KR101296572B1 - 반도체 장치의 제조 방법 - Google Patents

반도체 장치의 제조 방법 Download PDF

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Publication number
KR101296572B1
KR101296572B1 KR1020070057541A KR20070057541A KR101296572B1 KR 101296572 B1 KR101296572 B1 KR 101296572B1 KR 1020070057541 A KR1020070057541 A KR 1020070057541A KR 20070057541 A KR20070057541 A KR 20070057541A KR 101296572 B1 KR101296572 B1 KR 101296572B1
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South Korea
Prior art keywords
wiring
plating
delete delete
semiconductor device
main surface
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Expired - Fee Related
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KR1020070057541A
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English (en)
Korean (ko)
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KR20070119521A (ko
Inventor
데쯔하루 다노우에
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르네사스 일렉트로닉스 가부시키가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1020070057541A 2006-06-14 2007-06-13 반도체 장치의 제조 방법 Expired - Fee Related KR101296572B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006164822A JP2007335581A (ja) 2006-06-14 2006-06-14 半導体装置の製造方法
JPJP-P-2006-00164822 2006-06-14

Publications (2)

Publication Number Publication Date
KR20070119521A KR20070119521A (ko) 2007-12-20
KR101296572B1 true KR101296572B1 (ko) 2013-08-13

Family

ID=38862090

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070057541A Expired - Fee Related KR101296572B1 (ko) 2006-06-14 2007-06-13 반도체 장치의 제조 방법

Country Status (5)

Country Link
US (5) US7659146B2 (enExample)
JP (1) JP2007335581A (enExample)
KR (1) KR101296572B1 (enExample)
CN (1) CN101090081A (enExample)
TW (1) TW200807666A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10950512B2 (en) 2018-02-01 2021-03-16 SK Hynix Inc. Semiconductor packages including a semiconductor chip and methods of forming the semiconductor packages

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5692952B2 (ja) * 2007-12-11 2015-04-01 シチズン電子株式会社 発光ダイオード
JP5188289B2 (ja) * 2008-06-26 2013-04-24 ラピスセミコンダクタ株式会社 プリント基板の製造方法
US8749074B2 (en) * 2009-11-30 2014-06-10 Micron Technology, Inc. Package including an interposer having at least one topological feature
JP5587123B2 (ja) * 2010-09-30 2014-09-10 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US9082780B2 (en) * 2012-03-23 2015-07-14 Stats Chippac, Ltd. Semiconductor device and method of forming a robust fan-out package including vertical interconnects and mechanical support layer
JP6068175B2 (ja) * 2013-02-12 2017-01-25 新光電気工業株式会社 配線基板、発光装置、配線基板の製造方法及び発光装置の製造方法
KR20160000293A (ko) * 2014-06-24 2016-01-04 삼성전자주식회사 탭 핀에 타이바가 없는 반도체 모듈
JP2016122802A (ja) * 2014-12-25 2016-07-07 ルネサスエレクトロニクス株式会社 半導体装置
JP6293248B2 (ja) * 2016-12-12 2018-03-14 ルネサスエレクトロニクス株式会社 半導体装置および半導体装置の製造方法
US10879160B2 (en) * 2018-02-01 2020-12-29 SK Hynix Inc. Semiconductor package with packaging substrate
CN110112117A (zh) * 2018-02-01 2019-08-09 爱思开海力士有限公司 半导体封装
KR102509051B1 (ko) * 2018-02-01 2023-03-10 에스케이하이닉스 주식회사 반도체 패키지
KR20190093488A (ko) * 2018-02-01 2019-08-09 에스케이하이닉스 주식회사 반도체 패키지
US11462501B2 (en) * 2019-10-25 2022-10-04 Shinko Electric Industries Co., Ltd. Interconnect substrate and method of making the same
CN116130445A (zh) * 2021-11-12 2023-05-16 合肥本源量子计算科技有限责任公司 一种量子器件及其制备方法、一种量子计算机

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6450450A (en) * 1987-08-20 1989-02-27 Toshiba Corp Package for semiconductor integrated circuit
JP2002050715A (ja) 2000-08-03 2002-02-15 Shinko Electric Ind Co Ltd 半導体パッケージの製造方法
KR101117848B1 (ko) 2004-10-29 2012-03-15 르네사스 일렉트로닉스 가부시키가이샤 반도체 장치 및 그 제조 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3339473B2 (ja) * 1999-08-26 2002-10-28 日本電気株式会社 パッケージ基板、該パッケージ基板を備える半導体装置及びそれらの製造方法
JP3619773B2 (ja) * 2000-12-20 2005-02-16 株式会社ルネサステクノロジ 半導体装置の製造方法
WO2002103793A1 (en) * 2001-06-07 2002-12-27 Renesas Technology Corp. Semiconductor device and manufacturing method thereof
JP2003086735A (ja) * 2001-06-27 2003-03-20 Shinko Electric Ind Co Ltd 位置情報付配線基板及びその製造方法並びに半導体装置の製造方法
EP1280204A3 (en) * 2001-06-27 2004-09-01 Shinko Electric Industries Co. Ltd. Wiring substrate having position problem
JP2005079129A (ja) 2003-08-28 2005-03-24 Sumitomo Metal Electronics Devices Inc プラスチックパッケージ及びその製造方法
KR100557540B1 (ko) * 2004-07-26 2006-03-03 삼성전기주식회사 Ｂｇａ 패키지 기판 및 그 제작 방법
JP2006261485A (ja) * 2005-03-18 2006-09-28 Renesas Technology Corp 半導体装置およびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6450450A (en) * 1987-08-20 1989-02-27 Toshiba Corp Package for semiconductor integrated circuit
JP2002050715A (ja) 2000-08-03 2002-02-15 Shinko Electric Ind Co Ltd 半導体パッケージの製造方法
KR101117848B1 (ko) 2004-10-29 2012-03-15 르네사스 일렉트로닉스 가부시키가이샤 반도체 장치 및 그 제조 방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10950512B2 (en) 2018-02-01 2021-03-16 SK Hynix Inc. Semiconductor packages including a semiconductor chip and methods of forming the semiconductor packages
US11557523B2 (en) 2018-02-01 2023-01-17 SK Hynix Inc. Semiconductor packages and methods of forming the semiconductor packages

Also Published As

Publication number Publication date
US8420451B2 (en) 2013-04-16
US8258018B2 (en) 2012-09-04
TW200807666A (en) 2008-02-01
JP2007335581A (ja) 2007-12-27
US20110124159A1 (en) 2011-05-26
US7915086B2 (en) 2011-03-29
US20120282737A1 (en) 2012-11-08
US8048722B2 (en) 2011-11-01
CN101090081A (zh) 2007-12-19
US20070292993A1 (en) 2007-12-20
KR20070119521A (ko) 2007-12-20
US7659146B2 (en) 2010-02-09
US20090311833A1 (en) 2009-12-17
US20120083072A1 (en) 2012-04-05

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