CN101393877A - 制造半导体器件的方法 - Google Patents

制造半导体器件的方法 Download PDF

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Publication number
CN101393877A
CN101393877A CNA2008101612052A CN200810161205A CN101393877A CN 101393877 A CN101393877 A CN 101393877A CN A2008101612052 A CNA2008101612052 A CN A2008101612052A CN 200810161205 A CN200810161205 A CN 200810161205A CN 101393877 A CN101393877 A CN 101393877A
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China
Prior art keywords
metal layer
support plate
internal connection
semiconductor device
forming
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Pending
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CNA2008101612052A
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English (en)
Chinese (zh)
Inventor
町田洋弘
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Shinko Electric Industries Co Ltd
Shinko Electric Co Ltd
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Shinko Electric Co Ltd
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Publication of CN101393877A publication Critical patent/CN101393877A/zh
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
CNA2008101612052A 2007-09-18 2008-09-18 制造半导体器件的方法 Pending CN101393877A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007241375 2007-09-18
JP2007241375A JP5064158B2 (ja) 2007-09-18 2007-09-18 半導体装置とその製造方法

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US (1) US7615408B2 (enExample)
EP (1) EP2040294B1 (enExample)
JP (1) JP5064158B2 (enExample)
KR (1) KR20090029646A (enExample)
CN (1) CN101393877A (enExample)
TW (1) TW200917365A (enExample)

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CN102280426A (zh) * 2010-06-11 2011-12-14 卡西欧计算机株式会社 半导体器件及其制造方法
CN103205701A (zh) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 蒸镀掩模板及其制作方法

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WO2010070964A1 (ja) * 2008-12-16 2010-06-24 株式会社村田製作所 回路モジュール及びその管理方法
JP5160498B2 (ja) * 2009-05-20 2013-03-13 ルネサスエレクトロニクス株式会社 半導体装置
US9235674B2 (en) * 2013-03-05 2016-01-12 Oracle International Corporation Mitigating electromigration effects using parallel pillars
WO2016179023A1 (en) * 2015-05-01 2016-11-10 Adarza Biosystems, Inc. Methods and devices for the high-volume production of silicon chips with uniform anti-reflective coatings
JP6741264B2 (ja) * 2017-03-31 2020-08-19 国立研究開発法人産業技術総合研究所 ウェハ上のアライメントマークを用いる半導体パッケージの製造方法
CN116504645A (zh) * 2023-05-04 2023-07-28 无锡广芯封装基板有限公司 一种封装基板及其制作方法

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CN103205701A (zh) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 蒸镀掩模板及其制作方法

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