CN101138135A - 将柔性印刷电路板连接至另一个电路板的方法 - Google Patents

将柔性印刷电路板连接至另一个电路板的方法 Download PDF

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Publication number
CN101138135A
CN101138135A CNA2006800074738A CN200680007473A CN101138135A CN 101138135 A CN101138135 A CN 101138135A CN A2006800074738 A CNA2006800074738 A CN A2006800074738A CN 200680007473 A CN200680007473 A CN 200680007473A CN 101138135 A CN101138135 A CN 101138135A
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CN
China
Prior art keywords
circuit board
fpc
conductor
adhesive film
connection portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006800074738A
Other languages
English (en)
Chinese (zh)
Inventor
川手恒一郎
佐藤义明
雄二平泽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN101138135A publication Critical patent/CN101138135A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CNA2006800074738A 2005-03-07 2006-03-07 将柔性印刷电路板连接至另一个电路板的方法 Pending CN101138135A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005061858A JP2006245453A (ja) 2005-03-07 2005-03-07 フレキシブルプリント回路基板の他の回路基板への接続方法
JP061858/2005 2005-03-07

Publications (1)

Publication Number Publication Date
CN101138135A true CN101138135A (zh) 2008-03-05

Family

ID=36603345

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006800074738A Pending CN101138135A (zh) 2005-03-07 2006-03-07 将柔性印刷电路板连接至另一个电路板的方法

Country Status (7)

Country Link
US (1) US20080156437A1 (enExample)
EP (1) EP1856770A1 (enExample)
JP (1) JP2006245453A (enExample)
KR (1) KR20070106627A (enExample)
CN (1) CN101138135A (enExample)
TW (1) TW200638823A (enExample)
WO (1) WO2006096631A1 (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103548207A (zh) * 2011-05-18 2014-01-29 日立化成株式会社 电路连接材料、电路部件的连接结构以及电路部件的连接结构的制造方法
CN103607855A (zh) * 2013-10-26 2014-02-26 溧阳市东大技术转移中心有限公司 一种复合挠性基板的制造方法
CN104093799A (zh) * 2012-04-13 2014-10-08 日立化成株式会社 电路连接材料、连接结构体及其制造方法
CN102047778B (zh) * 2008-05-29 2015-01-28 3M创新有限公司 用于将制品粘附到表面上的方法和组件
CN105896135A (zh) * 2015-02-17 2016-08-24 广濑电机株式会社 电连接器与柔性基板的组装体
CN112616244A (zh) * 2020-12-22 2021-04-06 浙江清华柔性电子技术研究院 柔性电路板及柔性电路板制备方法
CN114206015A (zh) * 2020-09-17 2022-03-18 佳胜科技股份有限公司 制造电路板结构的方法

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US7040557B2 (en) * 2001-02-26 2006-05-09 Power Technologies Investment Ltd. System and method for pulverizing and extracting moisture
JP2007005640A (ja) * 2005-06-24 2007-01-11 Three M Innovative Properties Co 回路基板の相互接続方法
JP2008089819A (ja) * 2006-09-29 2008-04-17 Toshiba Matsushita Display Technology Co Ltd フレキシブル基板及びフレキシブル基板を備えた表示装置
JP5087302B2 (ja) * 2007-03-29 2012-12-05 三洋電機株式会社 回路装置およびその製造方法
GB0714723D0 (en) * 2007-07-30 2007-09-12 Pilkington Automotive D Gmbh Improved electrical connector
US9001016B2 (en) * 2007-09-19 2015-04-07 Nvidia Corporation Hardware driven display restore mechanism
JP5909044B2 (ja) * 2011-02-25 2016-04-26 矢崎総業株式会社 コネクタ構造
JP2012199262A (ja) * 2011-03-18 2012-10-18 Seiko Epson Corp 回路基板、接続構造体及び回路基板の接続方法
TWI436718B (zh) * 2012-05-04 2014-05-01 Mutual Tek Ind Co Ltd 複合式電路板的製作方法
DE102013221870B4 (de) * 2013-10-28 2021-09-30 Te Connectivity Germany Gmbh Verbindungsanordnung zur Verbindung mindestens einer als Zelle ausgestalteten Spannungsquelle und/oder -senke mit einem externen elektrischen Bauelement und elektrische Anordnung umfassend eine Verbindungsanordnung
US9460757B2 (en) * 2013-11-04 2016-10-04 HGST Netherlands B.V. Flexible cable assembly having reduced-tolerance electrical connection pads
US10543039B2 (en) * 2014-03-18 2020-01-28 Boston Scientific Scimed, Inc. Nerve ablation devices and related methods of use and manufacture
US11737818B2 (en) * 2018-08-14 2023-08-29 Biosense Webster (Israel) Ltd. Heat transfer during ablation procedures
TWI705748B (zh) * 2019-11-21 2020-09-21 頎邦科技股份有限公司 雙面銅之軟性電路板及其佈線結構
CN120477928A (zh) * 2020-05-08 2025-08-15 圣犹达医疗用品心脏病学部门有限公司 用柔性电路组件形成样条的方法和包括该样条的电极组件
TWI881025B (zh) * 2021-01-25 2025-04-21 優顯科技股份有限公司 電子裝置及其製造方法

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ES8605846A1 (es) * 1984-03-01 1986-04-16 Norton Sa Procedimiento de producir agentes de ensamblado para objetos solidos
JP2833111B2 (ja) * 1989-03-09 1998-12-09 日立化成工業株式会社 回路の接続方法及びそれに用いる接着剤フィルム
JP3238695B2 (ja) * 1990-07-09 2001-12-17 株式会社半導体エネルギー研究所 表示装置及びイメージセンサー装置の作製方法
JP2995993B2 (ja) * 1992-03-16 1999-12-27 日立化成工業株式会社 回路の接続方法
JP2937705B2 (ja) * 1993-08-31 1999-08-23 アルプス電気株式会社 プリント配線板の接続方法
US5728755A (en) * 1995-09-22 1998-03-17 Minnesota Mining And Manufacturing Company Curable epoxy resin compositions with 9,9'-bis(4-aminophenyl)fluorenes as curatives
JPH09194570A (ja) * 1996-01-18 1997-07-29 Minnesota Mining & Mfg Co <3M> エポキシ樹脂組成物、改質エポキシ樹脂組成物およびその製造方法
JP2003100953A (ja) * 2001-06-29 2003-04-04 Hitachi Chem Co Ltd 接着部材
WO2004000966A1 (en) * 2002-06-24 2003-12-31 3M Innovative Properties Company Heat curable adhesive composition, article, semiconductor apparatus and method
US6936644B2 (en) * 2002-10-16 2005-08-30 Cookson Electronics, Inc. Releasable microcapsule and adhesive curing system using the same
JP4152196B2 (ja) * 2003-01-10 2008-09-17 スリーエム イノベイティブ プロパティズ カンパニー 平面多導体の接続方法、該接続方法で接続される部分を含む電気電子部品、該接続方法で接続される平面多導体、および、平面多導体の接続システム
JP4714406B2 (ja) * 2003-03-03 2011-06-29 日立化成工業株式会社 半導体装置用ダイボンディング材及びこれを用いた半導体装置
JP2006140052A (ja) * 2004-11-12 2006-06-01 Three M Innovative Properties Co 熱硬化性接着フィルム付きコネクタ及びそれを用いた接続方法

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102047778B (zh) * 2008-05-29 2015-01-28 3M创新有限公司 用于将制品粘附到表面上的方法和组件
CN103548207B (zh) * 2011-05-18 2017-10-27 日立化成株式会社 电路连接材料、电路部件的连接结构以及电路部件的连接结构的制造方法
CN103548207A (zh) * 2011-05-18 2014-01-29 日立化成株式会社 电路连接材料、电路部件的连接结构以及电路部件的连接结构的制造方法
CN104093799A (zh) * 2012-04-13 2014-10-08 日立化成株式会社 电路连接材料、连接结构体及其制造方法
CN104093799B (zh) * 2012-04-13 2019-04-26 日立化成株式会社 电路连接材料、连接结构体及其制造方法
CN103607855A (zh) * 2013-10-26 2014-02-26 溧阳市东大技术转移中心有限公司 一种复合挠性基板的制造方法
CN103607855B (zh) * 2013-10-26 2016-06-08 溧阳市东大技术转移中心有限公司 一种复合挠性基板的制造方法
CN105896135A (zh) * 2015-02-17 2016-08-24 广濑电机株式会社 电连接器与柔性基板的组装体
CN105896135B (zh) * 2015-02-17 2021-03-26 广濑电机株式会社 电连接器与柔性基板的组装体
CN114206015A (zh) * 2020-09-17 2022-03-18 佳胜科技股份有限公司 制造电路板结构的方法
CN114206015B (zh) * 2020-09-17 2024-10-11 佳胜科技股份有限公司 制造电路板结构的方法
CN112616244A (zh) * 2020-12-22 2021-04-06 浙江清华柔性电子技术研究院 柔性电路板及柔性电路板制备方法
CN112616244B (zh) * 2020-12-22 2022-03-22 浙江清华柔性电子技术研究院 柔性电路板及柔性电路板制备方法

Also Published As

Publication number Publication date
TW200638823A (en) 2006-11-01
KR20070106627A (ko) 2007-11-02
JP2006245453A (ja) 2006-09-14
EP1856770A1 (en) 2007-11-21
US20080156437A1 (en) 2008-07-03
WO2006096631A1 (en) 2006-09-14

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication