CN101395711B - 纵式基板运送装置及成膜装置 - Google Patents
纵式基板运送装置及成膜装置 Download PDFInfo
- Publication number
- CN101395711B CN101395711B CN2007800072173A CN200780007217A CN101395711B CN 101395711 B CN101395711 B CN 101395711B CN 2007800072173 A CN2007800072173 A CN 2007800072173A CN 200780007217 A CN200780007217 A CN 200780007217A CN 101395711 B CN101395711 B CN 101395711B
- Authority
- CN
- China
- Prior art keywords
- mentioned
- carriage
- substrate
- posture
- rotating mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/066—Transporting devices for sheet glass being suspended; Suspending devices, e.g. clamps, supporting tongs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/02—Controlled or contamination-free environments or clean space conditions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Robotics (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
本发明提供与基板的运送姿势无关、在任意面上都能成膜、且可与非成膜面不干涉地支承并运送基板的纵式基板运送装置和成膜装置。本发明的成膜装置(1),备有可处理基板(W)的任意面地支承着上述基板的托架(15)、变换托架(15)的运送姿势的第1姿势变换部(3)、收容已变换了姿势的托架并将该托架运送到成膜室(10)的运送室(9)。采用上述构造,可以与基板(W)的运送姿势无关地、对任意面实施成膜处理。另外,在基板(W)的运送途中,可以变更成膜面(Wa)。另外,可以使托架(15)不与基板(W)的非成膜面干涉地支承着基板(W)。
Description
技术领域
本发明涉及可将基板以大致直立的姿势运送以及进行成膜的纵式基板运送装置和成膜装置。
背景技术
近年来,随着显示器的大画面化,显示器用的基板也渐渐地大型化。在用已往的水平方式运送该大型基板时,存在各种问题。
例如,由于基板的大型化、薄型化,水平载置着的基板,在其自重的作用下容易产生挠曲、翘曲,在膜厚、平坦性方面精密地成膜是很困难的。另外,与基板面积相应地,成膜装置的构造也大型化,必须确保相当的占据空间。
另一方面,现有技术中也提出了纵式运送方式,在该纵式运送方式中,用托架支承基板的一侧,将基板以大致直立的状态运送(参见例如下述专利文献1、2)。根据该纵式运送方式,可以抑制基板的挠曲、翘曲,所以能适应基板的大型化。另外,还可以减少基板运送装置占据的空间。
专利文献1:日本专利第2948842号公报
专利文献2:日本特开2004-83997号公报
但是,在已往的纵式基板运送装置中,是用托架支承基板的一侧而将基板保持为大致直立姿势的结构,必须将成膜面对齐地将基板设置在托架上。另外,在基板被支承在托架上后,成膜面受到限制。因此,基板的成膜面由基板的运送姿势决定,在运送途中不能变更成膜面。
另外,在要在基板的两面上进行成膜时,先进行了成膜的基板的一面,由于在另一面成膜时由托架支承着,所以,托架必须不与上述另一面的成膜区域接触。但是,根据基板种类的不同,成膜区域也不 同,所以,要根据这些基板的种类做成不同构造的托架,这样,导致装置成本的提高。
发明内容
本发明就是鉴于上述问题而做出的,其目的是提供一种与基板的运送姿势无关、无论在哪一个面上都能成膜、且可不与非成膜面干扰地支承并运送基板的纵式基板运送装置和成膜装置。
为了解决上述课题,本发明的纵式基板运送装置,将基板以大致直立的姿势运送到处理室,备有:可处理基板的任意面地支承基板的托架、变换托架的运送姿势的姿势变换机构、收容已变换了姿势的托架并将该托架运送到处理室的运送室。
根据上述构造,可以与基板的运送姿势无关地对任意面实施成膜等的处理。另外,在基板的运送途中可以变更成膜面。另外,可以使托架不与基板的非成膜面干扰地支承基板。因此,即使在非成膜面上已实施了任何处理的情况下,也不受该已实施处理的区域限制,可恰当地支承基板,不必根据基板的种类变更托架的构造,可防止装置成本提高。
托架的构造没有特别限定,但最好是如下构造,即,具有包围上述基板周围的框状,并且,在内周侧具有夹持基板缘部的夹持机构。这样,可以对基板的任意面都进行处理地支承基板。另外,作为姿势变换机构,具有使托架绕铅直轴旋转的旋转机构。
作为运送室,最好是将基板导入处理室的荷载锁定室。这样,当处理室是真空时,可以将在大气中变换了姿势的基板,高效地运送到处理室。这时,处理室可由成膜室、蚀刻室、热处理室等各种处理室构成。成膜处理,例如可采用溅射处理、CVD处理等。
处理室,可由备有溅射阴极的成膜室构成。这时,设置挟着基板相向的一对溅射阴极,可以对基板的两面同时成膜。或者,可以构成能够以各成膜面相互朝外的方式收容两块基板的运送室,由此可将2块基板同时成膜。
如上所述,根据本发明,与基板的运送姿势无关地无论在哪个面 上都能够成膜。并且,可以不与非成膜面干扰地支承并运送基板。
附图说明
图1是备有本发明的实施方式的纵式基板运送机构的成膜装置的概略构造图。
图2是说明在图1的成膜装置中、将基板移载到在装入部待机的托架上的工序图。
图3是图2所示托架的侧视图。
图4是说明托架的夹持机构的一个作用的要部放大图。
图5是表示夹持机构的结构的一例的要部剖视图。
图6是表示夹持机构的结构的另一例的要部剖视图。
图7是备有图6的夹持机构的托架的要部剖视图。
图8是表示夹持机构的结构的另一例的要部剖视图。
图9是表示夹持机构的结构的另一例的要部剖视图。
图10是备有图8和图9的夹持机构的托架的要部侧视图。
图11是说明图1的成膜装置的一个作用的工序图。
图12是表示基板的一个构造例的侧视图。
具体实施方式
下面,参照附图说明本发明的实施方式。
图1是表示本发明的实施方式的成膜装置1的概略构造的平面图,所述成膜装置1具有纵式基板运送机构。先说明成膜装置1的构造。
本实施方式的成膜装置1,是对液晶显示装置用的玻璃基板或者相当于若干个该玻璃基板大小的母玻璃等的大面积薄型基板(下面简称为“基板”)W,实施规定的成膜处理的装置。成膜装置1,备有装入部2、第1姿势变换部3、成膜部4、第2姿势变换部5和取出部6,并且按照该顺序构成了将基板W以大致直立的姿势运送的运送线。
装入部2设置在大气中,把由图未示的移载机构载置在水平方向的基板W,直立起来供给到运送线。将基板W以大致直立的姿势支承着的托架15,在装入部2待机。另外,在装入部2设有传感器16,该传感器16检测移载到托架15上的基板的表背面。托架15,如后所 述,在将基板W保持着直立姿势的状态下,将基板W依次运送到第1姿势变换部3、成膜部4、第2姿势变换部5和取出部6。
第1姿势变换部3,设置在大气中,备有第1旋转机构7和第2旋转机构8。该第1姿势变换部3,与本发明的“姿势变换机构”对应。
第1旋转机构7,在将托架15的行进方向变换了90度后,运送到第2旋转机构8。第1旋转机构7使托架15绕铅直方向旋转,以此变换基板W的运送姿势。第1旋转机构7,至少能朝图1中箭头R1所示的旋转方向和与R1相反的旋转方向中的、至少一方旋转。被运送到第1旋转机构7的托架15,在第1旋转机构7的旋转中心C的位置停止。
第2旋转机构8,绕着通过中心C2的铅直方向、朝箭头R2所示的旋转方向旋转,以此将该托架15的行进方向变换90度并运送到成膜部4。第2旋转机构8,可以把由第1旋转机构7变换了姿势后的托架15以呈两列并列的状态收载。第2旋转机构8的中心C2与第1旋转机构7的中心C1,在托架15运入第2旋转机构8的方向错开。因此,通过使该第2旋转机构8旋转180度,可以使2个部位的托架的收载位置,分别对准第1旋转机构7的运出位置的延长线。如后所述,通过第1旋转机构7以基板W的成膜面分别朝外的方式变换了姿势的托架15、15,被运送到第2旋转机构8。第2旋转机构8将收载的两列托架15、15同时运送到成膜部4。
成膜部4由第1荷载锁定室9、成膜室10和第2荷载锁定室11构成。
第1荷载锁定室9,在其前后分别设置着图未示的闸阀,并且内部可减压成预定的真空度。第1荷载锁定室9作为本发明中的“运送室”,在从第2旋转机构8以并列状态收载托架15、15后,将入口侧的闸阀关闭,将内部减压成预定的真空度。然后,将出口侧的闸阀打开,将两列托架15、15同时地运送到成膜室10。
成膜室10,与本发明的“处理室”对应,对支承在托架15、15上的基板W的预定面进行成膜处理。在本实施方式中,成膜室10由 溅射室构成,内部被减压成预定的真空度。在成膜室10中,在托架15、15的行进方向两侧,配置着作为成膜源的一对溅射阴极10A、10B。
第2荷载锁定室11,在其前后分别设置着图未示的闸阀,并且,内部可减压成预定的真空度。第2荷载锁定室11,在内部被减压成预定的真空度的状态下,在从成膜室10收载了托架15、15后,将入口侧的闸阀关闭,将内部朝大气开放。然后,将出口侧的闸阀开放,把支承着成膜处理后的基板W的托架15、15运送到第2姿势变换部5。
第2姿势变换部5设置在大气中,备有第3旋转机构12和第4旋转机构13。
第3旋转机构12,绕着通过中心C3的铅直方向,朝箭头R3所示的旋转方向旋转,由此在把该托架15、15的行进方向变换了90度后运送到第4旋转机构13。第3旋转机构12,把变换了姿势后的托架15、15一个一个地运送到第4旋转机构13。第3旋转机构12的中心C3和第4旋转机构13的中心C4,在托架从第3旋转机构12运出的方向错开。因此,使第3旋转机构12旋转180度,就可以将2个运出的托架分别对准第4旋转机构13的运入位置的延长线。
第4旋转机构13,在将托架15的行进方向变换了90度后,运送到取出部6。第4旋转机构13,绕通过中心C4的铅直方向旋转,有此变换托架15的运送姿势。被运送到第4旋转机构13的托架15,在第4旋转机构13的旋转中心C4的位置停止。第4旋转机构13,可朝图1中箭头R4所示的旋转方向、以及与R4相反的旋转方向之中的至少一方旋转,由此可把从第3旋转机构12运送的2个托架15、15载置在朝向取出部6的运送线上。
取出部6设置在大气中,从托架15上取出被以大致直立的姿势支承着的成膜处理后的基板W。在取出部6设有图未示的移载机构,该移载机构从托架15取出基板W并使其横卧在水平方向。该移载机构,具有与设置在装入部2的移载机构同样的构造。
图2表示上述移载机构的概略构造。在图2中,移载机构17是格子形状,在其面内格子点的若干部位,设有能真空吸附基板W的一主 面的吸附嘴18(图2A)。移载机构17,能以预定的一边侧为轴自由转动,使吸附保持着的基板W从水平方向横卧的姿势直立起来,或者从直立姿势变换为横卧姿势(图2B、C)。该构造的移载机构17,在装入部2和取出部6各设有一台。
在与移载机构17之间进行基板W的交接的托架15,使基板W的任何面都能进行处理(在本实施方式中是成膜)地支承着基板W。尤其在本实施方式中,托架15是包围基板W周围的框状,并且,在内周侧备有夹持基板W的缘部的夹持机构20(图2C)。夹持机构20,能夹持矩形基板W的上缘和下缘,但是,也可以如图3所示那样,夹持基板W的四边。另外,夹持机构20也可以沿基板W的边缘部连续地夹持,也可以在若干部位夹持基板W的一缘部。
图4表示夹持机构20的一例。夹持机构20,在托架15的内周侧具有一对夹爪20a、20b,借助与这些夹爪20a、20b对应设置着的操作部21a、21b的推压操作,夹爪20a、20b可以开闭。被开闭的夹爪20a、20b,可由操作部21a、21b的选择动作任意决定,可以从任意方向接纳基板W。
图5A、B是表示夹持机构20的具体构造之一例的要部剖视图。图示的夹持机构20-1中,表示一方夹爪20a的开闭状态,另一方夹爪20b也用同样的机构开闭。
在构成托架15的框部的托架基座15B的内周缘部15B1上,设有将夹爪20a、20b可转动地支承着的第1轴部31a、31b。在图示例中,夹爪20a、20b具有大致三角形的截面,第1轴部31a、31b分别支承着该夹爪20a、20b的外侧顶点部分。夹爪20a、20b的内侧的顶点部分分别形成长孔33a、33b,轴状的操作部件21a、21b的一端,通过第2轴部32a、32b与这些长孔连接。
操作部件21a、21b跨过托架基座15B的内外周缘部地贯通该托架基座15B,借助这些操作部件21a、21b的轴方向的推压操作,使夹爪20a、20b绕第1轴部31a、31b转动(图5B)。在托架基座15B的内部收容着弹簧部件34a、34b,这些弹簧部件34a、34b将操作部件21a、21b朝托架基座15B的外周缘部侧推压。在解除了对操作部件21a、21b的推压操作时,弹簧部件34a、34b将夹爪20a、20b朝图5A所示的夹持位置推压。
图6A、B是表示夹持机构20的另一具体例的结构的要部剖视图。在图中,与图5A、B对应的部分,注以相同标记,其详细说明从略。
在图示的夹持机构20-2中,表示一对夹爪20a、20b中的一方夹爪20b的开闭机构。夹爪20b轴支在操作部件21b的一端,在将该操作部件21b朝轴方向推压操作时,夹爪20b抵抗弹簧部件34b的弹力,朝图6B所示的开放位置转动。对操作部件21b的推压力的输入操作,是从托架基座15B的图中上面侧通过操作窗35b进行的。推压力的输入方向,不限定于如图6B所示那样沿操作部21b的轴方向,例如也可以采用图6C所示的机构。即,在操作部件21b的输入侧端部,安装三角形截面的导块36,把朝着与操作部件21b的轴方向直交的方向输入的操作力,变换为朝向该操作部件21b的轴方向。
上述构造的夹持机构20-2,在托架基座15B上安装着若干组,用这些若干个夹持机构20-2,开闭夹爪20a、20b。例如,如果采用在一对夹爪20a、20b之中只使一方夹爪转动的夹持机构,则可以从该一方夹爪侧进行基板的装卸。另外,如图7所示,交替地配置使一方夹爪转动的夹持机构和使另一方夹爪转动的夹持机构,由此,两方的夹爪20a、20b都可以转动,所以,可从这些夹爪的任一侧装卸基板。在图7中,具有操作部件21a的夹持机构20-2表示使夹爪20a转动的夹持机构,具有操作部件21b的夹持机构20-2表示使夹爪20b转动的夹持机构。另外,在图7的例子中,为了可从托架基座15B的两侧操作这些操作部件21a、21b,操作窗35贯通托架基座15B。
图8~图10表示夹持机构的结构的另一具体例。在图示的夹持机构20-3中,支承夹爪20a、20b的夹持本体37a、37b,可绕转动轴39a、39b自由转动,用操作部件40转动操作这些夹持本体37a、37b中的任一个,由此可开闭操作夹爪20a、20b。
图8A、B表示开闭操作夹爪20b的夹持机构20-3的构造,转动轴39b与夹持本体37b结合成一体。图9A、B表示开闭操作夹爪20a的夹持机构20-3的构造,转动轴39a与夹持本体37a结合成一体。如图10所示,在转动轴39a、39b上,分别安装着扭簧41a、41b,将夹持本体37a、37b朝着与夹持本体37a、37b的转动操作方向相反的方向推压。因此,当操作部件40对夹持本体37a、37b的操作力解除了时,夹爪20a、20b借助扭簧39a、39b的弹力回复到原来的关闭位置。另外,在图10的例子中,交替地配置使一方夹爪转动的夹持机构和使另一方夹爪转动的夹持机构,这样,在这些夹爪的任一侧都可以装卸基板。
下面,说明上述构造的成膜装置1的动作。
首先,在装入部2,基板W被移载到托架15上。
图2A~C表示基板W往托架15上移载的工序。基板W以横卧在水平方向的姿势、设置在移载机构17上(图2A)。这时,基板W的成膜面朝向上面侧。移载机构17用吸附嘴18吸附着基板W的下面侧,然后,转动90度、使基板W直立(图2B)。托架15在装入部2待机。移载机构17把基板W以大致直立的姿势移载到在装入部2处待机的托架15上。
在把基板W移载到托架15上时,托架15的夹持机构20如图3A所示地,只将移载基板W的一侧的夹爪20a开放,将基板W导入托架15内。在基板W被配置在托架15的内部后,夹爪20a关闭、挟住基板W的缘部。然后,吸附嘴18的吸附动作解除,移载机构17转动到原来的位置(图2C)。
在装入部2中移载到了托架15上的基板W,通过第1姿势变换部3变换了姿势,然后,被运送到成膜部4。图11A~C,表示第1姿势变换部3中的基板W(托架15)的姿势变换工序的一例。
第1姿势变换部3,把从装入部2呈单列状供给到运送线的托架15,并列成2列地运送到成膜部4,同时,使并排配置着的托架15、15所支承的基板W的成膜面Wa,分别与成膜室10的溅射阴极10A、10B相向。
如图11A所示,在装入部2中被移载到托架15上的基板W,其成膜面朝向图中下方侧。在该状态下,托架15被运送到第1姿势变换部3的第1旋转机构7,然后,第1旋转机构7朝R1方向转动90度。这样,基板W与托架15一起旋转而变换姿势,使成膜面Wa位于图中左方侧。然后,变换了姿势的托架15,被运送到第2旋转机构8。然后,第2旋转机构8朝R2方向旋转180度。
接着,如图11B所示,在装入部2中移载了基板W的下一个托架15,被运送到第1旋转机构7。第1旋转机构7朝R1方向旋转90度,这样,使基板W与托架15一起旋转而变换姿势,使成膜面Wa位于图中左方侧。然后,将变换了姿势的托架15运送到第2旋转机构8。
在第2旋转机构8,以并列成两列的状态收载托架15、15,该两列托架15、15分别是支承成膜面Wa位于图中左方侧的基板W的托架15、和支承成膜面Wa位于图中右侧的基板W的托架15。在该状态下,第2旋转机构8朝R2方向旋转,由此,如图11C所示,将这些托架15、15同时旋转90度后运送到成膜部4。
被运送到成膜部4的一对托架15、15,使基板W的成膜面分别与溅射阴极10A、10B相向地被运送到成膜室10,同时进行成膜。在成膜后,托架15、15被运送到第2姿势变换部5。第2姿势变换部5,将同时收载的2列托架15、15变换姿势,并且,一列一列地运送到取出部6。
即,如图1所示,第3旋转机构12朝R3方向旋转,使一对托架15、15同时旋转90度,然后,把托架15一列一列地运送到第4旋转机构13。第4旋转机构13,首先收载在图1中位于第3旋转机构12上的右侧的托架15,然后,朝R4方向旋转、使基板W的成膜面Wa朝向图中下方侧,接着朝向取出部6运送。接着,在图1中,使第3旋转机构12朝R3方向旋转180度,然后,将托架15运送到第4旋转机构13。第4旋转机构13,在收载了托架15后,朝R4方向旋转、使基板W的成膜面Wa朝向图中下侧,接着朝向取出部6运送。
在取出部6中,从托架15上取下已成膜的基板W,将其以在水平方向横卧的姿势运送到下一工序。基板W的取出,是用上述移载机构17进行的。用与图2所示的动作相反的动作从托架15上取下基板W。空了的托架15被运送到装入部2,在装入部2移载基板W。以后,反复上述同样的动作。
如上所述,根据本实施方式,对支承在托架15上的基板W可以处理其任意面,所以,与在装入部2供给的基板W的姿势无关,在第1姿势变换部3,可以将任意一面作为成膜面而运送到成膜室10。
另外,在运送途中,由于可任意变更基板W的处理面,所以,可以使处理面相互朝外地、将基板W以并列状态运送到成膜室10。另外,由于以两列并列的状态将一对基板W同时成膜,所以,可提高生产性。
另外,根据本实施方式,被运送到装入部2的基板W的成膜面,无论是上下哪个面,都可以借助能够两面成膜的托架15、和第1旋转机构7的旋转方向,使成膜面与成膜源相向。
另外,由于托架15备有夹持基板W的缘部的夹持机构20,所以,可以避免基板W的非成膜面与托架15接触而干涉。因此,即使在基板W的非成膜面上已实施了某种处理,该非成膜面也不会因与托架接触而受到损伤。
图12表示用该成膜装置1实施了成膜处理的基板W的一例。图示的基板W,是在一个面上形成了滤色层CF的液晶显示板用的滤色基板。图12A表示在滤色层CF上形成了透明电极层、即ITO(IndiumTin Oxide)层22的例子。图12B表示在滤色层CF上和基板W的背面形成了ITO层22的例子。根据本实施方式,把滤色层CF作为上面,用图2所示的移载机构17将基板W移载到托架15上,这样,可避免滤色层CF与移载机构17接触,并且,在移载了托架后,对滤色层侧和基板背面侧都可进行成膜处理。
上面,说明了本发明的实施方式,但本发明并不限定于此,可根据本发明的技术思想做各种变形。
例如,在上述实施方式中,说明了将溅射室作为成膜室10的例子,但是,成膜法并不限定于溅射法,也可以是CVD法、蒸镀法等其它的成膜法。这时,作为成膜源,应该是供给反应气体的气体头、蒸发源等。另外,成膜室10也可以由蚀刻室、热处理室等其它的处理室构成。
另外,在上述实施方式中,将两片基板运送到成膜室10,分别在其一面上成膜,但也可以将基板一片一片地运送到成膜室10,在其两面上同时成膜。
另外,也可以根据检测基板W的表背面的传感器16的输出,决定第1姿势变换部3的第1旋转机构7使基板W旋转的方向。这样,在装入部2中,可以与基板W的成膜面Wa的朝向无关地、把基板W移载到托架15上。
Claims (6)
1.一种纵式基板运送装置,将基板以大致直立的姿势运送到处理室,其特征在于,备有:
可处理上述基板的任意面地支承着上述基板的托架;
将上述基板移载到上述托架上的装入机构;
变换上述托架的运送姿势的姿势变换机构;
收容上述已变换了姿势的托架并将该托架运送到上述处理室的运送室;
处理上述基板的一面的上述处理室,
上述姿势变换机构具有第1旋转机构和第2旋转机构,
上述第1旋转机构使上述托架绕铅直方向旋转,以此变换上述基板的运送姿势,
上述第2旋转机构能够以呈两列并列的状态收容上述托架,
通过上述第1旋转机构以上述基板的成膜面分别朝外的方式变换了姿势的托架,被运送到上述第2旋转机构,上述第2旋转机构将收载成两列的托架同时向上述运送室运送。
2.如权利要求1所述的纵式基板运送装置,其特征在于,上述托架,是包围上述基板周围的框状,并且在内周侧具有夹持上述基板的缘部的夹持机构。
3.如权利要求1所述的纵式基板运送装置,其特征在于,上述装入机构和上述姿势变换机构设置在大气中,上述处理室内排气成真空,上述运送室是荷载锁定室。
4.如权利要求1所述的纵式基板运送装置,其特征在于,上述处理室,是备有配置在上述托架行进方向两侧方的一对溅射阴极的成膜室。
5.一种成膜装置,备有将基板以大致直立的姿势运送到成膜室的纵式基板运送机构,其特征在于,上述纵式基板运送机构备有:
可对上述基板的任意面进行成膜地支承着上述基板的托架;
能够变换上述托架的运送姿势的姿势变换机构;
收容上述已变换了姿势的托架并将该托架运送到上述成膜室的运送室;并且,
上述成膜室,备有配置在上述托架行进方向两侧方的一对成膜源,
上述姿势变换机构具有第1旋转机构和第2旋转机构,
上述第1旋转机构使上述托架绕铅直方向旋转,以此变换上述基板的运送姿势,
上述第2旋转机构能够以呈两列并列的状态收容上述托架,
通过上述第1旋转机构以上述基板的成膜面分别朝外的方式变换了姿势的托架,被运送到上述第2旋转机构,上述第2旋转机构将收载成两列的托架同时向上述运送室运送。
6.如权利要求5所述的成膜装置,其特征在于,上述成膜源是溅射阴极。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006115238 | 2006-04-19 | ||
JP115238/2006 | 2006-04-19 | ||
PCT/JP2007/057968 WO2007123032A1 (ja) | 2006-04-19 | 2007-04-11 | 縦型基板搬送装置および成膜装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101395711A CN101395711A (zh) | 2009-03-25 |
CN101395711B true CN101395711B (zh) | 2011-03-30 |
Family
ID=38624937
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007800072173A Active CN101395711B (zh) | 2006-04-19 | 2007-04-11 | 纵式基板运送装置及成膜装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8128793B2 (zh) |
EP (1) | EP2009685A4 (zh) |
JP (1) | JP4888917B2 (zh) |
KR (1) | KR101003515B1 (zh) |
CN (1) | CN101395711B (zh) |
TW (1) | TWI351376B (zh) |
WO (1) | WO2007123032A1 (zh) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009072426A1 (ja) * | 2007-12-06 | 2009-06-11 | Ulvac, Inc. | 真空処理装置及び基板処理方法 |
JP5366790B2 (ja) * | 2008-12-26 | 2013-12-11 | 株式会社アルバック | 基板反転装置、真空成膜装置及び基板反転方法 |
JP5563318B2 (ja) * | 2009-03-02 | 2014-07-30 | キヤノンアネルバ株式会社 | 基板支持装置、基板処理装置、基板支持方法、基板支持装置の制御プログラム及び記録媒体 |
US8432603B2 (en) | 2009-03-31 | 2013-04-30 | View, Inc. | Electrochromic devices |
JP5731838B2 (ja) * | 2010-02-10 | 2015-06-10 | キヤノンアネルバ株式会社 | トレイ式基板搬送システム、成膜方法及び電子装置の製造方法 |
US9207528B2 (en) * | 2010-06-04 | 2015-12-08 | Apple Inc. | Thin sheet glass processing |
JP5158157B2 (ja) * | 2010-08-31 | 2013-03-06 | 三星ダイヤモンド工業株式会社 | ワークの固定方法、およびワークの固定解除方法 |
JP5152277B2 (ja) * | 2010-08-31 | 2013-02-27 | 三星ダイヤモンド工業株式会社 | 姿勢変更ユニット |
KR101318172B1 (ko) * | 2011-06-08 | 2013-10-16 | 주식회사 에스에프에이 | 기판 이송용 트레이 |
WO2013050805A1 (de) * | 2011-10-06 | 2013-04-11 | Roth & Rau Ag | Substratwendeeinrichtung |
JP5840095B2 (ja) * | 2011-10-31 | 2016-01-06 | 三菱電機株式会社 | 太陽電池の製造装置、及び太陽電池の製造方法 |
ES2657115T3 (es) | 2011-12-12 | 2018-03-01 | View, Inc. | Dispositivos de película fina y fabricación |
EP2852469B1 (en) * | 2012-04-26 | 2019-04-24 | Intevac, Inc. | System architecture for vacuum processing |
KR101698536B1 (ko) * | 2012-11-07 | 2017-01-20 | 주성엔지니어링(주) | 기판 트레이 및 이를 포함하는 기판처리장치 |
CA2914658C (en) * | 2013-06-10 | 2023-10-17 | View, Inc. | Glass pallet for sputtering systems |
US11688589B2 (en) | 2013-06-10 | 2023-06-27 | View, Inc. | Carrier with vertical grid for supporting substrates in coater |
KR102190806B1 (ko) * | 2013-08-02 | 2020-12-14 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판들을 위한 유지 배열, 및 이를 사용하기 위한 장치 및 방법 |
WO2015014411A1 (en) * | 2013-08-02 | 2015-02-05 | Applied Materials, Inc. | Holding arrangement for substrates |
FR3049941B1 (fr) * | 2016-04-06 | 2018-04-13 | Saint- Gobain Glass France | Dispositif de convoyage et de maintien pour feuille de verre notamment dans une installation de lavage |
JP6279176B1 (ja) * | 2016-08-25 | 2018-02-14 | 株式会社アルバック | 成膜装置及び成膜方法並びに太陽電池の製造方法 |
CN108350567B (zh) * | 2016-08-25 | 2019-06-14 | 株式会社爱发科 | 成膜装置及成膜方法以及太阳能电池的制造方法 |
JP6336231B1 (ja) * | 2016-11-02 | 2018-06-06 | 株式会社アルバック | 真空処理装置 |
JP6379318B1 (ja) * | 2017-06-14 | 2018-08-22 | 株式会社アルバック | 成膜装置及び成膜方法並びに太陽電池の製造方法 |
DE102018110392A1 (de) * | 2018-04-30 | 2019-10-31 | Meyer Burger (Germany) Gmbh | Vakuumdurchlaufanlage mit hohem Durchsatz |
CN209382625U (zh) * | 2018-09-30 | 2019-09-13 | 重庆惠科金渝光电科技有限公司 | 一种缓冲衬垫和缓冲装置 |
TWI733140B (zh) * | 2019-07-12 | 2021-07-11 | 萬潤科技股份有限公司 | 薄片物件搬送裝置及設備 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2948842B2 (ja) | 1989-11-24 | 1999-09-13 | 日本真空技術株式会社 | インライン型cvd装置 |
JPH11238785A (ja) * | 1998-02-19 | 1999-08-31 | Sharp Corp | 基板処理装置及び基板処理方法 |
JP3629371B2 (ja) * | 1998-10-29 | 2005-03-16 | シャープ株式会社 | 成膜装置および成膜方法 |
JP4614529B2 (ja) * | 2000-12-07 | 2011-01-19 | キヤノンアネルバ株式会社 | インライン式基板処理装置 |
JP2002309372A (ja) * | 2001-04-13 | 2002-10-23 | Canon Inc | インライン式成膜装置、成膜方法及び液晶素子 |
JP2003258058A (ja) | 2002-02-27 | 2003-09-12 | Anelva Corp | 基板処理装置の運転方法 |
JP4478376B2 (ja) | 2002-08-27 | 2010-06-09 | 株式会社アルバック | 縦型化学気相成長装置及び該装置を用いた成膜方法 |
JP4023543B2 (ja) | 2003-05-29 | 2007-12-19 | 東京エレクトロン株式会社 | 基板搬送装置および基板搬送方法ならびに真空処理装置 |
JP4417734B2 (ja) | 2004-01-20 | 2010-02-17 | 株式会社アルバック | インライン式真空処理装置 |
JP2005258058A (ja) * | 2004-03-11 | 2005-09-22 | Toyo Commun Equip Co Ltd | 3波長合成デバイスとこれを用いた投写型投影装置 |
JP4713497B2 (ja) * | 2004-11-22 | 2011-06-29 | シャープ株式会社 | 基板保持装置および基板処理装置ならびに液晶表示装置 |
JP5046882B2 (ja) * | 2007-11-21 | 2012-10-10 | 三菱重工業株式会社 | インライン式成膜装置 |
-
2007
- 2007-04-11 WO PCT/JP2007/057968 patent/WO2007123032A1/ja active Application Filing
- 2007-04-11 EP EP07741404.3A patent/EP2009685A4/en not_active Withdrawn
- 2007-04-11 KR KR1020087019485A patent/KR101003515B1/ko active IP Right Grant
- 2007-04-11 JP JP2008512072A patent/JP4888917B2/ja active Active
- 2007-04-11 US US12/226,364 patent/US8128793B2/en not_active Expired - Fee Related
- 2007-04-11 CN CN2007800072173A patent/CN101395711B/zh active Active
- 2007-04-16 TW TW096113291A patent/TWI351376B/zh active
Non-Patent Citations (1)
Title |
---|
JP平11-238785A 1999.08.31 |
Also Published As
Publication number | Publication date |
---|---|
US20090139864A1 (en) | 2009-06-04 |
JPWO2007123032A1 (ja) | 2009-09-03 |
JP4888917B2 (ja) | 2012-02-29 |
TW200744928A (en) | 2007-12-16 |
TWI351376B (en) | 2011-11-01 |
EP2009685A4 (en) | 2013-05-22 |
WO2007123032A1 (ja) | 2007-11-01 |
US8128793B2 (en) | 2012-03-06 |
KR20080095247A (ko) | 2008-10-28 |
KR101003515B1 (ko) | 2010-12-30 |
CN101395711A (zh) | 2009-03-25 |
EP2009685A1 (en) | 2008-12-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101395711B (zh) | 纵式基板运送装置及成膜装置 | |
JP4526151B2 (ja) | 基板処理装置の基板移載装置 | |
JP4642619B2 (ja) | 基板処理システム及び方法 | |
JPH05304112A (ja) | 真空処理装置 | |
JPH09223727A (ja) | 半導体処理装置、その基板交換機構及び基板交換方法 | |
JP2011124565A (ja) | 半導体被処理基板の真空処理システム及び半導体被処理基板の真空処理方法 | |
JP4227623B2 (ja) | 半導体処理装置 | |
US20090266410A1 (en) | Vacuum processing apparatus, vacuum processing method, electronic device, and electronic device manufacturing method | |
TWI512878B (zh) | 基片加工設備 | |
TWI379132B (zh) | ||
JP2688555B2 (ja) | マルチチャンバシステム | |
JP2015154083A (ja) | 基板搬送ロボット及びそれを用いた基板処理装置 | |
TW201212147A (en) | Substrate processing apparatus and substrate processing system | |
JPH0294647A (ja) | ウェーハ処理装置 | |
JPH0242901B2 (zh) | ||
JPH03155619A (ja) | 真空処理装置 | |
KR101028409B1 (ko) | 세미 배치 타입 프로세스 모듈 및 이를 구비하는 원자층 증착장치 | |
JP3816929B2 (ja) | 半導体処理装置 | |
JP3121022B2 (ja) | 減圧処理装置 | |
TW202036766A (zh) | 負載鎖定室 | |
KR20040057144A (ko) | 인라인 방식의 기판처리장치 | |
JPH01253237A (ja) | 真空処理装置 | |
JP2001077172A (ja) | 基板の処理装置、基板の搬送体、並びに電子部品の製造方法 | |
JPH0669317A (ja) | 搬送用ロボット | |
JP3971081B2 (ja) | 真空処理装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |