CN101312169B - 半导体模块、半导体模块的制造方法以及便携式设备 - Google Patents

半导体模块、半导体模块的制造方法以及便携式设备 Download PDF

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Publication number
CN101312169B
CN101312169B CN2008101428105A CN200810142810A CN101312169B CN 101312169 B CN101312169 B CN 101312169B CN 2008101428105 A CN2008101428105 A CN 2008101428105A CN 200810142810 A CN200810142810 A CN 200810142810A CN 101312169 B CN101312169 B CN 101312169B
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semiconductor module
jut
semiconductor
protrusion
electrode
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CN101312169A (zh
Inventor
柳瀬康行
冈山芳央
柴田清司
井上恭典
水原秀树
臼井良辅
山本哲也
吉井益良男
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Sanyo Electric Co Ltd
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Sanyo Electric Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0236—Shape of the insulating layers therebetween
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
CN2008101428105A 2007-01-31 2008-01-31 半导体模块、半导体模块的制造方法以及便携式设备 Active CN101312169B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP020540/07 2007-01-31
JP2007020540 2007-01-31
JP090375/07 2007-03-30
JP2007090375 2007-03-30
JP013191/08 2008-01-23
JP2008013191A JP5118982B2 (ja) 2007-01-31 2008-01-23 半導体モジュールおよびその製造方法

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CN2011101894506A Division CN102254874A (zh) 2007-01-31 2008-01-31 半导体模块、半导体模块的制造方法以及便携式设备

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CN101312169A CN101312169A (zh) 2008-11-26
CN101312169B true CN101312169B (zh) 2011-12-28

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CN2011101894506A Pending CN102254874A (zh) 2007-01-31 2008-01-31 半导体模块、半导体模块的制造方法以及便携式设备

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CN (2) CN101312169B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4972633B2 (ja) * 2008-12-11 2012-07-11 日東電工株式会社 半導体装置の製造方法
JP2010199148A (ja) * 2009-02-23 2010-09-09 Fujikura Ltd 半導体センサデバイス及びその製造方法、パッケージ及びその製造方法、モジュール及びその製造方法、並びに電子機器
JP2010238996A (ja) * 2009-03-31 2010-10-21 Sanyo Electric Co Ltd 半導体モジュールの製造方法
JP5830702B2 (ja) 2010-04-28 2015-12-09 パナソニックＩｐマネジメント株式会社 回路装置の製造方法
JP5607994B2 (ja) * 2010-06-15 2014-10-15 ルネサスエレクトロニクス株式会社 半導体集積回路装置およびその製造方法
WO2014132937A1 (ja) 2013-02-28 2014-09-04 株式会社村田製作所 Ｅｓｄ保護デバイス
CN105051887B (zh) 2013-02-28 2018-04-17 株式会社村田制作所 半导体装置
JP6102398B2 (ja) * 2013-03-26 2017-03-29 セイコーエプソン株式会社 半導体装置
WO2014162795A1 (ja) 2013-04-05 2014-10-09 株式会社村田製作所 Ｅｓｄ保護デバイス
CN106252315B (zh) * 2015-06-13 2019-07-02 中芯国际集成电路制造(上海)有限公司 封装结构及其制造方法
WO2018198199A1 (ja) * 2017-04-25 2018-11-01 三菱電機株式会社 半導体装置
JP7088224B2 (ja) * 2019-03-19 2022-06-21 株式会社デンソー 半導体モジュールおよびこれに用いられる半導体装置
KR102727977B1 (ko) * 2019-11-14 2024-11-07 현대자동차주식회사 전력모듈에 적용되는 기판 구조
CN113078149B (zh) * 2021-03-12 2023-11-10 上海易卜半导体有限公司 半导体封装结构、方法、器件和电子产品

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1375869A (zh) * 2001-03-19 2002-10-23 卡西欧计算机株式会社 半导体器件及其制造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001223287A (ja) * 2000-02-07 2001-08-17 Mitsui High Tec Inc インターポーザーの製造方法
JP2002170839A (ja) * 2000-11-30 2002-06-14 Nec Corp 半導体装置とその製造方法及び半導体装置の実装構造とその実装方法
JP2002313992A (ja) * 2001-04-16 2002-10-25 Sharp Corp 半導体装置およびその製造方法
JP4397583B2 (ja) * 2002-12-24 2010-01-13 株式会社フジクラ 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1375869A (zh) * 2001-03-19 2002-10-23 卡西欧计算机株式会社 半导体器件及其制造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2005-93652A 2005.04.07

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CN102254874A (zh) 2011-11-23
CN101312169A (zh) 2008-11-26
JP2008277742A (ja) 2008-11-13
JP5118982B2 (ja) 2013-01-16

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