膜性的改善，苯氧树脂在树脂中的含量是，例如，占除了焊料粉末以外粘合带中所有组分总重量的10％或更多，优选占总重量的15％或更多。这样，能够进一步保证苯氧树脂中的羟基所衍生的粘结性。此外，为了避免树脂熔融粘度的过分增加，进一步确保焊料粉末向导电部件表面的传送，苯氧树脂在树脂中的含量是，例如，占除了焊料粉末以外粘合带中所有组分总重量的50％或更少，优选占总重量的40％或更少。
[0039]
考虑到焊料粉末在树脂中的可靠传送，树脂的固化温度优选高于后面要说明的焊料粉末的熔融温度。更特别地，优选树脂的固化温度高于焊料熔点10℃或以上，进一步优选高20℃或以上。此外，优选在粘着温度下树脂的熔体粘度比较低。
[0040]
树脂的固化温度是粘合带使用，例如，DSC(差示扫描量热计)以10℃/分的升温速度测出的放热峰温度。
[0041]
本发明的粘合带中，包含在焊料粉末中的焊料可为，例如，无铅焊料。该无铅焊料优选为一种合金，该合金包括至少两种选自以下组的金属，该组包括，但不局限于，Sn、Ag、Bi、In、Zn以及Cu。其中，考虑到合金的熔融温度和机械性能，优选包含Sn的合金，例如Sn-Bi合金，Sn-Ag-Cu合金以及Sn-In合金。
[0042]
考虑到充分地确保在粘合带粘接期间树脂的流动性，焊料粉末的熔融温度(熔点)是，例如，100℃或更高，优选130℃或更高。考虑到避免在粘结过程中安装在粘合材料上的元件(例如基板和芯片)的恶化，焊料粉末的熔融温度是，例如，250℃或更低，优选230℃或更低。
[0043]
在这里，焊料粉末的熔融温度是单独使用例如，DSC(差示扫描量热计)以10℃/分的升温速度测量得到的吸热峰温度。
[0044]
考虑到更加可靠地传送焊料粉末到导电部件的表面，焊料粉末的熔融温度优选低于树脂的固化温度。
[0045]
焊料粉末的颗粒尺寸可决定于导电部件的表面面积以及导电部件之间的距离。考虑到确保传送焊料粉末到导电部件的表面，焊料粉末的平均颗粒尺寸是，例如，5μm或更大，优选10μm或更大。此外，考虑到在导电部件表面选择性地形成焊接区域并且确保粘合带在导电区域，例如电极形成区域之外的区域的绝缘性，焊料粉末的平均颗粒尺寸是，例如，100
μm或更小，优选50μm或更小。这里，焊料粉末的平均颗粒尺寸是通过例如激光衍射光散射法测定的。
[0046]
考虑到改善粘接的可靠性，本发明粘合带中焊料粉末的含量占总重量的20份或更多，优选总重量的40份或更多，其中总重量是除了焊料粉末以外的其它组分的总和，其为100份。考虑到改善粘合带的成膜性，含量占总重量的250份或更少，优选总重量的230份或更少，其中总重量是粘合带中除了焊料粉末以外的其它组分的总和，其为100份。
[0047]
在本发明中所使用的具有助焊活性的固化剂是一种化合物，该化合物对形成在焊料粉末表面的氧化膜具有足够的还原能力，以与导电部件形成导电连接，并且该化合物还有一个作用基团，通过该基团该化合物与树脂相连。例如，当树脂包括环氧树脂时，具有助焊活性的固化剂可以含有羧基以及可与环氧基团反应的基团。可与环氧基团反应的基团的实例包括羧基、羟基、氨基。
[0048]
考虑到在粘接期间去除掉焊料粉末表面的氧化物膜，具有助焊活性的固化剂根据焊料粉末的类型来适当的选择。
[0049]
具有助焊活性的固化剂是，例如，一种包含羧基的化合物。包含羧基的化合物的实例包括羧酸类，例如直链的或含有支链的烷基羧酸以及芳族羧酸。
[0050]
烷基羧酸的具体实例包括化学式(1)所代表的化合物
HOOC-(CH2)n-COOH       (1)
在上面的化学式(1)中，n是包括在0到20的整数。
考虑到助焊活性组分之间的平衡、粘结过程中的除气作用以及粘合带固化之后的弹性模量和玻璃化转变温度，式(1)中的n优选4到10，当n是4或更大时，可以避免粘合带固化后由于环氧树脂中交联距离太短而导致的弹性模量升高，因而可以改进与被粘结材料的粘结性。当n是10或更小时，可以避免由于环氧树脂中交联距离太长而导致的弹性模量降低，因而进一步改进了粘结的可靠性。
[0051]
化学式(1)所表示的化合物的实例包括己二酸(HOOC-(CH2)4-COOH；n＝4)，癸二酸(HOOC-(CH2)8-COOH；n＝8)以及HOOC-(CH2)10-COOH；n＝10
[0052]
此外，芳基羧酸的具体实例包括在一个分子中至少两个酚羟基以及至少一个羧基基团直接连接到芳香基团的化合物。这种化合物的实例包括苯甲酸衍生物例如2，3-二羟基苯甲酸，2，4-二羟基苯甲酸，龙胆酸(2，5-二羟基苯甲酸)，2，6-二羟基苯甲酸，3，4-二羟基苯甲酸，五倍子酸(3，4，5-三羟基苯甲酸)以及酚酞啉(2-[双(p-羟苯基)甲基]苯甲酸)。
萘酸衍生物如1，4-二羟基-2-萘酸，3，5-二羟基-2-萘酸，3，7-二羟基-2-萘酸以及
双酚酸(diphenolic acid)
[0053]
此外，具有助焊活性的固化剂的具体的实例包括上面描述的癸二酸或龙胆酸，可包括一个或者两个。
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在本发明的粘合带中，具有助焊活性的固化剂可位于焊料粉末的外面；例如，焊料粉末以及具有助焊活性的固化剂可独立地分散在树脂中或者固化剂粘在分散于树脂中的焊料粉末的表面。由于具有助焊活性的固化剂是在焊料粉末的外面，具有助焊活性的固化剂有效地移动到焊料与导电部件之间的界面，所以导电部件能够直接地与焊料接触。这样，改善了粘结的可靠性。除此之外，由于具有助焊活性的固化剂被包含在树脂中，所有它能够有效地粘结树脂从而提高弹性模量或Tg(玻璃化转变温度)。
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在本发明的粘合带中，考虑到改进助焊活性，具有助焊活性的固化剂的含量是例如占除了焊料粉末以外粘合带中所有组分的总重量的0.1％或更多，优选占总重量的1％或更多。此外，考虑到降低粘结期间树脂的熔融粘度，具有助焊活性的固化剂是例如占除了焊料粉末以外粘合带中所有组分总重量的30％或更少，优选占总重量的10％或更少。
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更特别地，当本发明粘合带包括环氧树脂时，具有助焊活性的固化剂的含量是例如占粘合带中环氧树脂重量的50％或更少，优选占重量的30％或更少。这样，因此避免使用过多的固化剂，从而改善了固化性。
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在本发明粘合带中，除了具有助焊活性的固化剂以外，树脂可以还包括其它的固化剂或能够起固化剂作用的树脂。
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固化剂实例包括，但不局限于，酚类、胺类以及硫醇类，考虑到与环氧树脂的反应性和固化之后的物理特性，酚类更加适合使用。
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考虑到固化后粘合带的物理性能，酚类优选，但不局限于，为双官能或多官能的。实例包括双酚-A，四甲基双酚-A，二烯丙基双酚-A，双苯酚，双酚-F，二烯丙基双酚-F，三苯酚，四苯酚，苯酚酚醛清漆以及甲酚酚醛清漆，并且考虑到熔融粘度、与环氧树脂的反应性和固化后的物理性能，苯酚酚醛清漆和甲酚酚醛清漆是合适的。
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考虑到可靠地固化树脂，固化剂而非具有助焊活性的固化剂的含量是例如占除了焊料粉末以外粘合带中所有组分总重量的5％或更多，优选占总重量的10％或更多。此外，考虑到改善树脂粘结期间的流动性，此固化剂含量是例如占除了焊料粉末以外粘合带中所有组分总重量的40％或更少，优选占总重量的30％或更少。
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本发明粘合带可进一步包括固化催化剂。通过加入固化催化剂，在制备粘合带期间树脂能够被更可靠地固化。
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固化催化剂可根据所用的树脂的类型来合适的选择；例如熔点为150℃或更高的咪唑化合物，由于焊料粉末传送到电极表面之前粘合带中树脂的固化，所以熔点太低的咪唑化合物会导致粘结不稳定，或者粘合带的保存期限减少。因此，咪唑化合物的熔点优选150℃或更高，更优选160℃或更高。熔点为150℃或更高的咪唑化合物的实例包括2-苯基羟基咪唑，2-苯基-4-甲基羟基咪唑，2-苯基-4，5-二羟基咪唑以及2-苯基-4-甲基咪唑。咪唑化合物的熔点的上限没有特别的限定，其可以适当的选择，如取决于粘合带的粘结温度，例如为250℃或更低。
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考虑到作为催化剂更加有效地起到环氧树脂的固化催化作用以改善粘合带的固化性能，固化催化剂的含量是例如占除了焊料粉末以外粘合带中所有组分总重量的0.001％或更多，优选占总重量的0.01％或更多。此外，固化催化剂的含量是例如占总重量的5％或更少。这样，粘合带的保存期限可进一步的改善。
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本发明的粘合带还可进一步包含硅烷偶联剂。通过使用硅烷偶联剂，粘合带与被粘结物的粘结性进一步提高。硅烷偶联剂的实例包括环氧基硅烷偶联剂，含芳基的氨基硅烷偶联剂，它们可以单独使用，或两种都使用。硅烷偶联剂的含量是例如大约占除了焊料粉末以外粘合带中所有组分总重量的0.01-5％。
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此外，本发明的粘合带除了上述描述的以外，还可包括其它填料，例如，选择合适的添加剂以改善各种性能如树脂的相容性、稳定性以及加工性能。
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下面将描述制备本发明粘合带的过程。通过混合树脂、焊料粉末、具有助焊活性的固化剂以及如果有必要的话，其它的添加剂，来制备粘合带，其中焊料粉末和具有助焊活性的固化剂分散于树脂中，然后将这样制备的分散体施加到剥离基材例如聚酯膜上并在预定温度下将其干燥。
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在所制备的带型粘合带中，焊料粉末和具有助焊活性的固化剂包含在树脂中。当树脂被放在准备粘结在一起的元件之间然后加热时，树脂中的焊料粉末以自动对准方式移动到导电部件的表面，从而形成金属连接。
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接下来参照附图进一步具体描述本发明粘合带的粘结过程。
第一基板109，粘合带101，第二基板107，粘合带101以及第三基板105从底部开始依次层叠。在第一基板109表面上的第一电极113面对着在第二基板107的表面上的第二电极115。此外，在第二基板107表面上的第二电极121面对着在第三基板105的表面上的第三电极119。
一种指定的材料可进入到通孔117中或通孔117是一个穿孔(throughhole)。
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接下来，在预定的温度下加热堆叠体，进行粘结。粘结温度根据粘合带101中的焊料粉末103的材料以及树脂材料而定。
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粘结温度高于焊料粉末103的熔点，在该粘结温度下，树脂熔化。可以理解，粘结温度是例如高于100℃，优选120℃或更高。在粘结温度下，最好树脂的熔融粘度比较低，从这个观点来看，熔融温度为例如250℃或更低，优选200℃或更低。考虑到在一个更大的范围内树脂具有较低的熔融粘度，所以优选比较低的温度。
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考虑到迫使焊料粉末103更加有效地移动到电极表面，在粘结过程期间要使用一定的压力。考虑到形成更加可靠的焊接区域111，所以所用的压力是例如0Mpa或更大，优选1Mpa或更大。甚至当外界所施加的压力为0Mpa时，但粘合带所受到的压力是设置在粘合带上面部件的自身重量。考虑到进一步改进连接的可靠性，压力是例如20Mpa或更小，优选10Mpa或更小。
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加热可使粘合带101中的树脂熔化。进一步，粘合带101中的焊料粉末被熔化。熔融的焊料粉末103从树脂(未示出)的内部以自动对准方式移动到形成于每一基板表面上的电极。焊料粉末103自动调整到电极彼此互相面对的区域里，所以焊接区域111形成在第一电极113与第二电极115之间以及第二电极121与第三电极119之间的每一个区域里。
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包含在树脂(未示出)中的具有助焊活性的固化剂高效地移动到焊料粉末103与电极之间的界面，同时去除焊料粉末103上的氧化膜，使得焊接区域111与每一个电极都是直接地金属连接从而形成了导电连接。然后，冷却该堆叠体以固化粘合带中的树脂，这样电极通过焊接区域111被连接起来的状态被维持住了。
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因此，通过使用带型粘合带101，在粘结期间基板能够很容易地通过在一个预定的单一的温度下加热被连接起来。然而，粘结期间的加热不局限于在一个单一的温度下，例如，分步固化包括加热在150℃下100秒，然后在200℃下100秒，或者后固化包括在180℃下热压粘合10秒，然后在烘箱中200℃下固化10分钟。此外，构成焊料粉末103的焊料颗粒的金属连接形成了电极与粘合带101中的焊料的连接，从而实现了比较低的连接电阻以及比较高的连接可靠性。
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本发明的粘合带表现出优良的与被粘结物的粘结性以及比较高的导电部件间导电连接可靠性。例如，本发明粘合带可在一连接结构中用作粘合带使用，该连接结构具有一对导电部件，粘合带设置与这对导电部件间，以实现这对导电部件间的导电连接。
本发明的粘合带可用在电子设备中，用于连接电子组件的或电组件，并将组件电连接起来。这样的电子设备的具体的实例包括计算机、电视机、手机、游戏机、各种各样的通讯设备以及测量设备。
由于本发明粘合带即便在导电部件的粘结面积很小时也能够提供可靠的连接，这样的带用在连接基板或芯片(例如，在半导体封装中)是很合适的。
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例如，本发明的粘合带可用于半导体封装中基板的粘结。
在使用了本发明粘合带的半导体封装中，例如，第一基板、粘合带和第二基板被依次层叠，在第一基板上的第一半导体和第二基板上的第二半导体通过粘合带中的焊料区域连接起来。
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被粘结之后，粘合带含有树脂以及浸入了树脂的焊接区域。具有助焊活性的固化剂存在或不存在于树脂中。
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如下面的实例所描述的那样，焊料区域逐步地从粘合带内部朝着第一和第二电极扩展。焊料区域具有沿着两边的电极扩展的形状，从而实现了焊接区域与粘合带的树脂优良的粘结性以及第一或第二电极与焊接区域之间大的接触面积。
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当本发明的粘合带被用于基板的粘结，在第一和第二基板的表面可能存在也可能不存在阻焊层。
图2所示的截面图描述了在没有阻焊层的基板之间形成连接的方法。
在图2中，第一基材133和第二基材131上分别形成有第一电极137和第二电极135。本发明的粘合带被设置在基材之间并在预定温度下加热，通过树脂132粘结基材并且焊料粉末以自动对准方式朝着第一电极137和第二电极135的表面移动，从而在这些电极之间通过焊接区域形成了连接。
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图3所示的截面图描述了存在焊接保护层的基板之间形成连接的方法。图3中的基本结构在图2中已经描述过了，除了分别设置在第一基材133上的第一焊接保护层141以及第二基材131上的第二焊接保护层139，并且第一电极137和第二电极135被分别埋设在第一阻焊层141和第二阻焊层139里面。除此之外，第一电极137和第二电极135在给定位置处彼此相对，一个空隙143贯穿于第一阻焊层141和第二阻焊层139。
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当在这些基材之间形成粘结时，本发明的粘合带(未示出)被设置于基板之间，并在预定的温度下加热。然后焊料粉末移动到暴露于空隙143中的第一电极137和第二电极135的表面，填充空隙143。这样，焊接区域在彼此相通的部分之间形成连接。
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本发明粘合带被用于半导体封装内的半导体芯片之间的粘结。
图4和图5描述了半导体封装结构的截面图，其中该半导体封装中的半导体芯片通过粘合带被粘结。
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在图4中，第二半导体芯片153、粘合带101和第一半导体芯片151被依次层叠，在第二半导体芯片153中的电极(未示出)和在第一半导体芯片151中的电极(未示出)通过粘合带101中焊接区域111而连接。形成在第二半导体芯片153后表面上的电极和芯片安装基板(安装基板155)上的电极通过导线159连接起来。第一半导体芯片151，第二半导体芯片153和导线159被封铸树脂163包裹起来。在安装基板155后表面有多个凸电极161。
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图5中基本的结构如同在图4中所描述的，除了在图5中，第二半导体芯片153经过凸电极165和第一半导体芯片151被翻转地连接(flip-bonded)到一个安装基板155上。凸电极165和第一半导体芯片151被布置在安装基板155与第二半导体芯片153之间。
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在图4和图5中，第一半导体芯片151和第二半导体芯片153通过本发明的粘合带101粘结起来。这样，封装件可比通过凸电极连接芯片的结构更薄。而且，使用粘合带101可实现用简单的工艺就能连接芯片并且可以更加可靠地、稳定地连接芯片上的电极。
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除此之外，本发明的粘合带可用于当一个半导体封装件中的安装基板要被进一步安置到另一个基板上时，基板之间的粘结。例如，该粘合带能够用于半导体封装上的二次安装，例如，PC板。
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图6是一个半导体封装的结构截面图。在图6中，通过粘合带101，第一基板(安装基板155)与第二基板(基板157)被连接起来，半导体芯片(第一半导体芯片151和第二半导体芯片153)被安装在第一基板上，安装基板155安装在第二基板上。基板157可为，例如，PC板。第一半导体芯片151与第二半导体芯片153之间的空间充满了树脂167。被安装在第一半导体芯片151上的电极(未示出)与第二半导体芯片153分别通过导线169和导线171连接到安装基板155上的电极(未示出)。
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在图6中，由于安装基板155与基板157通过粘合带101连接起来，所以基板上的电极之间能够形成稳定的连接，连接的可靠性也比较高。通过使用粘合带101，能够缩短基板间的距离，使得整个封装件变得更薄。
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尽管本发明的部分实施例已经参照附图说明过了，但这样的描述仅仅为了说明发明的目的，其它的上面没有提到的结构也可以使用。
实施例
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(粘合带的制备)
制备含有树脂、焊料粉末以及具有助焊活性的固化剂的厚40μm的粘合带(实施例1-21)。除此之外，还制备含有树脂和焊料粉末但不具有助焊活性的固化剂的粘合带(比较例1)。
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表1～表5显示出了混合在一起的各组分的重量份数。对于每一个实施例和比较例，显示在表1～表5中的组分被溶解在芳香烃溶剂(如甲苯、二甲苯)、有机酯溶剂(如乙酸乙酯、乙酸丁酯)、或有机酮溶剂(如丙酮、甲乙酮)中，获得清漆，将所述清漆涂到聚酯片上，在足够的温度下挥发溶剂以将其干燥。
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在实施例1到21中，制备的粘合带表现出优良的成膜性(depositability)。
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(基板间连接的评价)
实施例1-21和比较例1的每一种粘合带都被用来连接图2所示的无阻焊剂的基板。所用的基板是FR-4，板厚度为0.4mm，Ni/Au镀铜箔厚为12μm，电路宽/电路间宽为300μm/100μm，上下电路重叠的宽度为100μm。粘合带放在基板之间，此外，厚200μm的硅橡胶放在基板的上表面，以施加同样的压力，然后在200℃、2Mpa下热压600秒，形成连接。
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此外，实施例1-21和比较例1的每一种粘合带都被用来连接图3所示的有阻焊剂的基板。所用的基板是FR-4，板厚度为0.4mm，Ni/Au镀铜箔厚为12μm，阻焊剂厚(从电路的上表面的厚度)为12μm，电路宽/电路间宽为300μm/100μm，上下电路重叠的宽度为100μm。粘合带放在基板之间，此外，厚200μm的硅橡胶放在基板的上表面，以施加同样的压力，然后在180℃、2Mpa下热压600秒，形成连接。
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对于所制备的堆叠体，相邻端子间的连接电阻是通过四端子法在12点测量的，并且将平均值作为测量值。在表1～表5中，当测量值是30mΩ或更少时，结果被记为＂o＂，当测量值是30mΩ或更多时，结果被记为＂×＂。
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对于每一个实施例或比较例，观察10个端子的横截面，当在所有的端子都形成了如图7和图8所示的焊接圆柱导体时，则记为＂o＂，当一个或多个端子没有形成圆柱导体时，则记为＂×＂。
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图7是一个在实施例1中没有阻焊剂而形成的堆叠体的扫描电镜(SEM)横截面图。就像图7所示的，焊接厚度是2μm并且表现出很好的焊接导电性。
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图8是一个在实施例1中有阻焊剂而形成的堆叠体的扫描电镜(SEM)横截面图。如图8所示的，端子间隔是大约18μm。焊接厚度是18μm并且表现出很好的焊接导电性。连接电极的焊接区域形成了沿着两个电极侧边延伸的形状。
Figure A200780014652D00231
Figure A200780014652D00241
Figure A200780014652D00251
Figure A200780014652D00261
Figure A200780014652D00271
Figure A200780014652D00291
Figure A200780014652D00301
Figure A200780014652D00311
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(对铜连接表面的浸润性的评价)
在这个实例中，制备实施例1所描述的粘合带，在表1中改变焊料粉末以及具有助焊活性的固化剂的类型。然后评价焊料粉末与具有助焊活性的固化剂的不同组合对铜连接表面的浸润性。
[0105]
所用的焊料粉末是Sn/Pb、Sn/Bi、Sn/Zn/Bi以及Sn/Ag/Cu。在每一种焊料粉末中，具有助焊活性的固化剂起到对环氧树脂催化剂作用的是龙胆酸或癸二酸。结果显示，任何的组合都有很好的浸润性。Sn/Bi与癸二酸的组合显示出最好的浸润性。
[0106]
(焊料颗粒尺寸的分析)
在这个实例中，改变粘合带中焊料粉末的颗粒尺寸，评价颗粒尺寸在对铜连接表面的浸润性中所起的作用。实施例1所描述的粘合带中，焊料粉末的平均颗粒尺寸是12μm，20μm和35μm。焊料粉末的含量是占重量的20％，该重量是除了焊料粉末以外组分的总重量。粘合带设置在没有阻焊层的基板之间，然后在220℃，2Mpa下经历600秒的热压粘结。结果显示出在任何颗粒尺寸下对铜互联都有很好的浸润性。以颗粒尺寸而论，浸润性按照35μm，20μm和12μm的顺序提高。

Claims (22)

1.电连接导电部件的粘合带，该粘合带包括
树脂，
焊料粉末，以及
具有助焊活性的固化剂；
其中焊料粉末以及具有助焊活性的固化剂包含在树脂中。
2.根据权利要求1所述的粘合带，其中通过加热使包含在树脂中的焊料粉末以自动对准的方式移动到导电部件的表面。
3.根据权利要求2所述的粘合带，其中所述树脂包含环氧树脂和丙烯酯橡胶。
4.根据权利要求2所述的粘合带，其中所述树脂包含环氧树脂和苯氧树脂。
5.根据权利要求2所述的粘合带，其中所述具有助焊活性的固化剂是含有羧基的化合物。
6.根据权利要求5所述的粘合带，其中所述具有助焊活性的固化剂是含有羧基和能与环氧基团反应的基团的化合物。
7.根据权利要求6所述的粘合带，其中所述具有助焊活性的固化剂是苯甲酸衍生物。
8.根据权利要求5所述的粘合带，其中所述具有助焊活性的固化剂是化学式(1)所代表的化合物：
HOOC-(CH2)n-COOH     (1)
在上面的化学式(1)中，n是4～10的整数。
9.根据权利要求5所述的粘合带，其中所述具有助焊活性的固化剂包括癸二酸和龙胆酸中的至少一种。
10.根据权利要求2所述的粘合带，其还包括咪唑化合物作为固化催化剂。
11.根据权利要求10所述的粘合带，其中所述咪唑化合物的熔点是150℃或更高。
12.根据权利要求11所述的粘合带，其中所述固化催化剂包括2-苯基羟基咪唑或2-苯基-4-甲基羟基咪唑。
13.根据权利要求10所述的粘合带，其中所述固化催化剂包括2-苯基-4，5-二羟基咪唑或2-苯基-4-甲基咪唑。
14.根据权利要求2所述的粘合带，其中所述的焊料粉末是合金，该合金包括选自Sn、Ag、Bi、In、Zn和Cu中的至少两种。
15、根据权利要求14所述的粘合带，其中所述焊料粉末的熔点在100℃～250℃。
16、根据权利要求2所述的粘合带，其中所述树脂包括在室温下是固态的环氧树脂以及在室温下是液态的环氧树脂。
17.根据权利要求16所述的粘合带，其中所述在室温下是固态的环氧树脂包括固态三官能环氧树脂和甲酚酚醛清漆型环氧树脂，且所述在室温下是液态的环氧树脂是双酚-A型环氧树脂或双酚-F型环氧树脂。
18.根据权利要求2所述的粘合带，其还包括硅烷偶联剂。
19.根据权利要求18所述的粘合带，其中所述硅烷偶联剂包括环氧基硅烷偶联剂和含芳基的氨基硅烷偶联剂中的至少一种。
20.半导体封装件，其包括
安装芯片的基板，以及
设置在安装芯片的基板的一个表面上的第一和第二半导体芯片；
其中所述的第一和第二半导体芯片通过权利要求1所限定的粘合带而连接起来。
21.半导体封装件，其包括
安装半导体芯片的第一基板和
安装所述第一基板的第二基板；
其中所述的第一和第二基板通过权利要求1所限定的粘合带连接起来。
22.电子设备，其中使用权利要求1所述的粘合带连接电子组件或电组件。
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