TW200845342A - Semiconductor device - Google Patents

Semiconductor device Download PDF

Info

Publication number
TW200845342A
TW200845342A TW097107439A TW97107439A TW200845342A TW 200845342 A TW200845342 A TW 200845342A TW 097107439 A TW097107439 A TW 097107439A TW 97107439 A TW97107439 A TW 97107439A TW 200845342 A TW200845342 A TW 200845342A
Authority
TW
Taiwan
Prior art keywords
lead
wafer
pad
semiconductor device
internal
Prior art date
Application number
TW097107439A
Other languages
English (en)
Chinese (zh)
Inventor
Kazuyuki Misumi
Kazushi Hatauchi
Yasuki Takata
Naoya Yasuda
Hideyuki Arakawa
Fukudome Katsuyuki
Original Assignee
Renesas Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Tech Corp filed Critical Renesas Tech Corp
Publication of TW200845342A publication Critical patent/TW200845342A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/435—Shapes or dispositions of insulating layers on leadframes, e.g. bridging members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/223—Differential pair signal lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
TW097107439A 2007-03-06 2008-03-04 Semiconductor device TW200845342A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007055247A JP2008218776A (ja) 2007-03-06 2007-03-06 半導体装置

Publications (1)

Publication Number Publication Date
TW200845342A true TW200845342A (en) 2008-11-16

Family

ID=39740812

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097107439A TW200845342A (en) 2007-03-06 2008-03-04 Semiconductor device

Country Status (4)

Country Link
US (1) US7763966B2 (https=)
JP (1) JP2008218776A (https=)
CN (1) CN101261973B (https=)
TW (1) TW200845342A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5499696B2 (ja) 2009-12-25 2014-05-21 富士通セミコンダクター株式会社 半導体装置及び実装構造
CN104851863B (zh) * 2015-04-17 2017-11-28 华为技术有限公司 一种集成电路、引线键合封装芯片及倒装封装芯片
JP7001826B2 (ja) * 2018-07-12 2022-01-20 ローム株式会社 半導体装置

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5530210A (en) * 1978-08-25 1980-03-04 Hitachi Ltd Transistor amplifier circuit
JP2580674B2 (ja) 1988-02-08 1997-02-12 三菱電機株式会社 高周波用モールド型パッケージ
JP2880734B2 (ja) * 1989-08-31 1999-04-12 株式会社東芝 集積回路及びその接続回路
JPH0714976A (ja) 1993-06-24 1995-01-17 Shinko Electric Ind Co Ltd リードフレーム及び半導体装置
US5343074A (en) * 1993-10-04 1994-08-30 Motorola, Inc. Semiconductor device having voltage distribution ring(s) and method for making the same
JP2866572B2 (ja) * 1994-02-07 1999-03-08 三菱電機株式会社 半導体製造方法
KR0148077B1 (ko) * 1994-08-16 1998-08-01 김광호 분리된 다이 패드를 갖는 반도체 패키지
US5949132A (en) * 1995-05-02 1999-09-07 Texas Instruments Incorporated Dambarless leadframe for molded component encapsulation
EP0848423B1 (en) * 1996-07-03 2006-03-01 Seiko Epson Corporation Resin-encapsulated semiconductor device and method of manufacturing the same
US6118173A (en) * 1996-11-14 2000-09-12 Nippon Steel Semiconductor Corporation Lead frame and a semiconductor device
US5903050A (en) * 1998-04-30 1999-05-11 Lsi Logic Corporation Semiconductor package having capacitive extension spokes and method for making the same
JP4373531B2 (ja) * 1999-06-18 2009-11-25 パナソニック株式会社 差動平衡信号伝送基板
JP2001102488A (ja) * 1999-09-28 2001-04-13 Hitachi Cable Ltd 半導体装置
US6198163B1 (en) * 1999-10-18 2001-03-06 Amkor Technology, Inc. Thin leadframe-type semiconductor package having heat sink with recess and exposed surface
JP2002084107A (ja) * 2000-07-04 2002-03-22 Matsushita Electric Ind Co Ltd 伝送線路を有する多層配線基板
JP4319339B2 (ja) * 2000-08-30 2009-08-26 株式会社ルネサステクノロジ 半導体装置
US6538336B1 (en) * 2000-11-14 2003-03-25 Rambus Inc. Wirebond assembly for high-speed integrated circuits
TW490826B (en) * 2001-05-02 2002-06-11 Siliconware Precision Industries Co Ltd Semiconductor package device and its manufacture method
US6903448B1 (en) * 2002-11-12 2005-06-07 Marvell International Ltd. High performance leadframe in electronic package
US6992377B2 (en) * 2004-02-26 2006-01-31 Freescale Semiconductor, Inc. Semiconductor package with crossing conductor assembly and method of manufacture
JP2006220453A (ja) * 2005-02-08 2006-08-24 Denso Corp 加速度センサ装置
EP1746648A3 (en) * 2005-07-22 2008-09-03 Marvell World Trade Ltd. Packaging for high speed integrated circuits
US7479680B2 (en) * 2005-11-30 2009-01-20 California Micro Devices Method and apparatus that provides differential connections with improved ESD protection and routing
US8294249B2 (en) * 2008-08-05 2012-10-23 Integrated Device Technology Inc. Lead frame package

Also Published As

Publication number Publication date
US20080217750A1 (en) 2008-09-11
US7763966B2 (en) 2010-07-27
JP2008218776A (ja) 2008-09-18
CN101261973A (zh) 2008-09-10
CN101261973B (zh) 2011-12-21

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