JP2006245453A - フレキシブルプリント回路基板の他の回路基板への接続方法 - Google Patents

フレキシブルプリント回路基板の他の回路基板への接続方法 Download PDF

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Publication number
JP2006245453A
JP2006245453A JP2005061858A JP2005061858A JP2006245453A JP 2006245453 A JP2006245453 A JP 2006245453A JP 2005061858 A JP2005061858 A JP 2005061858A JP 2005061858 A JP2005061858 A JP 2005061858A JP 2006245453 A JP2006245453 A JP 2006245453A
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JP
Japan
Prior art keywords
circuit board
fpc
adhesive film
conductor
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005061858A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006245453A5 (enExample
Inventor
Koichiro Kawate
恒一郎 川手
Yoshiaki Sato
義明 佐藤
Yuji Hirasawa
雄二 平澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to JP2005061858A priority Critical patent/JP2006245453A/ja
Priority to TW095107436A priority patent/TW200638823A/zh
Priority to US11/816,124 priority patent/US20080156437A1/en
Priority to KR1020077020348A priority patent/KR20070106627A/ko
Priority to CNA2006800074738A priority patent/CN101138135A/zh
Priority to EP06737119A priority patent/EP1856770A1/en
Priority to PCT/US2006/007903 priority patent/WO2006096631A1/en
Publication of JP2006245453A publication Critical patent/JP2006245453A/ja
Publication of JP2006245453A5 publication Critical patent/JP2006245453A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2005061858A 2005-03-07 2005-03-07 フレキシブルプリント回路基板の他の回路基板への接続方法 Pending JP2006245453A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2005061858A JP2006245453A (ja) 2005-03-07 2005-03-07 フレキシブルプリント回路基板の他の回路基板への接続方法
TW095107436A TW200638823A (en) 2005-03-07 2006-03-06 Method for connecting flexible printed circuit board to another circuit board
US11/816,124 US20080156437A1 (en) 2005-03-07 2006-03-07 Method for Connecting Flexible Printed Circuit Board to Another Circuit Board
KR1020077020348A KR20070106627A (ko) 2005-03-07 2006-03-07 가요성 인쇄 회로 기판과 다른 회로 기판의 접속 방법
CNA2006800074738A CN101138135A (zh) 2005-03-07 2006-03-07 将柔性印刷电路板连接至另一个电路板的方法
EP06737119A EP1856770A1 (en) 2005-03-07 2006-03-07 Method for connecting flexible printed circuit board to another circuit board
PCT/US2006/007903 WO2006096631A1 (en) 2005-03-07 2006-03-07 Method for connecting flexible printed circuit board to another circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005061858A JP2006245453A (ja) 2005-03-07 2005-03-07 フレキシブルプリント回路基板の他の回路基板への接続方法

Publications (2)

Publication Number Publication Date
JP2006245453A true JP2006245453A (ja) 2006-09-14
JP2006245453A5 JP2006245453A5 (enExample) 2008-04-03

Family

ID=36603345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005061858A Pending JP2006245453A (ja) 2005-03-07 2005-03-07 フレキシブルプリント回路基板の他の回路基板への接続方法

Country Status (7)

Country Link
US (1) US20080156437A1 (enExample)
EP (1) EP1856770A1 (enExample)
JP (1) JP2006245453A (enExample)
KR (1) KR20070106627A (enExample)
CN (1) CN101138135A (enExample)
TW (1) TW200638823A (enExample)
WO (1) WO2006096631A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008251745A (ja) * 2007-03-29 2008-10-16 Sanyo Electric Co Ltd 回路装置およびその製造方法
JP2012199262A (ja) * 2011-03-18 2012-10-18 Seiko Epson Corp 回路基板、接続構造体及び回路基板の接続方法
JP2017503306A (ja) * 2013-10-28 2017-01-26 ティーイー コネクティビティ ジャーマニー ゲゼルシャフト ミット ベシュレンクテル ハフツンクＴＥ Ｃｏｎｎｅｃｔｉｖｉｔｙ Ｇｅｒｍａｎｙ ＧｍｂＨ セルの形態である少なくとも１つの電圧ソースおよび／または電圧シンクを外部電気構成要素に接続するための接続構成、ならびに接続構成を備える電気的構成

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US7040557B2 (en) * 2001-02-26 2006-05-09 Power Technologies Investment Ltd. System and method for pulverizing and extracting moisture
JP2007005640A (ja) * 2005-06-24 2007-01-11 Three M Innovative Properties Co 回路基板の相互接続方法
JP2008089819A (ja) * 2006-09-29 2008-04-17 Toshiba Matsushita Display Technology Co Ltd フレキシブル基板及びフレキシブル基板を備えた表示装置
GB0714723D0 (en) 2007-07-30 2007-09-12 Pilkington Automotive D Gmbh Improved electrical connector
US9001016B2 (en) * 2007-09-19 2015-04-07 Nvidia Corporation Hardware driven display restore mechanism
US7854817B2 (en) * 2008-05-29 2010-12-21 3M Innovative Properties Company Methods and assemblies for attaching articles to surfaces
JP5909044B2 (ja) * 2011-02-25 2016-04-26 矢崎総業株式会社 コネクタ構造
KR101899185B1 (ko) * 2011-05-18 2018-09-14 히타치가세이가부시끼가이샤 회로 접속 재료, 회로 부재의 접속 구조 및 회로 부재의 접속 구조의 제조 방법
KR102044574B1 (ko) * 2012-04-13 2019-11-13 히타치가세이가부시끼가이샤 회로 접속 재료, 접속 구조체 및 그의 제조 방법
TWI436718B (zh) * 2012-05-04 2014-05-01 Mutual Tek Ind Co Ltd 複合式電路板的製作方法
CN103607855B (zh) * 2013-10-26 2016-06-08 溧阳市东大技术转移中心有限公司 一种复合挠性基板的制造方法
US9460757B2 (en) * 2013-11-04 2016-10-04 HGST Netherlands B.V. Flexible cable assembly having reduced-tolerance electrical connection pads
US10543039B2 (en) * 2014-03-18 2020-01-28 Boston Scientific Scimed, Inc. Nerve ablation devices and related methods of use and manufacture
JP6656808B2 (ja) * 2015-02-17 2020-03-04 ヒロセ電機株式会社 電気コネクタとフレキシブル基板との組立体
US11737818B2 (en) * 2018-08-14 2023-08-29 Biosense Webster (Israel) Ltd. Heat transfer during ablation procedures
TWI705748B (zh) * 2019-11-21 2020-09-21 頎邦科技股份有限公司 雙面銅之軟性電路板及其佈線結構
CN120477928A (zh) * 2020-05-08 2025-08-15 圣犹达医疗用品心脏病学部门有限公司 用柔性电路组件形成样条的方法和包括该样条的电极组件
TWI763042B (zh) * 2020-09-17 2022-05-01 佳勝科技股份有限公司 製造電路板結構的方法
CN112616244B (zh) * 2020-12-22 2022-03-22 浙江清华柔性电子技术研究院 柔性电路板及柔性电路板制备方法
TWI881025B (zh) * 2021-01-25 2025-04-21 優顯科技股份有限公司 電子裝置及其製造方法

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JPH05258830A (ja) * 1992-03-16 1993-10-08 Hitachi Chem Co Ltd 回路の接続方法
JPH09194570A (ja) * 1996-01-18 1997-07-29 Minnesota Mining & Mfg Co <3M> エポキシ樹脂組成物、改質エポキシ樹脂組成物およびその製造方法
JP2001035880A (ja) * 1990-07-09 2001-02-09 Semiconductor Energy Lab Co Ltd 表示装置及びイメージセンサー装置の作製方法
JP2003100953A (ja) * 2001-06-29 2003-04-04 Hitachi Chem Co Ltd 接着部材
JP2004221189A (ja) * 2003-01-10 2004-08-05 Three M Innovative Properties Co 平面多導体の接続方法、該接続方法で接続される部分を含む電気電子部品、該接続方法で接続される平面多導体、および、平面多導体の接続システム
JP2004266137A (ja) * 2003-03-03 2004-09-24 Hitachi Chem Co Ltd 半導体装置用ダイボンディング材及びこれを用いた半導体装置

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KR101025404B1 (ko) * 2002-06-24 2011-03-28 쓰리엠 이노베이티브 프로퍼티즈 컴파니 열 경화성 접착제 조성물, 물품, 반도체 장치 및 방법
US6936644B2 (en) * 2002-10-16 2005-08-30 Cookson Electronics, Inc. Releasable microcapsule and adhesive curing system using the same
JP2006140052A (ja) * 2004-11-12 2006-06-01 Three M Innovative Properties Co 熱硬化性接着フィルム付きコネクタ及びそれを用いた接続方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001035880A (ja) * 1990-07-09 2001-02-09 Semiconductor Energy Lab Co Ltd 表示装置及びイメージセンサー装置の作製方法
JPH05258830A (ja) * 1992-03-16 1993-10-08 Hitachi Chem Co Ltd 回路の接続方法
JPH09194570A (ja) * 1996-01-18 1997-07-29 Minnesota Mining & Mfg Co <3M> エポキシ樹脂組成物、改質エポキシ樹脂組成物およびその製造方法
JP2003100953A (ja) * 2001-06-29 2003-04-04 Hitachi Chem Co Ltd 接着部材
JP2004221189A (ja) * 2003-01-10 2004-08-05 Three M Innovative Properties Co 平面多導体の接続方法、該接続方法で接続される部分を含む電気電子部品、該接続方法で接続される平面多導体、および、平面多導体の接続システム
JP2004266137A (ja) * 2003-03-03 2004-09-24 Hitachi Chem Co Ltd 半導体装置用ダイボンディング材及びこれを用いた半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008251745A (ja) * 2007-03-29 2008-10-16 Sanyo Electric Co Ltd 回路装置およびその製造方法
JP2012199262A (ja) * 2011-03-18 2012-10-18 Seiko Epson Corp 回路基板、接続構造体及び回路基板の接続方法
JP2017503306A (ja) * 2013-10-28 2017-01-26 ティーイー コネクティビティ ジャーマニー ゲゼルシャフト ミット ベシュレンクテル ハフツンクＴＥ Ｃｏｎｎｅｃｔｉｖｉｔｙ Ｇｅｒｍａｎｙ ＧｍｂＨ セルの形態である少なくとも１つの電圧ソースおよび／または電圧シンクを外部電気構成要素に接続するための接続構成、ならびに接続構成を備える電気的構成
US11201377B2 (en) 2013-10-28 2021-12-14 Te Connectivity Germany Gmbh Connection arrangement for connecting at least one voltage source and/or voltage sink which is in the form of a cell to an external electrical component and electrical arrangement comprising a connection arrangement

Also Published As

Publication number Publication date
US20080156437A1 (en) 2008-07-03
KR20070106627A (ko) 2007-11-02
EP1856770A1 (en) 2007-11-21
CN101138135A (zh) 2008-03-05
WO2006096631A1 (en) 2006-09-14
TW200638823A (en) 2006-11-01

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