CN101211931B - 半导体器件及电子设备 - Google Patents

半导体器件及电子设备 Download PDF

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Publication number
CN101211931B
CN101211931B CN2007101608495A CN200710160849A CN101211931B CN 101211931 B CN101211931 B CN 101211931B CN 2007101608495 A CN2007101608495 A CN 2007101608495A CN 200710160849 A CN200710160849 A CN 200710160849A CN 101211931 B CN101211931 B CN 101211931B
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China
Prior art keywords
terminal
photoelectric conversion
film
semiconductor device
conductive film
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Expired - Fee Related
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CN2007101608495A
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English (en)
Chinese (zh)
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CN101211931A (zh
Inventor
广濑笃志
肉户英明
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Publication of CN101211931A publication Critical patent/CN101211931A/zh
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F30/00Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
    • H10F30/20Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00Arrangements for protection of devices
    • H10W42/60Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/803Pixels having integrated switching, control, storage or amplification elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/95Circuit arrangements
    • H10F77/953Circuit arrangements for devices having potential barriers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors

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  • Solid State Image Pick-Up Elements (AREA)
CN2007101608495A 2006-12-27 2007-12-27 半导体器件及电子设备 Expired - Fee Related CN101211931B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006351877 2006-12-27
JP2006351877 2006-12-27
JP2006-351877 2006-12-27

Publications (2)

Publication Number Publication Date
CN101211931A CN101211931A (zh) 2008-07-02
CN101211931B true CN101211931B (zh) 2011-04-13

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CN2007101608495A Expired - Fee Related CN101211931B (zh) 2006-12-27 2007-12-27 半导体器件及电子设备

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US (1) US7923800B2 (https=)
JP (1) JP5070030B2 (https=)
KR (1) KR101369863B1 (https=)
CN (1) CN101211931B (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100796592B1 (ko) * 2005-08-26 2008-01-21 삼성에스디아이 주식회사 박막트랜지스터 및 그 제조 방법
US8207589B2 (en) * 2007-02-15 2012-06-26 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and electronic device, and method for manufacturing photoelectric conversion device
JP5212686B2 (ja) 2007-08-22 2013-06-19 ソニー株式会社 半導体レーザアレイの製造方法
US8115160B2 (en) * 2008-03-14 2012-02-14 Semiconductor Energy Laboratory Co., Ltd. Protection circuit and photoelectric conversion device
JP5388632B2 (ja) 2008-03-14 2014-01-15 株式会社半導体エネルギー研究所 半導体装置
JP2013093565A (ja) 2011-10-07 2013-05-16 Semiconductor Energy Lab Co Ltd 半導体装置
TWI493685B (zh) 2012-02-10 2015-07-21 E Ink Holdings Inc 主動陣列基板上之靜電防護結構
EP2651035B1 (en) * 2012-04-11 2017-05-03 Imec Low voltage drop unidirectional smart bypass elements
JP2015149414A (ja) * 2014-02-06 2015-08-20 株式会社東芝 半導体装置及び撮像装置
CN105304656B (zh) * 2014-06-23 2018-06-22 上海箩箕技术有限公司 光电传感器
CN104637970B (zh) * 2015-03-03 2018-03-06 京东方科技集团股份有限公司 阵列基板及其制作方法、x射线平板探测器、摄像系统
CN110649068A (zh) * 2019-09-02 2020-01-03 武汉华星光电半导体显示技术有限公司 一种阵列基板及其制备方法
CN110895374A (zh) * 2019-11-26 2020-03-20 上海天马微电子有限公司 显示面板及显示装置
KR20220033596A (ko) * 2020-09-08 2022-03-17 삼성디스플레이 주식회사 다결정 실리콘층의 제조 방법, 표시 장치 및 이의 제조 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060186497A1 (en) * 2005-02-18 2006-08-24 Semiconductor Energy Laboratory Co., Ltd. Photoelectric Conversion Device and Manufacturing Method of the Same, and a Semiconductor Device

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4454418A (en) * 1982-04-26 1984-06-12 Walker Clifford G Integrated optics transducer
JPS61111578A (ja) * 1984-11-05 1986-05-29 Sumitomo Electric Ind Ltd 光受信ic
JPH0691228B2 (ja) * 1986-03-28 1994-11-14 キヤノン株式会社 半導体装置
JP2667432B2 (ja) * 1988-03-19 1997-10-27 株式会社東芝 半導体装置及び固体撮像装置
JPH029176A (ja) * 1988-06-27 1990-01-12 Matsushita Electric Works Ltd 光電変換装置および半導体装置
JPH05244513A (ja) * 1992-02-26 1993-09-21 Canon Inc 光電変換装置及びその駆動方法
JPH06163868A (ja) * 1992-09-28 1994-06-10 Sanyo Electric Co Ltd ホトダイオード内蔵半導体装置
JPH06204446A (ja) * 1993-01-01 1994-07-22 Canon Inc 光電変換素子
JPH06302798A (ja) * 1993-04-19 1994-10-28 Olympus Optical Co Ltd 固体撮像装置
US5654203A (en) * 1993-12-02 1997-08-05 Semiconductor Energy Laboratory, Co., Ltd. Method for manufacturing a thin film transistor using catalyst elements to promote crystallization
JP2797941B2 (ja) * 1993-12-27 1998-09-17 日本電気株式会社 光電変換素子とその駆動方法
JP2000200892A (ja) * 1995-12-22 2000-07-18 Sanyo Electric Co Ltd ホトダイオード内蔵半導体装置
JP4179483B2 (ja) * 1996-02-13 2008-11-12 株式会社半導体エネルギー研究所 表示装置の作製方法
JP2765558B2 (ja) * 1996-04-17 1998-06-18 日本電気株式会社 フィルム・キャリア半導体装置
JP3727416B2 (ja) * 1996-05-31 2005-12-14 株式会社半導体エネルギー研究所 表示装置
JP3444093B2 (ja) * 1996-06-10 2003-09-08 株式会社デンソー 光センサ回路
JP3855351B2 (ja) * 1997-04-10 2006-12-06 株式会社デンソー 光センサ
JP4294745B2 (ja) * 1997-09-26 2009-07-15 株式会社半導体エネルギー研究所 光電変換装置の作製方法
US20040252867A1 (en) * 2000-01-05 2004-12-16 Je-Hsiung Lan Biometric sensor
US6358767B2 (en) * 2000-06-08 2002-03-19 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing semiconductor device
TW582121B (en) * 2001-02-08 2004-04-01 Semiconductor Energy Lab Light emitting device
US6953735B2 (en) * 2001-12-28 2005-10-11 Semiconductor Energy Laboratory Co., Ltd. Method for fabricating a semiconductor device by transferring a layer to a support with curvature
US7372495B2 (en) * 2002-08-23 2008-05-13 Micron Technology, Inc. CMOS aps with stacked avalanche multiplication layer and low voltage readout electronics
US6982406B2 (en) * 2003-04-03 2006-01-03 Pao Jung Chen Simple CMOS light-to-current sensor
US7253391B2 (en) * 2003-09-19 2007-08-07 Semiconductor Energy Laboratory Co., Ltd. Optical sensor device and electronic apparatus
CN100477240C (zh) * 2003-10-06 2009-04-08 株式会社半导体能源研究所 半导体器件以及制造该器件的方法
CN101088144B (zh) * 2004-12-24 2012-03-28 株式会社半导体能源研究所 曝光装置和使用该曝光装置的半导体器件制造方法
JP4697524B2 (ja) 2005-03-30 2011-06-08 ソニー株式会社 アクティブマトリクス型液晶表示装置
US7537976B2 (en) * 2005-05-20 2009-05-26 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of thin film transistor
DE602006001686D1 (de) * 2005-05-23 2008-08-21 Semiconductor Energy Lab Photoelektrische Umwandleranordnung und Verfahren zu ihrer Herstellung
CN101189625B (zh) * 2005-05-31 2011-09-28 株式会社半导体能源研究所 半导体器件及其制造方法以及天线的制造方法
CN101233394B (zh) * 2005-07-27 2014-02-26 株式会社半导体能源研究所 半导体装置
US7635863B2 (en) * 2005-10-18 2009-12-22 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic apparatus having the display device
EP2259213B1 (en) * 2006-02-08 2015-12-23 Semiconductor Energy Laboratory Co., Ltd. RFID device
KR101315282B1 (ko) * 2006-04-27 2013-10-08 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 이를 사용한 전자기기
DE602007002105D1 (de) * 2006-04-28 2009-10-08 Semiconductor Energy Lab Halbleiterbauelement
EP1863091A3 (en) * 2006-05-30 2012-11-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device using the same
US7791012B2 (en) * 2006-09-29 2010-09-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising photoelectric conversion element and high-potential and low-potential electrodes
KR101447044B1 (ko) * 2006-10-31 2014-10-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치
US7759629B2 (en) * 2007-03-20 2010-07-20 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a semiconductor device
WO2008123119A1 (en) * 2007-03-26 2008-10-16 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and electronic device provided with the photoelectric conversion device
WO2009014155A1 (en) * 2007-07-25 2009-01-29 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and electronic device having the same
US8053717B2 (en) * 2008-05-22 2011-11-08 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device having a reference voltage generation circuit with a resistor and a second diode element and electronic device having the same
JP5518381B2 (ja) * 2008-07-10 2014-06-11 株式会社半導体エネルギー研究所 カラーセンサ及び当該カラーセンサを具備する電子機器
US8106346B2 (en) * 2008-09-04 2012-01-31 Semiconductor Energy Laboratory Co., Ltd. Photodetector

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060186497A1 (en) * 2005-02-18 2006-08-24 Semiconductor Energy Laboratory Co., Ltd. Photoelectric Conversion Device and Manufacturing Method of the Same, and a Semiconductor Device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2006-324634A 2006.11.30

Also Published As

Publication number Publication date
JP2008182214A (ja) 2008-08-07
JP5070030B2 (ja) 2012-11-07
KR101369863B1 (ko) 2014-03-05
CN101211931A (zh) 2008-07-02
US7923800B2 (en) 2011-04-12
KR20080061291A (ko) 2008-07-02
US20080156368A1 (en) 2008-07-03

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