CN101261973B - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN101261973B
CN101261973B CN2008100825992A CN200810082599A CN101261973B CN 101261973 B CN101261973 B CN 101261973B CN 2008100825992 A CN2008100825992 A CN 2008100825992A CN 200810082599 A CN200810082599 A CN 200810082599A CN 101261973 B CN101261973 B CN 101261973B
Authority
CN
China
Prior art keywords
signal
inner lead
leads
interval
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008100825992A
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English (en)
Chinese (zh)
Other versions
CN101261973A (zh
Inventor
三角和幸
畑内和士
高田泰纪
安田直世
新川秀之
福留胜幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Publication of CN101261973A publication Critical patent/CN101261973A/zh
Application granted granted Critical
Publication of CN101261973B publication Critical patent/CN101261973B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/435—Shapes or dispositions of insulating layers on leadframes, e.g. bridging members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/223—Differential pair signal lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
CN2008100825992A 2007-03-06 2008-03-05 半导体装置 Expired - Fee Related CN101261973B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007055247A JP2008218776A (ja) 2007-03-06 2007-03-06 半導体装置
JP2007-055247 2007-03-06
JP2007055247 2007-03-06

Publications (2)

Publication Number Publication Date
CN101261973A CN101261973A (zh) 2008-09-10
CN101261973B true CN101261973B (zh) 2011-12-21

Family

ID=39740812

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008100825992A Expired - Fee Related CN101261973B (zh) 2007-03-06 2008-03-05 半导体装置

Country Status (4)

Country Link
US (1) US7763966B2 (https=)
JP (1) JP2008218776A (https=)
CN (1) CN101261973B (https=)
TW (1) TW200845342A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5499696B2 (ja) 2009-12-25 2014-05-21 富士通セミコンダクター株式会社 半導体装置及び実装構造
CN104851863B (zh) * 2015-04-17 2017-11-28 华为技术有限公司 一种集成电路、引线键合封装芯片及倒装封装芯片
JP7001826B2 (ja) * 2018-07-12 2022-01-20 ローム株式会社 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6538336B1 (en) * 2000-11-14 2003-03-25 Rambus Inc. Wirebond assembly for high-speed integrated circuits

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5530210A (en) * 1978-08-25 1980-03-04 Hitachi Ltd Transistor amplifier circuit
JP2580674B2 (ja) 1988-02-08 1997-02-12 三菱電機株式会社 高周波用モールド型パッケージ
JP2880734B2 (ja) * 1989-08-31 1999-04-12 株式会社東芝 集積回路及びその接続回路
JPH0714976A (ja) 1993-06-24 1995-01-17 Shinko Electric Ind Co Ltd リードフレーム及び半導体装置
US5343074A (en) * 1993-10-04 1994-08-30 Motorola, Inc. Semiconductor device having voltage distribution ring(s) and method for making the same
JP2866572B2 (ja) * 1994-02-07 1999-03-08 三菱電機株式会社 半導体製造方法
KR0148077B1 (ko) * 1994-08-16 1998-08-01 김광호 분리된 다이 패드를 갖는 반도체 패키지
US5949132A (en) * 1995-05-02 1999-09-07 Texas Instruments Incorporated Dambarless leadframe for molded component encapsulation
EP0848423B1 (en) * 1996-07-03 2006-03-01 Seiko Epson Corporation Resin-encapsulated semiconductor device and method of manufacturing the same
US6118173A (en) * 1996-11-14 2000-09-12 Nippon Steel Semiconductor Corporation Lead frame and a semiconductor device
US5903050A (en) * 1998-04-30 1999-05-11 Lsi Logic Corporation Semiconductor package having capacitive extension spokes and method for making the same
JP4373531B2 (ja) * 1999-06-18 2009-11-25 パナソニック株式会社 差動平衡信号伝送基板
JP2001102488A (ja) * 1999-09-28 2001-04-13 Hitachi Cable Ltd 半導体装置
US6198163B1 (en) * 1999-10-18 2001-03-06 Amkor Technology, Inc. Thin leadframe-type semiconductor package having heat sink with recess and exposed surface
JP2002084107A (ja) * 2000-07-04 2002-03-22 Matsushita Electric Ind Co Ltd 伝送線路を有する多層配線基板
JP4319339B2 (ja) * 2000-08-30 2009-08-26 株式会社ルネサステクノロジ 半導体装置
TW490826B (en) * 2001-05-02 2002-06-11 Siliconware Precision Industries Co Ltd Semiconductor package device and its manufacture method
US6903448B1 (en) * 2002-11-12 2005-06-07 Marvell International Ltd. High performance leadframe in electronic package
US6992377B2 (en) * 2004-02-26 2006-01-31 Freescale Semiconductor, Inc. Semiconductor package with crossing conductor assembly and method of manufacture
JP2006220453A (ja) * 2005-02-08 2006-08-24 Denso Corp 加速度センサ装置
EP1746648A3 (en) * 2005-07-22 2008-09-03 Marvell World Trade Ltd. Packaging for high speed integrated circuits
US7479680B2 (en) * 2005-11-30 2009-01-20 California Micro Devices Method and apparatus that provides differential connections with improved ESD protection and routing
US8294249B2 (en) * 2008-08-05 2012-10-23 Integrated Device Technology Inc. Lead frame package

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6538336B1 (en) * 2000-11-14 2003-03-25 Rambus Inc. Wirebond assembly for high-speed integrated circuits

Also Published As

Publication number Publication date
US20080217750A1 (en) 2008-09-11
US7763966B2 (en) 2010-07-27
JP2008218776A (ja) 2008-09-18
CN101261973A (zh) 2008-09-10
TW200845342A (en) 2008-11-16

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: RENESAS ELECTRONICS

Free format text: FORMER OWNER: RENESAS TECHNOLOGY CORP.

Effective date: 20100920

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: TOKYO, JAPAN TO: KAWASAKI CITY, KANAGAWA PREFECTURE, JAPAN

TA01 Transfer of patent application right

Effective date of registration: 20100920

Address after: Kawasaki, Kanagawa, Japan

Applicant after: Renesas Electronics Corporation

Address before: Tokyo, Japan, Japan

Applicant before: Renesas Technology Corp.

C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20111221

Termination date: 20140305