CN101405360B - 可用于电子器件快速装配的紫外可b阶化湿固化组合物 - Google Patents

可用于电子器件快速装配的紫外可b阶化湿固化组合物 Download PDF

Info

Publication number
CN101405360B
CN101405360B CN2007800094505A CN200780009450A CN101405360B CN 101405360 B CN101405360 B CN 101405360B CN 2007800094505 A CN2007800094505 A CN 2007800094505A CN 200780009450 A CN200780009450 A CN 200780009450A CN 101405360 B CN101405360 B CN 101405360B
Authority
CN
China
Prior art keywords
binder composition
moisture
composition according
acrylate
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007800094505A
Other languages
English (en)
Chinese (zh)
Other versions
CN101405360A (zh
Inventor
迈克尔·A·克罗普
罗伯特·L·D·曾纳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN101405360A publication Critical patent/CN101405360A/zh
Application granted granted Critical
Publication of CN101405360B publication Critical patent/CN101405360B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/10—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Silicon Polymers (AREA)
CN2007800094505A 2006-03-17 2007-02-23 可用于电子器件快速装配的紫外可b阶化湿固化组合物 Expired - Fee Related CN101405360B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/276,922 2006-03-17
US11/276,922 US20070219285A1 (en) 2006-03-17 2006-03-17 Uv b-stageable, moisture curable composition useful for rapid electronic device assembly
PCT/US2007/004865 WO2007108895A1 (en) 2006-03-17 2007-02-23 Uv b-stageable, moisture curable composition useful for rapid electronic device assembly

Publications (2)

Publication Number Publication Date
CN101405360A CN101405360A (zh) 2009-04-08
CN101405360B true CN101405360B (zh) 2010-11-17

Family

ID=38518770

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800094505A Expired - Fee Related CN101405360B (zh) 2006-03-17 2007-02-23 可用于电子器件快速装配的紫外可b阶化湿固化组合物

Country Status (7)

Country Link
US (1) US20070219285A1 (OSRAM)
EP (1) EP1996665A1 (OSRAM)
JP (1) JP2009530441A (OSRAM)
KR (1) KR20080113371A (OSRAM)
CN (1) CN101405360B (OSRAM)
TW (1) TW200745297A (OSRAM)
WO (1) WO2007108895A1 (OSRAM)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100053536A (ko) 2007-06-29 2010-05-20 아트피셜 머슬, 인코퍼레이션 감각적 피드백을 부여하는 전기활성 고분자 변환기
JP5466843B2 (ja) * 2008-10-30 2014-04-09 倉敷繊維加工株式会社 エアフィルタ用積層不織布の製造方法
RU2393195C1 (ru) * 2009-02-18 2010-06-27 Общество с ограниченной ответственностью "Пента-91" (ООО "Пента-91") Фотополимеризуемая кремнийорганическая композиция для склеивания и герметизации оптических элементов и способ получения ее основы
EP2239793A1 (de) 2009-04-11 2010-10-13 Bayer MaterialScience AG Elektrisch schaltbarer Polymerfilmaufbau und dessen Verwendung
JP5737185B2 (ja) * 2009-11-13 2015-06-17 日立化成株式会社 半導体装置、半導体装置の製造方法及び接着剤層付き半導体ウェハ
DE102010010598A1 (de) 2010-03-08 2011-09-08 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Dual härtende Masse und deren Verwendung
TWI542269B (zh) 2011-03-01 2016-07-11 拜耳材料科學股份有限公司 用於生產可變形聚合物裝置和薄膜的自動化生產方法
CN103703404A (zh) 2011-03-22 2014-04-02 拜耳知识产权有限责任公司 电活化聚合物致动器双凸透镜系统
TWI575049B (zh) * 2011-12-22 2017-03-21 漢高股份有限公司 紫外線硬化型和濕氣硬化型黏膠組成物
CN102559121A (zh) * 2012-02-29 2012-07-11 北京海斯迪克新材料有限公司 一种uv/湿气双重固化覆膜胶及其制备方法
EP2828901B1 (en) 2012-03-21 2017-01-04 Parker Hannifin Corporation Roll-to-roll manufacturing processes for producing self-healing electroactive polymer devices
US9761790B2 (en) 2012-06-18 2017-09-12 Parker-Hannifin Corporation Stretch frame for stretching process
WO2014066576A1 (en) 2012-10-24 2014-05-01 Bayer Intellectual Property Gmbh Polymer diode
CN103232782B (zh) * 2013-04-23 2016-12-28 矽时代材料科技股份有限公司 一种环保型无溶剂丙烯酸酯保形涂料
JP6432174B2 (ja) * 2014-06-18 2018-12-05 セメダイン株式会社 導電性接着剤
KR102494910B1 (ko) 2014-12-26 2023-02-01 세메다인 가부시키 가이샤 광경화성 조성물
WO2016163353A1 (ja) * 2015-04-09 2016-10-13 積水化学工業株式会社 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤
WO2017098972A1 (ja) 2015-12-08 2017-06-15 セメダイン株式会社 光硬化性粘着剤を用いる接着方法
DE102015224734A1 (de) 2015-12-09 2017-06-14 Tesa Se Zusammensetzung zur Herstellung von Haftklebemassen
DE102016111590A1 (de) 2016-06-24 2017-12-28 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Einkomponentenmasse auf Basis von Alkoxysilanen und Verfahren zum Fügen oder Vergießen von Bauteilen unter Verwendung der Masse
US20200071512A1 (en) * 2017-03-29 2020-03-05 Sika Technology Ag Water-based composition having improved mechanical properties
US10927269B2 (en) 2017-06-27 2021-02-23 Inx International Ink Co. Energy cured heat activated ink jet adhesives for foiling applications
US12054620B2 (en) 2017-06-27 2024-08-06 Inx International Ink Co. Energy curable, heat activated flexographic adhesives for die-less foiling
KR102625644B1 (ko) * 2017-12-13 2024-01-15 쓰리엠 이노베이티브 프로퍼티즈 컴파니 트라이알킬 보란 착물 개시제 및 광산을 함유하는 광학 투명 접착제
DE102018127854A1 (de) * 2018-11-08 2020-05-14 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Feuchtigkeitshärtbare Einkomponentenmasse und Verfahren zum Fügen, Vergießen und Beschichten unter Verwendung der Masse
EP3763795A1 (de) * 2019-07-08 2021-01-13 tesa SE Feuchtigkeitsvernetzbare, dimensionsstabile polymermasse
CN114163974A (zh) * 2021-12-30 2022-03-11 烟台信友新材料有限公司 一种可uv-led和湿气双固化的高润湿性环保三防胶黏剂及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1238366A (zh) * 1998-06-09 1999-12-15 国家淀粉及化学投资控股公司 紫外线/湿固化的粘合剂
US6204350B1 (en) * 1997-03-14 2001-03-20 3M Innovative Properties Company Cure-on-demand, moisture-curable compositions having reactive silane functionality
CN1107695C (zh) * 1996-11-08 2003-05-07 美国3M公司 可湿固化的热熔组合物
CN1705684A (zh) * 2002-10-23 2005-12-07 亨凯尔公司 快速湿气固化和uv－湿气双重固化组合物

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4239077A (en) * 1978-12-01 1980-12-16 Westinghouse Electric Corp. Method of making heat curable adhesive coated insulation for transformers
JP2635098B2 (ja) * 1988-05-09 1997-07-30 東芝シリコーン株式会社 硬化性ポリオルガノシロキサン組成物
US5086088A (en) * 1989-03-09 1992-02-04 Minnesota Mining And Manufacturing Company Epoxy-acrylate blend pressure-sensitive thermosetting adhesives
WO1992005226A1 (en) * 1990-09-19 1992-04-02 Minnesota Mining And Manufacturing Company Moisture-curable polyolefin pressure-sensitive adhesives
US5212211A (en) * 1990-11-19 1993-05-18 Loctite Corporation Polymodal-cure silicone composition, and method of making the same
US5620795A (en) * 1993-11-10 1997-04-15 Minnesota Mining And Manufacturing Company Adhesives containing electrically conductive agents
US6471820B1 (en) * 1995-01-05 2002-10-29 3M Innovative Properties Moisture-curable silicone composition
JP2002308959A (ja) * 2001-04-16 2002-10-23 Kanegafuchi Chem Ind Co Ltd 湿気硬化型組成物
US6606247B2 (en) * 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
JP3892270B2 (ja) * 2001-10-17 2007-03-14 コニシ株式会社 一液湿気硬化型可撓性樹脂組成物
US7214569B2 (en) * 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
US20030187088A1 (en) * 2002-04-01 2003-10-02 Shin-Etsu Chemical Co., Ltd. Photo-curable coating compostion for hard protective coat and coated article
US6940408B2 (en) * 2002-12-31 2005-09-06 Avery Dennison Corporation RFID device and method of forming
JP2005281404A (ja) * 2004-03-29 2005-10-13 Aica Kogyo Co Ltd 湿気硬化型樹脂組成物とその硬化促進方法
JP2005350514A (ja) * 2004-06-08 2005-12-22 Sekisui Chem Co Ltd 湿気硬化型組成物とその用途
US20050282355A1 (en) * 2004-06-18 2005-12-22 Edwards David N High density bonding of electrical devices

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1107695C (zh) * 1996-11-08 2003-05-07 美国3M公司 可湿固化的热熔组合物
US6204350B1 (en) * 1997-03-14 2001-03-20 3M Innovative Properties Company Cure-on-demand, moisture-curable compositions having reactive silane functionality
CN1238366A (zh) * 1998-06-09 1999-12-15 国家淀粉及化学投资控股公司 紫外线/湿固化的粘合剂
CN1705684A (zh) * 2002-10-23 2005-12-07 亨凯尔公司 快速湿气固化和uv－湿气双重固化组合物

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP特开2002-308959A 2002.10.23
JP特开2005-350514A 2005.12.22

Also Published As

Publication number Publication date
CN101405360A (zh) 2009-04-08
JP2009530441A (ja) 2009-08-27
WO2007108895A1 (en) 2007-09-27
US20070219285A1 (en) 2007-09-20
TW200745297A (en) 2007-12-16
EP1996665A1 (en) 2008-12-03
KR20080113371A (ko) 2008-12-30

Similar Documents

Publication Publication Date Title
CN101405360B (zh) 可用于电子器件快速装配的紫外可b阶化湿固化组合物
EP2797973B1 (en) Adhesive tape composition and adhesive tape prepared from same
EP2094804A1 (en) Thermally b-stageable composition for rapid electronic device assembly
JP2018520215A (ja) アクリルポリマーに基づくｕｖ硬化性接着剤
TW200946633A (en) Conductive adhesive precursor, method of using the same, and article
CN1252204C (zh) 使用可光活化胶粘膜粘合基材的方法
JP2007510041A (ja) ポリ（アルキレンオキシド）ポリマー系感圧接着剤及びこれから形成されるテープ
EP3450519A1 (en) Self-adhesive layer
WO2000000566A1 (en) Hot-melt adhesive composition, heat-bonding film adhesive and adhering method using hot-melt adhesive composition
EP3450518A1 (en) Self-adhesive layer
JP2006522857A (ja) 熱活性化性接着剤
WO2002055626A1 (en) Removable adhesive compositions and process for producing the same
JP2010077286A (ja) シリコーン樹脂組成物および粘着フィルム
JP5319993B2 (ja) ダイシング−ダイボンディングテープ及び半導体チップの製造方法
KR20050044473A (ko) 접착성 물질, 접착성 물질의 박리 방법 및 접속 구조체
JP4201858B2 (ja) 熱硬化性接着剤組成物、その製造方法および接着構造
WO2019044046A1 (ja) フィルム状透明接着剤、及び赤外線センサーモジュール
JP5192950B2 (ja) 硬化性エポキシ組成物、異方性導電材料、積層体、接続構造体及び接続構造体の製造方法
CN107960098B (zh) 光学用粘合剂组合物及光学用粘合膜
JPH09291267A (ja) 紫外線硬化型接着剤組成物
CN104059555B (zh) 抗静电压敏胶带的制造工艺
JPH11335649A (ja) 熱硬化型接着剤組成物とその接着シ―ト類
CN101336278A (zh) 热固化型粘接剂
CN111394017A (zh) 一种具有高导热率和导电性的热固型粘合材料
CN112739533A (zh) 粘合带及电子部件的制造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20101117

Termination date: 20120223