CN101090081A - 半导体器件的制造方法 - Google Patents

半导体器件的制造方法 Download PDF

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Publication number
CN101090081A
CN101090081A CNA2007101065554A CN200710106555A CN101090081A CN 101090081 A CN101090081 A CN 101090081A CN A2007101065554 A CNA2007101065554 A CN A2007101065554A CN 200710106555 A CN200710106555 A CN 200710106555A CN 101090081 A CN101090081 A CN 101090081A
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CN
China
Prior art keywords
lead
semiconductor device
wiring
substrate
terminal pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007101065554A
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English (en)
Chinese (zh)
Inventor
田上哲治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Publication of CN101090081A publication Critical patent/CN101090081A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CNA2007101065554A 2006-06-14 2007-06-06 半导体器件的制造方法 Pending CN101090081A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006164822 2006-06-14
JP2006164822A JP2007335581A (ja) 2006-06-14 2006-06-14 半導体装置の製造方法

Publications (1)

Publication Number Publication Date
CN101090081A true CN101090081A (zh) 2007-12-19

Family

ID=38862090

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007101065554A Pending CN101090081A (zh) 2006-06-14 2007-06-06 半导体器件的制造方法

Country Status (5)

Country Link
US (5) US7659146B2 (enExample)
JP (1) JP2007335581A (enExample)
KR (1) KR101296572B1 (enExample)
CN (1) CN101090081A (enExample)
TW (1) TW200807666A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110112118A (zh) * 2018-02-01 2019-08-09 爱思开海力士有限公司 半导体封装
WO2023083021A1 (zh) * 2021-11-12 2023-05-19 合肥本源量子计算科技有限责任公司 一种量子器件及其制备方法、一种量子计算机

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JP5692952B2 (ja) * 2007-12-11 2015-04-01 シチズン電子株式会社 発光ダイオード
JP5188289B2 (ja) * 2008-06-26 2013-04-24 ラピスセミコンダクタ株式会社 プリント基板の製造方法
US8749074B2 (en) * 2009-11-30 2014-06-10 Micron Technology, Inc. Package including an interposer having at least one topological feature
JP5587123B2 (ja) * 2010-09-30 2014-09-10 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US9082780B2 (en) * 2012-03-23 2015-07-14 Stats Chippac, Ltd. Semiconductor device and method of forming a robust fan-out package including vertical interconnects and mechanical support layer
JP6068175B2 (ja) * 2013-02-12 2017-01-25 新光電気工業株式会社 配線基板、発光装置、配線基板の製造方法及び発光装置の製造方法
KR20160000293A (ko) * 2014-06-24 2016-01-04 삼성전자주식회사 탭 핀에 타이바가 없는 반도체 모듈
JP2016122802A (ja) * 2014-12-25 2016-07-07 ルネサスエレクトロニクス株式会社 半導体装置
JP6293248B2 (ja) * 2016-12-12 2018-03-14 ルネサスエレクトロニクス株式会社 半導体装置および半導体装置の製造方法
CN110112117A (zh) * 2018-02-01 2019-08-09 爱思开海力士有限公司 半导体封装
KR102509051B1 (ko) * 2018-02-01 2023-03-10 에스케이하이닉스 주식회사 반도체 패키지
KR20190093488A (ko) * 2018-02-01 2019-08-09 에스케이하이닉스 주식회사 반도체 패키지
CN110112116B (zh) * 2018-02-01 2023-06-06 爱思开海力士有限公司 半导体封装件和形成半导体封装件的方法
US11462501B2 (en) * 2019-10-25 2022-10-04 Shinko Electric Industries Co., Ltd. Interconnect substrate and method of making the same

Family Cites Families (11)

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JPS6450450A (en) * 1987-08-20 1989-02-27 Toshiba Corp Package for semiconductor integrated circuit
JP3339473B2 (ja) * 1999-08-26 2002-10-28 日本電気株式会社 パッケージ基板、該パッケージ基板を備える半導体装置及びそれらの製造方法
JP3721299B2 (ja) * 2000-08-03 2005-11-30 新光電気工業株式会社 半導体パッケージの製造方法
JP3619773B2 (ja) * 2000-12-20 2005-02-16 株式会社ルネサステクノロジ 半導体装置の製造方法
WO2002103793A1 (en) * 2001-06-07 2002-12-27 Renesas Technology Corp. Semiconductor device and manufacturing method thereof
JP2003086735A (ja) * 2001-06-27 2003-03-20 Shinko Electric Ind Co Ltd 位置情報付配線基板及びその製造方法並びに半導体装置の製造方法
EP1280204A3 (en) * 2001-06-27 2004-09-01 Shinko Electric Industries Co. Ltd. Wiring substrate having position problem
JP2005079129A (ja) 2003-08-28 2005-03-24 Sumitomo Metal Electronics Devices Inc プラスチックパッケージ及びその製造方法
KR100557540B1 (ko) * 2004-07-26 2006-03-03 삼성전기주식회사 Ｂｇａ 패키지 기판 및 그 제작 방법
JP4651359B2 (ja) 2004-10-29 2011-03-16 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP2006261485A (ja) * 2005-03-18 2006-09-28 Renesas Technology Corp 半導体装置およびその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110112118A (zh) * 2018-02-01 2019-08-09 爱思开海力士有限公司 半导体封装
WO2023083021A1 (zh) * 2021-11-12 2023-05-19 合肥本源量子计算科技有限责任公司 一种量子器件及其制备方法、一种量子计算机

Also Published As

Publication number Publication date
KR101296572B1 (ko) 2013-08-13
US8420451B2 (en) 2013-04-16
US8258018B2 (en) 2012-09-04
TW200807666A (en) 2008-02-01
JP2007335581A (ja) 2007-12-27
US20110124159A1 (en) 2011-05-26
US7915086B2 (en) 2011-03-29
US20120282737A1 (en) 2012-11-08
US8048722B2 (en) 2011-11-01
US20070292993A1 (en) 2007-12-20
KR20070119521A (ko) 2007-12-20
US7659146B2 (en) 2010-02-09
US20090311833A1 (en) 2009-12-17
US20120083072A1 (en) 2012-04-05

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