CN101065459A - 可通过热活化并且基于羧化腈橡胶的用于将电子元件和条形导体粘结在一起的粘合带 - Google Patents
可通过热活化并且基于羧化腈橡胶的用于将电子元件和条形导体粘结在一起的粘合带 Download PDFInfo
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- CN101065459A CN101065459A CNA2005800404837A CN200580040483A CN101065459A CN 101065459 A CN101065459 A CN 101065459A CN A2005800404837 A CNA2005800404837 A CN A2005800404837A CN 200580040483 A CN200580040483 A CN 200580040483A CN 101065459 A CN101065459 A CN 101065459A
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- H—ELECTRICITY
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Abstract
用于生产和进一步加工柔性导体轨道的可热活化粘合带，其包含至少由以下物质组成的粘合剂：a.酸或酸酐改性的丙烯腈－丁二烯共聚物，和b.环氧树脂，这两种组分的重量比a/b大于1.5，并且没有使用另外的非－聚合物固化剂。
Description
本发明涉及一种在高温下具有低流动性的用于粘结柔性印刷导体轨道(flexible printed conductor tracks)柔性印刷电路板，FPCBs)的可热活化粘合剂。
柔性印刷电路板现今被用于多种电子器件例如移动电话、收音机、计算机、打印机和许多更多的器件中。它们由铜和耐高熔点的热塑性物质：主要是聚酰亚胺，较少为聚酯的层构成。通常使用具有特别严格要求的粘合带生产这些FPCBs。一方面，为了生产FPCBs，将铜箔粘结在聚酰亚胺薄膜上；另一方面，还将单个FPCBs彼此粘结，在该情形中为聚酰亚胺粘结在聚酰亚胺上。除了这些应用之外，还将FPCBs粘结在其他基材上。
对于用于这些粘结任务的粘合带的要求非常严格。由于必须获得非常高的粘结性能，因此使用的粘合带通常是在高温下加工的可热活化的带。在通常于约200℃的温度进行的FPCBs的粘结期间，在该高温负荷过程中这些粘合带必须不放出挥发性组分。为了获得高的粘结程度，粘合带应该在该温度负荷期间交联。在粘结操作期间高压使得粘合带在高温下的流动性必须低。这通过在未交联的粘合带中高的粘度或者通过非常迅速的交联而实现。另外，粘合带必须还是抗金属熔化浴(solder bath)的，换句话说必须短时间承受288℃的温度负荷。
出于该原因，使用纯的热塑性物质并不合理，尽管它们非常容易熔化、确保将要粘结的基材有效润湿并且在几秒钟内导致非常迅速的粘结。不过，在高温下它们是软的以致于在粘结过程中在压力下它们容易从粘合层中溶胀出来。因此没有金属熔化浴抗性。
对于可交联的粘合带而言，通常使用环氧树脂或酚醛树脂，其与特定的固化剂反应形成聚合物网状结构。在该特定情况下不能使用酚醛树脂，因为在交联过程中它们产生了消除产物，该产物被释放，并且在固化过程中或者最迟在金属熔化浴中导致起泡。
环氧树脂被主要用于结构的粘合剂粘结并且在用合适的交联剂固化之后制得了非常脆的粘合剂，其实际上获得了高的粘结强度但基本不具有柔性。
对于在FPCBs中的应用而言，提高柔性是至关重要的。一方面将使用理想地缠绕成卷的粘合带产生粘结；另一方面所述的导体轨道是柔性的并且还必须是弯曲的，这容易从其中可折叠式屏幕通过FPCBs与另外的电路相连的掌上电脑中的导体轨道的例子中明显看出。
可以两种方式将这些环氧树脂粘合剂柔性化。首先，存在用弹性体链柔性化的环氧树脂，但由于非常短的弹性体链因此它们经历的柔性化有限。另一种可能是通过加入弹性体而实现柔性化，该弹性体被加入粘合剂中。该形式具有弹性体不能化学交联的缺陷，这意味着仅仅可使用的弹性体是在高温下仍然保持高粘度的那些。
由于通常由溶液制备粘合带，因此通常难以发现具有足够的长链性质而在高温下不流动同时仍然可溶于常规溶剂的弹性体。
通过热熔操作制备是可能的但在交联体系的情况下非常困难，因为在生产操作期间必须防止过早交联。
从JP05287255A、JP11061073A、JP03028285A和JP61076579A中获知了基于酸改性的丙烯腈-丁二烯共聚物(腈橡胶)和环氧树脂的粘合剂。在所有这些情形中，除了羧化的腈橡胶和环氧树脂之外，还加入了用于环氧树脂的固化剂，优选为胺。尽管JP11181380A没有明确地提及使用固化剂，但环氧树脂的比例高使得环氧化物基团相对于改性的腈橡胶的酸基团显著过量，以致于仅仅可以通过另外的固化剂进行完全交联。另外，由于高的环氧树脂比例，粘合带非常硬并且不如所希望的那样柔性。
因此，本发明的目的是提供一种可热活化、在热下交联、在热下在将要粘结的基材上优良地流动、展现出对聚酰亚胺的有效粘结并且在未交联状态中可溶于有机溶剂的粘合带。
令人惊奇地，借助于在主权利要求中更详细表征的粘合带实现了该目的。从属权利要求提供了本发明的主题的有利发展。
本发明因此提供一种用于生产和进一步加工柔性导体轨道的可热活化粘合带，其包含至少由以下物质组成的粘合剂：
a)酸或酸酐改性的丙烯腈-丁二烯共聚物，和
b)环氧树脂，
这两种组分的重量比a/b大于1.5，并且没有使用另外的非-聚合物固化剂。
用于本发明目的的通用措词“粘合带”包括所有的片状结构，例如两维延伸的片材或片材断片(section)、具有延长的长度和有限的宽度的带、带断片、模切物(diecuts)等。
本发明的粘合带的优点是弹性体实际上与树脂化学交联；由于弹性体本身充当了固化剂，因此并不需要加入用于环氧树脂的固化剂。弹性体还由此被引入网状结构，这得到了与其中仅用固化剂交联的环氧树脂的粘合剂相比显著提高强度的交联粘合剂。
可特别用于本发明的粘合剂中的腈橡胶包括丙烯腈含量为15-50wt％的所有丙烯腈-丁二烯共聚物。另外，也可以使用丙烯腈、丁二烯和异戊二烯的共聚物。在该情况下，1，2-连接的丁二烯的比例可变。上述聚合物可以具有不同的氢化度；还可以使用双键比例低于1％的完全氢化的聚合物。
所有这些腈橡胶被羧化至一定程度；酸基团的比例优选为2-15wt％。在商业上，这类体系可例如在名称Nipol 1072或Nipol NX775下从Zeon公司获得。氢化的羧化腈橡胶在名称Therban XT VP KA8889下从Lanxess商购获得。
通常将环氧树脂理解为不仅是每分子含有多于一个环氧化物基团的单体化合物而且是每分子含有多于一个环氧化物基团的低聚化合物。它们可以是缩水甘油酯或表氯醇与双酚A或双酚F或者这两者的混合物的反应产物。同样适合于使用的是通过将表氯醇与苯酚和甲醛的反应产物反应得到的环氧酚醛清漆树脂。也可以使用被用作环氧树脂的稀释剂的含有两个或多个环氧化物端基的单体化合物。同样适合于使用的是弹性改性的环氧树脂。
环氧树脂的例子是：得自于Ciba Geigy的AralditeTM 6010、CY-281TM、ECNTM 1273、ECNTM 1280、MY 720、RD-2，得自于Dow Chemicals的DERTM331、732、736、DENTM 432，得自于Shell Chemicals的EponTM 812、825、826、828、830等，同样得自于Shell Chemicals的HPTTM 1071、1079，和得自于Bakelite AG的BakeliteTM EPR 161、166、172、191、194等。
商业的脂族环氧树脂例如是乙烯基环己烷二氧化物，例如来自UnionCarbide Corp的ERL-4206、4221、4201、4289或0400。
弹性处理的弹性体可在名称Hycar下从Noveon获得。
环氧稀释剂-含两个或多个环氧化物基团的单体化合物例如是来自Bakelite AG的BakeliteTM EPD KR、EPD Z8、EPD HD、EPD WF等或者来自UCCP的PolypoxTM R9、R12、R15、R19、R20等。
进一步优选粘合带包含多于一种的环氧树脂。
除了已经提及的酸或酸酐改性的腈橡胶之外，还可以使用其它弹性体。除了其它酸或酸酐改性的弹性体之外，还可以使用未改性的弹性体例如聚乙烯醇、聚乙酸乙烯酯、苯乙烯嵌段共聚物、聚乙烯醇缩甲醛、聚乙烯醇缩丁醛或者可溶性聚酯。
还可以使用与马来酸酐的共聚物例如聚乙烯基甲基醚和马来酸酐的共聚物，其可例如在名称GantrezTM下由ISP商购获得。
固化剂与弹性体的化学交联在粘合薄膜中产生了非常高的强度。然而，对聚酰亚胺的粘结强度同样极高。
为了提高粘合性，还可以加入与弹性体相容的增粘树脂。
可用于本发明的压敏粘合剂中的增粘剂的例子包括：非氢化、部分氢化或完全氢化的基于松香和松香衍生物的树脂，二环戊二烯的水合聚合物，非氢化或部分、选择性或完全氢化的基于C5、C5/C9或C9单体流的烃树脂，基于α-蒎烯和/或β-蒎烯和/或δ-柠檬烯的聚萜烯树脂，优选纯的C8和C9芳族物质的氢化聚合物。上述增粘树脂可以单独或者以混合物使用。
可使用的其它添加剂通常包括：
-主抗氧剂，例如位阻酚
-辅助抗氧剂，例如亚磷酸酯或硫醚
-工艺中的稳定剂，例如C-自由基清除剂
-光稳定剂，例如UV吸收剂或位阻胺
-加工助剂
-封端增强树脂
-填料，例如二氧化硅、玻璃(磨碎的或者以珠粒的形式)、氧化铝、氧化锌、碳酸钙、二氧化钛、炭黑、金属粉末等
-有色颜料和染料以及光学增白剂。
通过使用增塑剂，可以提高交联的粘合剂的弹性。可使用的增塑剂包括例如低分子质量聚异戊二烯、聚丁二烯、聚异丁烯或聚乙二醇和聚丙二醇。
由于使用的腈橡胶即使在高温下也不具有过分低的粘度，因此在粘合剂粘结或热压过程中不会有粘合剂从粘合层中逸出。在该过程期间，环氧树脂与弹性体交联形成三维网状结构。
通过加入已知的作为促进剂的化合物，可以进一步提高反应速率。
可能的促进剂的例子包括以下物质：
-叔胺，例如苄基二甲胺、二甲基氨甲基苯酚、三(二甲基氨甲基)苯酚
-三卤化硼-胺复合物
-取代的咪唑
-三苯基膦
理想地，将酸或酸酐改性的弹性体和环氧树脂以使得环氧化物基团和酸基团的摩尔比刚好相等的比例使用。在该情形下，使用仅仅稍微改性的弹性体和使用具有低环氧化物当量的低分子量环氧树脂仅仅得到非常少量的环氧树脂，基于改性的腈橡胶为小于10wt％。
然而，酸基团与环氧化物基团之间的比例可以在宽的范围内变化；为了充分交联，这两种基团都将不以超过4倍摩尔当量的过量存在。
为了制得粘合带，将粘合剂的组分溶于合适的溶剂例如丁酮中，并且将溶液涂覆在带有隔离层例如隔离纸或隔离膜的柔性基材上，并且将涂料干燥以使得可以容易地重新将组合物从基材上除去。在合适的转化之后，可以在室温下制得模切物、辊子或其他形状体。然后优选在升高的温度将相应的形状体粘结在待粘结的基材例如聚酰亚胺上。
还可以将粘合剂直接涂覆在聚酰亚胺衬底上。然后可以将这类粘合片材用于遮掩FPCBs的铜导体轨道。
粘结操作不一定是一步过程；相反，可以通过进行热层压将粘合带首先粘结在两个基材的其中一个上。在与第二个基材(第二个聚酰亚胺片材或铜箔)的实际热粘结操作过程中，树脂然后完全或部分固化并且粘合层达到高的粘结强度。
在层压温度时，混合的环氧树脂应该优选还没有进入任何化学反应，而是应该仅仅当热粘结时与酸或酸酐基团反应。
粘合带优选在高于150℃的温度交联。
实施例
下面通过许多实施例更详细地描述本发明，但无论如何不以任何方式限制本发明。
实施例1
将80重量份Nipol NX 775(得自Zeon的带有26wt％丙烯腈和7wt％酸改性的腈橡胶)和20重量份Bakelite EPR 166(得自Bakelite的环氧化物当量为184的环氧树脂)溶于丁酮中，并且然后将溶液涂覆在具有隔离层的隔离纸上，以在干燥后得到25μm的涂层厚度。
实施例2
将20重量份Piccolyte A125(得自Hercules的聚萜烯树脂)加入实施例1并且同样溶于丁酮中。随后的步骤如实施例1中所述。
实施例3，比较
将75重量份Breon N41H80(得自Zeon的丙烯腈含量为41wt％并且100℃下门尼粘度ML 1+4为72-88的腈橡胶)和25重量份Bakelite EPR 166溶于丁酮中，并且如上所述那样涂覆。
实施例4，比较
将70重量份Breon以及25重量份EPR 166和5重量份Dyhard 100-S(得自Degussa的二氰基二酰胺)溶于丁酮中，并且然后涂覆。
用制备的粘合带粘结FPCBs
使用根据实施例1-4制备的每一情形中的粘合带粘结两个FPCBs。为了该目的，在100℃下将粘合带层压在聚酰亚胺/铜箔FPCB层压制品的聚酰亚胺片上，粘合带稍微比将要粘结的FPCB更短，以使得随后有把持的垂片(grip tab)。随后将另一个FPCB的第二个聚酰亚胺片粘结在粘合带上，并且在可加热的Bürkle压制机中在200℃和1.3MPa压力下将整个组件压制1小时。
测试方法
通过以下测试方法研究根据上述实施例制备的粘合带的性能。
与FPCB的T-剥离试验
使用得自Zwick的拉伸试验机，将根据上述方法制备的FPCB/粘合带/FPCB组件以180°的角度和50mm/min的速率彼此剥离，并且测量以N/cm计的所需的力。测量在20℃和50％相对湿度下进行。每一测量值测量三次。
温度稳定性
与所述的T-剥离试验类似，使根据上述方法制备的FPCB组件悬垂以将形成的两个把持的垂片的其中一个固定在顶部，同时在另一个把持的垂片上固定500g的重物，使得在两个FPCBs之间形成180°的角度。在70℃下进行静态剥离试验。测量的参数是以mm/h计的静态剥离行程。
金属熔化浴抗性
将根据上述方法粘结的FPCB组件放置于288℃温度的金属熔化浴中10秒。如果没有造成FPCB的聚酰亚胺片材膨胀的空气泡形成，则评定该粘结是抗金属熔化浴的。如果即使有稍微的气泡形成，则也将该试验评定为失败。
结果：
对于上述实施例的粘合剂评价而言，首先进行T-剥离试验。
结果在表1中给出。
表1
T-剥离试验[N/cm]
实施例1 12.6
实施例2 14.3
实施例3 2.7
实施例4 10.7
除了酸改性的弹性体之外不再包含任何固化剂的样品中的粘结强度大于使用未改性的腈橡胶但需要另外的固化剂的样品中的粘结强度。在没有交联的情况下(实施例3)，粘结强度仅仅非常低。
采用静态剥离试验测量粘合带的温度稳定性，其值可以在表2中找到。
表2
70℃下静态T-剥离试验[mm/h]
实施例1 5
实施例2 7
实施例3 ＞50
实施例4 16
可以看出，在参考样品的情形中温度稳定性比实施例1和2的情形中的更小。
全部4个实施例通过了金属熔化浴试验。
Claims (9)
1.用于生产和进一步加工柔性导体轨道的可热活化粘合带，其包含至少由以下物质组成的粘合剂：
a.酸或酸酐改性的丙烯腈-丁二烯共聚物，和
b.环氧树脂，
这两种组分的重量比a/b大于1.5，并且没有使用另外的非-聚合物固化剂。
2.权利要求1的可热活化粘合带，特征在于该腈橡胶至少部分氢化。
3.权利要求1或2的可热活化粘合带，特征在于该丙烯腈-丁二烯橡胶的丙烯腈含量为15-50wt％。
4.前述权利要求1-3的至少一项的可热活化粘合带，特征在于该粘合带包含多于一种的环氧树脂。
5.前述权利要求的至少一项的可热活化粘合带，特征在于该粘合带包含增粘树脂、促进剂、染料、炭黑和/或金属粉末。
6.前述权利要求的其中一项的可热活化粘合带，特征在于该粘合带在高于150℃的温度交联。
7.前述权利要求的其中一项的可热活化粘合带，特征在于该粘合带进一步包含另外的弹性体。
8.前述权利要求的至少一项的可热活化粘合带用于粘结柔性印刷导体轨道的用途。
9.前述权利要求的至少一项的可热活化粘合带用于粘结聚酰亚胺的用途。
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102004057650A DE102004057650A1 (de) | 2004-11-29 | 2004-11-29 | Hitzeaktivierbares Klebeband auf Basis carboxylierter Nitrilkautschuke für die Verklebung von elektronischen Bauteilen und Leiterbahnen |
| DE102004057651A DE102004057651A1 (de) | 2004-11-29 | 2004-11-29 | Hitzeaktivierbares Klebeband auf der Basis von Nitrilkautschuk und Polyvinylbutyral für die Verklebung von elektronischen Bauteilen und Leiterbahnen |
| DE102004057650.5 | 2004-11-29 | ||
| PCT/EP2005/055910 WO2006058827A1 (de) | 2004-11-29 | 2005-11-11 | Hitzeaktivierbares klebeband auf basis carboxylierter nitrilkautschuke für die verklebung von elektronischen bauteilen und leiterbahnen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101065459A true CN101065459A (zh) | 2007-10-31 |
| CN101065459B CN101065459B (zh) | 2010-05-05 |
Family
ID=42239130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2005800404837A Expired - Fee Related CN101065459B (zh) | 2004-11-29 | 2005-11-11 | 可通过热活化并且基于羧化腈橡胶的用于将电子元件和条形导体粘结在一起的粘合带 |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US20090130440A1 (zh) |
| EP (1) | EP1819793B1 (zh) |
| JP (1) | JP4977618B2 (zh) |
| KR (1) | KR101222424B1 (zh) |
| CN (1) | CN101065459B (zh) |
| AT (1) | ATE420932T1 (zh) |
| DE (2) | DE102004057650A1 (zh) |
| ES (1) | ES2318567T3 (zh) |
| PL (1) | PL1819793T3 (zh) |
| WO (1) | WO2006058827A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111978898A (zh) * | 2019-05-23 | 2020-11-24 | 德莎欧洲股份公司 | 制造压敏胶粘性的反应性胶带的方法 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008007749A1 (de) * | 2008-02-05 | 2009-08-06 | Tesa Se | Thermisch aktivier- und härtbare Klebefolie insbesondere für die Verklebung von elektronischen Bauteilen und flexiblen gedruckten Leiterbahnen |
| DE102008053447A1 (de) * | 2008-09-11 | 2010-04-15 | Tesa Se | Klebemasse mit hohem Repulsionswiderstand |
| DE202012004946U1 (de) * | 2012-05-21 | 2013-08-26 | Tesa Se | Lichtabsorbierende hitzeaktivierbare Klebemasse und Klebeband enthaltend solche Klebemasse |
| DE102015215247A1 (de) * | 2015-08-11 | 2017-02-16 | Tesa Se | Haftklebstoff auf Basis von Acrylnitril-Butadien-Kautschuken |
| CN109952817A (zh) * | 2016-11-15 | 2019-06-28 | 日立化成株式会社 | 导体基板、布线基板及布线基板的制造方法 |
| DE102019209754A1 (de) | 2019-07-03 | 2021-01-07 | Tesa Se | Thermisch härtender Klebstoff und daraus hergestelltes Klebeband |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1594064A1 (de) * | 1959-04-29 | 1971-03-18 | Ralf Korpman | Haftklebestreifen |
| CA1035889A (en) * | 1973-10-13 | 1978-08-01 | Tsutomu Watanabe | Flexible adhesive composition and method for utilizing same |
| JPS6176579A (ja) * | 1984-09-21 | 1986-04-19 | Mitsui Petrochem Ind Ltd | 耐燃性接着剤組成物 |
| US4772509A (en) * | 1987-04-13 | 1988-09-20 | Japan Gore-Tex, Inc. | Printed circuit board base material |
| JPS6487667A (en) * | 1987-09-28 | 1989-03-31 | Yokohama Rubber Co Ltd | Adhesive composition with good oil-surface adhesivity and adhesive taking advantage of said feature |
| JPH0733501B2 (ja) * | 1989-06-27 | 1995-04-12 | 信越化学工業株式会社 | 難燃性カバーレイフィルム |
| JPH0368673A (ja) * | 1989-08-08 | 1991-03-25 | Yokohama Rubber Co Ltd:The | 接着剤組成物 |
| JPH05287255A (ja) * | 1992-04-03 | 1993-11-02 | Mitsui Petrochem Ind Ltd | 接着剤組成物 |
| JPH06330016A (ja) * | 1993-05-17 | 1994-11-29 | Three Bond Co Ltd | フレキシブル印刷回路基板用接着剤組成物 |
| JPH07316525A (ja) * | 1994-05-24 | 1995-12-05 | Mitsui Petrochem Ind Ltd | フレキシブルプリント配線板用接着剤組成物 |
| TW340967B (en) * | 1996-02-19 | 1998-09-21 | Toray Industries | An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device |
| DE19738199C2 (de) * | 1996-10-16 | 2000-03-23 | Grammer Ag | Fahrzeugsitz mit einer höhenverstellbaren Kopfstütze |
| JPH11181380A (ja) * | 1997-12-19 | 1999-07-06 | Mitsui Chem Inc | 難燃性接着剤組成物 |
| JP2000004074A (ja) * | 1998-04-17 | 2000-01-07 | Toray Ind Inc | カバ―レイフィルム及び接着剤シ―トならびにフレキシブル印刷回路基板 |
| WO2000026318A1 (fr) * | 1998-10-30 | 2000-05-11 | Mitsui Chemicals Inc. | Composition adhesive |
| JP3953234B2 (ja) * | 1999-06-30 | 2007-08-08 | 三井化学株式会社 | フレキシブルプリント配線板用接着剤組成物 |
| JP2001107001A (ja) * | 1999-10-06 | 2001-04-17 | Hitachi Cable Ltd | フィルム状接着材、配線テープ及び半導体装置 |
| DE60042131D1 (de) * | 1999-12-03 | 2009-06-10 | Bridgestone Corp | Anisotrop-leitender Film |
| DE10258961A1 (de) * | 2002-12-16 | 2004-07-15 | Tesa Ag | Elektrisch leitfähige, hitzeaktivierbare und thermovernetzende Klebstofffolie |
| DE10327452A1 (de) * | 2003-06-18 | 2005-01-05 | Bayer Materialscience Ag | Klebstoffe |
-
2004
- 2004-11-29 DE DE102004057650A patent/DE102004057650A1/de not_active Withdrawn
-
2005
- 2005-11-11 DE DE502005006501T patent/DE502005006501D1/de active Active
- 2005-11-11 JP JP2007541931A patent/JP4977618B2/ja active Active
- 2005-11-11 EP EP05808149A patent/EP1819793B1/de not_active Not-in-force
- 2005-11-11 KR KR1020077014213A patent/KR101222424B1/ko active IP Right Grant
- 2005-11-11 ES ES05808149T patent/ES2318567T3/es active Active
- 2005-11-11 WO PCT/EP2005/055910 patent/WO2006058827A1/de active Application Filing
- 2005-11-11 CN CN2005800404837A patent/CN101065459B/zh not_active Expired - Fee Related
- 2005-11-11 US US11/718,367 patent/US20090130440A1/en not_active Abandoned
- 2005-11-11 AT AT05808149T patent/ATE420932T1/de not_active IP Right Cessation
- 2005-11-11 PL PL05808149T patent/PL1819793T3/pl unknown
-
2010
- 2010-02-16 US US12/706,197 patent/US20100147462A1/en not_active Abandoned
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111978898A (zh) * | 2019-05-23 | 2020-11-24 | 德莎欧洲股份公司 | 制造压敏胶粘性的反应性胶带的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20100147462A1 (en) | 2010-06-17 |
| PL1819793T3 (pl) | 2009-05-29 |
| ES2318567T3 (es) | 2009-05-01 |
| DE102004057650A1 (de) | 2006-06-01 |
| DE502005006501D1 (de) | 2009-03-05 |
| CN101065459B (zh) | 2010-05-05 |
| JP4977618B2 (ja) | 2012-07-18 |
| ATE420932T1 (de) | 2009-01-15 |
| EP1819793B1 (de) | 2009-01-14 |
| US20090130440A1 (en) | 2009-05-21 |
| WO2006058827A1 (de) | 2006-06-08 |
| JP2008522391A (ja) | 2008-06-26 |
| KR20070086551A (ko) | 2007-08-27 |
| KR101222424B1 (ko) | 2013-01-15 |
| EP1819793A1 (de) | 2007-08-22 |
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