CN101281367A - 阻焊剂组合物及其固化物 - Google Patents
阻焊剂组合物及其固化物 Download PDFInfo
- Publication number
- CN101281367A CN101281367A CNA2008100906190A CN200810090619A CN101281367A CN 101281367 A CN101281367 A CN 101281367A CN A2008100906190 A CNA2008100906190 A CN A2008100906190A CN 200810090619 A CN200810090619 A CN 200810090619A CN 101281367 A CN101281367 A CN 101281367A
- Authority
- CN
- China
- Prior art keywords
- solder resist
- reaction
- epoxy
- molecule
- resist composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/062—Polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4292—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with monocarboxylic acids
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-100684 | 2007-04-06 | ||
JP2007100684A JP4994922B2 (ja) | 2007-04-06 | 2007-04-06 | ソルダーレジスト組成物およびその硬化物 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101281367A true CN101281367A (zh) | 2008-10-08 |
CN101281367B CN101281367B (zh) | 2011-07-06 |
Family
ID=39980669
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008100906190A Active CN101281367B (zh) | 2007-04-06 | 2008-04-02 | 阻焊剂组合物及其固化物 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4994922B2 (zh) |
KR (1) | KR100973643B1 (zh) |
CN (1) | CN101281367B (zh) |
HK (1) | HK1121816A1 (zh) |
TW (1) | TWI399614B (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101980081A (zh) * | 2010-02-17 | 2011-02-23 | 太阳控股株式会社 | 阻焊剂组合物和印刷电路板 |
CN102844711A (zh) * | 2010-03-31 | 2012-12-26 | 太阳控股株式会社 | 阻焊剂组合物以及印刷电路板 |
CN103358632A (zh) * | 2012-03-30 | 2013-10-23 | 太阳油墨制造株式会社 | 层叠结构体、干膜以及层叠结构体的制造方法 |
CN103676475A (zh) * | 2012-09-24 | 2014-03-26 | 株式会社田村制作所 | 黑色固化性树脂组合物 |
CN103676285A (zh) * | 2013-12-31 | 2014-03-26 | 京东方科技集团股份有限公司 | 覆晶薄膜以及液晶显示装置 |
CN104350421A (zh) * | 2012-05-29 | 2015-02-11 | 太阳油墨制造株式会社 | 感光性组合物及具有其固化层的印刷电路板 |
CN107329368A (zh) * | 2017-07-05 | 2017-11-07 | 江苏广信感光新材料股份有限公司 | 一种碱可溶感光性组合物及其制备方法与应用 |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5061938B2 (ja) * | 2008-02-14 | 2012-10-31 | 日立化成工業株式会社 | 感光性樹脂組成物、並びにこれを用いた感光性エレメント及び永久マスクレジスト |
JP2010235799A (ja) * | 2009-03-31 | 2010-10-21 | Taiyo Ink Mfg Ltd | 硬化性樹脂組成物およびそれを用いたプリント配線板と反射板 |
JP6054012B2 (ja) * | 2009-03-31 | 2016-12-27 | 太陽ホールディングス株式会社 | 硬化性樹脂組成物およびそれを用いたプリント配線板と反射板 |
JP5352340B2 (ja) * | 2009-05-13 | 2013-11-27 | 株式会社タムラ製作所 | 感光性樹脂組成物、プリント配線板用のソルダーレジスト組成物およびプリント配線板 |
WO2011030580A1 (ja) * | 2009-09-10 | 2011-03-17 | 積水化学工業株式会社 | 感光性組成物及びプリント配線板 |
JP5325805B2 (ja) * | 2010-01-29 | 2013-10-23 | 株式会社タムラ製作所 | 感光性樹脂組成物およびその硬化膜を用いたプリント配線板 |
JP2011170050A (ja) * | 2010-02-17 | 2011-09-01 | Taiyo Holdings Co Ltd | ソルダーレジスト組成物およびプリント配線板 |
JP6061440B2 (ja) * | 2010-02-25 | 2017-01-18 | 太陽ホールディングス株式会社 | ポリエステル基材用樹脂組成物、それを用いたドライフィルム及びプリント配線板 |
JP2011227308A (ja) * | 2010-04-20 | 2011-11-10 | Taiyo Holdings Co Ltd | ソルダーレジスト組成物およびプリント配線板 |
JP5820568B2 (ja) * | 2010-03-31 | 2015-11-24 | 太陽ホールディングス株式会社 | 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板 |
JP2011215384A (ja) * | 2010-03-31 | 2011-10-27 | Taiyo Holdings Co Ltd | ソルダーレジスト組成物およびプリント配線板 |
JP5566200B2 (ja) | 2010-06-18 | 2014-08-06 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
WO2013171888A1 (ja) * | 2012-05-17 | 2013-11-21 | 太陽インキ製造株式会社 | アルカリ現像型の熱硬化性樹脂組成物、プリント配線板 |
JP5766671B2 (ja) * | 2012-09-05 | 2015-08-19 | 株式会社タムラ製作所 | 黒色硬化性樹脂組成物およびそれを用いたプリント配線基板 |
JP5450763B2 (ja) * | 2012-10-26 | 2014-03-26 | 太陽ホールディングス株式会社 | 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板 |
JP2013033282A (ja) * | 2012-10-26 | 2013-02-14 | Taiyo Holdings Co Ltd | 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板 |
JP5876862B2 (ja) * | 2013-12-03 | 2016-03-02 | 太陽ホールディングス株式会社 | ポリエステル基材用樹脂組成物、それを用いたドライフィルム及びプリント配線板 |
JP6019065B2 (ja) * | 2014-07-08 | 2016-11-02 | 太陽ホールディングス株式会社 | ソルダーレジスト組成物およびプリント配線板 |
JP6448447B2 (ja) | 2015-04-07 | 2019-01-09 | 日本化薬株式会社 | 白色活性エネルギー線硬化性樹脂組成物 |
JP6078595B2 (ja) * | 2015-07-27 | 2017-02-08 | 太陽ホールディングス株式会社 | 硬化性樹脂組成物およびそれを用いたプリント配線板と反射板 |
JP6421092B2 (ja) * | 2015-07-31 | 2018-11-07 | 日立オートモティブシステムズ株式会社 | 物理量検出装置 |
JP6607811B2 (ja) * | 2016-03-11 | 2019-11-20 | マクセルホールディングス株式会社 | メッキ部品の製造方法、メッキ部品、触媒活性妨害剤及び無電解メッキ用複合材料 |
JP6783600B2 (ja) * | 2016-09-20 | 2020-11-11 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、プリント配線板、および、プリント配線板の製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03191352A (ja) * | 1989-12-15 | 1991-08-21 | W R Grace & Co | 感光性樹脂組成物 |
TW494276B (en) * | 1999-05-06 | 2002-07-11 | Solar Blak Water Co Ltd | Solder resist ink composition |
JP4768924B2 (ja) * | 2001-03-30 | 2011-09-07 | 互応化学工業株式会社 | フォトソルダーレジストインク |
JP4328645B2 (ja) * | 2004-02-26 | 2009-09-09 | 太陽インキ製造株式会社 | 光硬化性・熱硬化性樹脂組成物及びそれを用いたプリント配線板 |
JP4339805B2 (ja) * | 2004-03-16 | 2009-10-07 | 株式会社日本触媒 | 画像形成用感光性樹脂組成物 |
JP4709747B2 (ja) * | 2004-03-31 | 2011-06-22 | 太陽ホールディングス株式会社 | 活性エネルギー線硬化性樹脂、それを含有する光硬化性・熱硬化性樹脂組成物及びその硬化物 |
JP4587865B2 (ja) * | 2004-04-22 | 2010-11-24 | 昭和電工株式会社 | 感光性樹脂組成物及びその硬化物並びにそれらを使用するプリント配線基板の製造方法 |
TW200613903A (en) * | 2004-05-26 | 2006-05-01 | Showa Denko Kk | Photosensitive resin composition, and cured product and use thereof |
JP2006040935A (ja) | 2004-07-22 | 2006-02-09 | Taiyo Ink Mfg Ltd | 光硬化性・熱硬化性の艶消しソルダーレジストインキ組成物及びそれを用いたプリント配線板 |
JP4501662B2 (ja) * | 2004-12-06 | 2010-07-14 | 東亞合成株式会社 | 感光性組成物及びソルダーレジスト |
-
2007
- 2007-04-06 JP JP2007100684A patent/JP4994922B2/ja active Active
-
2008
- 2008-04-02 CN CN2008100906190A patent/CN101281367B/zh active Active
- 2008-04-03 TW TW097112317A patent/TWI399614B/zh active
- 2008-04-04 KR KR1020080031820A patent/KR100973643B1/ko active IP Right Grant
-
2009
- 2009-02-26 HK HK09101843.8A patent/HK1121816A1/xx unknown
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101980081A (zh) * | 2010-02-17 | 2011-02-23 | 太阳控股株式会社 | 阻焊剂组合物和印刷电路板 |
CN102844711A (zh) * | 2010-03-31 | 2012-12-26 | 太阳控股株式会社 | 阻焊剂组合物以及印刷电路板 |
CN103358632A (zh) * | 2012-03-30 | 2013-10-23 | 太阳油墨制造株式会社 | 层叠结构体、干膜以及层叠结构体的制造方法 |
CN103358632B (zh) * | 2012-03-30 | 2015-10-28 | 太阳油墨制造株式会社 | 层叠结构体、干膜以及层叠结构体的制造方法 |
US9497856B2 (en) | 2012-03-30 | 2016-11-15 | Taiyo Ink Mfg. Co., Ltd. | Laminated structure, dry film and method of producing laminated structure |
CN104350421A (zh) * | 2012-05-29 | 2015-02-11 | 太阳油墨制造株式会社 | 感光性组合物及具有其固化层的印刷电路板 |
CN104350421B (zh) * | 2012-05-29 | 2019-06-04 | 太阳油墨制造株式会社 | 感光性组合物及具有其固化层的印刷电路板 |
CN103676475A (zh) * | 2012-09-24 | 2014-03-26 | 株式会社田村制作所 | 黑色固化性树脂组合物 |
CN103676475B (zh) * | 2012-09-24 | 2019-05-07 | 株式会社田村制作所 | 黑色固化性树脂组合物 |
CN103676285A (zh) * | 2013-12-31 | 2014-03-26 | 京东方科技集团股份有限公司 | 覆晶薄膜以及液晶显示装置 |
CN107329368A (zh) * | 2017-07-05 | 2017-11-07 | 江苏广信感光新材料股份有限公司 | 一种碱可溶感光性组合物及其制备方法与应用 |
Also Published As
Publication number | Publication date |
---|---|
KR20080091035A (ko) | 2008-10-09 |
CN101281367B (zh) | 2011-07-06 |
KR100973643B1 (ko) | 2010-08-02 |
TWI399614B (zh) | 2013-06-21 |
HK1121816A1 (en) | 2009-04-30 |
TW200905384A (en) | 2009-02-01 |
JP2008257044A (ja) | 2008-10-23 |
JP4994922B2 (ja) | 2012-08-08 |
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