JP2008218776A - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP2008218776A
JP2008218776A JP2007055247A JP2007055247A JP2008218776A JP 2008218776 A JP2008218776 A JP 2008218776A JP 2007055247 A JP2007055247 A JP 2007055247A JP 2007055247 A JP2007055247 A JP 2007055247A JP 2008218776 A JP2008218776 A JP 2008218776A
Authority
JP
Japan
Prior art keywords
lead
inner leads
differential signal
pad
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007055247A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008218776A5 (https=
Inventor
Kazuyuki Misumi
和幸 三角
Kazushi Hatauchi
和士 畑内
Yasunori Takada
泰紀 高田
Naotsugu Yasuda
直世 安田
Hideyuki Shinkawa
秀之 新川
Katsuyuki Fukutome
勝幸 福留
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2007055247A priority Critical patent/JP2008218776A/ja
Priority to TW097107439A priority patent/TW200845342A/zh
Priority to US12/073,384 priority patent/US7763966B2/en
Priority to CN2008100825992A priority patent/CN101261973B/zh
Publication of JP2008218776A publication Critical patent/JP2008218776A/ja
Publication of JP2008218776A5 publication Critical patent/JP2008218776A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/435—Shapes or dispositions of insulating layers on leadframes, e.g. bridging members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/223—Differential pair signal lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2007055247A 2007-03-06 2007-03-06 半導体装置 Pending JP2008218776A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007055247A JP2008218776A (ja) 2007-03-06 2007-03-06 半導体装置
TW097107439A TW200845342A (en) 2007-03-06 2008-03-04 Semiconductor device
US12/073,384 US7763966B2 (en) 2007-03-06 2008-03-05 Resin molded semiconductor device and differential amplifier circuit
CN2008100825992A CN101261973B (zh) 2007-03-06 2008-03-05 半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007055247A JP2008218776A (ja) 2007-03-06 2007-03-06 半導体装置

Publications (2)

Publication Number Publication Date
JP2008218776A true JP2008218776A (ja) 2008-09-18
JP2008218776A5 JP2008218776A5 (https=) 2010-04-08

Family

ID=39740812

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007055247A Pending JP2008218776A (ja) 2007-03-06 2007-03-06 半導体装置

Country Status (4)

Country Link
US (1) US7763966B2 (https=)
JP (1) JP2008218776A (https=)
CN (1) CN101261973B (https=)
TW (1) TW200845342A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011134941A (ja) * 2009-12-25 2011-07-07 Fujitsu Semiconductor Ltd 半導体装置及び実装構造

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104851863B (zh) * 2015-04-17 2017-11-28 华为技术有限公司 一种集成电路、引线键合封装芯片及倒装封装芯片
JP7001826B2 (ja) * 2018-07-12 2022-01-20 ローム株式会社 半導体装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5530210A (en) * 1978-08-25 1980-03-04 Hitachi Ltd Transistor amplifier circuit
JPH0388356A (ja) * 1989-08-31 1991-04-12 Toshiba Corp 集積回路及びその接続回路
JP2001007458A (ja) * 1999-06-18 2001-01-12 Matsushita Electric Ind Co Ltd 差動平衡信号伝送基板
JP2001102488A (ja) * 1999-09-28 2001-04-13 Hitachi Cable Ltd 半導体装置
JP2002076235A (ja) * 2000-08-30 2002-03-15 Hitachi Ltd 半導体装置
JP2002084107A (ja) * 2000-07-04 2002-03-22 Matsushita Electric Ind Co Ltd 伝送線路を有する多層配線基板
JP2007043146A (ja) * 2005-07-22 2007-02-15 Marvell World Trade Ltd 高速集積回路用のパッケージング

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2580674B2 (ja) 1988-02-08 1997-02-12 三菱電機株式会社 高周波用モールド型パッケージ
JPH0714976A (ja) 1993-06-24 1995-01-17 Shinko Electric Ind Co Ltd リードフレーム及び半導体装置
US5343074A (en) * 1993-10-04 1994-08-30 Motorola, Inc. Semiconductor device having voltage distribution ring(s) and method for making the same
JP2866572B2 (ja) * 1994-02-07 1999-03-08 三菱電機株式会社 半導体製造方法
KR0148077B1 (ko) * 1994-08-16 1998-08-01 김광호 분리된 다이 패드를 갖는 반도체 패키지
US5949132A (en) * 1995-05-02 1999-09-07 Texas Instruments Incorporated Dambarless leadframe for molded component encapsulation
EP0848423B1 (en) * 1996-07-03 2006-03-01 Seiko Epson Corporation Resin-encapsulated semiconductor device and method of manufacturing the same
US6118173A (en) * 1996-11-14 2000-09-12 Nippon Steel Semiconductor Corporation Lead frame and a semiconductor device
US5903050A (en) * 1998-04-30 1999-05-11 Lsi Logic Corporation Semiconductor package having capacitive extension spokes and method for making the same
US6198163B1 (en) * 1999-10-18 2001-03-06 Amkor Technology, Inc. Thin leadframe-type semiconductor package having heat sink with recess and exposed surface
US6538336B1 (en) * 2000-11-14 2003-03-25 Rambus Inc. Wirebond assembly for high-speed integrated circuits
TW490826B (en) * 2001-05-02 2002-06-11 Siliconware Precision Industries Co Ltd Semiconductor package device and its manufacture method
US6903448B1 (en) * 2002-11-12 2005-06-07 Marvell International Ltd. High performance leadframe in electronic package
US6992377B2 (en) * 2004-02-26 2006-01-31 Freescale Semiconductor, Inc. Semiconductor package with crossing conductor assembly and method of manufacture
JP2006220453A (ja) * 2005-02-08 2006-08-24 Denso Corp 加速度センサ装置
US7479680B2 (en) * 2005-11-30 2009-01-20 California Micro Devices Method and apparatus that provides differential connections with improved ESD protection and routing
US8294249B2 (en) * 2008-08-05 2012-10-23 Integrated Device Technology Inc. Lead frame package

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5530210A (en) * 1978-08-25 1980-03-04 Hitachi Ltd Transistor amplifier circuit
JPH0388356A (ja) * 1989-08-31 1991-04-12 Toshiba Corp 集積回路及びその接続回路
JP2001007458A (ja) * 1999-06-18 2001-01-12 Matsushita Electric Ind Co Ltd 差動平衡信号伝送基板
JP2001102488A (ja) * 1999-09-28 2001-04-13 Hitachi Cable Ltd 半導体装置
JP2002084107A (ja) * 2000-07-04 2002-03-22 Matsushita Electric Ind Co Ltd 伝送線路を有する多層配線基板
JP2002076235A (ja) * 2000-08-30 2002-03-15 Hitachi Ltd 半導体装置
JP2007043146A (ja) * 2005-07-22 2007-02-15 Marvell World Trade Ltd 高速集積回路用のパッケージング

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011134941A (ja) * 2009-12-25 2011-07-07 Fujitsu Semiconductor Ltd 半導体装置及び実装構造
US8811028B2 (en) 2009-12-25 2014-08-19 Fujitsu Semiconductor Limited Semiconductor device and circuit board

Also Published As

Publication number Publication date
US20080217750A1 (en) 2008-09-11
US7763966B2 (en) 2010-07-27
CN101261973A (zh) 2008-09-10
TW200845342A (en) 2008-11-16
CN101261973B (zh) 2011-12-21

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