DE60042131D1 - Anisotrop-leitender Film - Google Patents
Anisotrop-leitender FilmInfo
- Publication number
- DE60042131D1 DE60042131D1 DE60042131T DE60042131T DE60042131D1 DE 60042131 D1 DE60042131 D1 DE 60042131D1 DE 60042131 T DE60042131 T DE 60042131T DE 60042131 T DE60042131 T DE 60042131T DE 60042131 D1 DE60042131 D1 DE 60042131D1
- Authority
- DE
- Germany
- Prior art keywords
- conductive film
- anisotropic conductive
- anisotropic
- film
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
- C09J129/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
- Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34506599A JP4491873B2 (ja) | 1999-12-03 | 1999-12-03 | 異方性導電フィルム |
JP34506699A JP4491874B2 (ja) | 1999-12-03 | 1999-12-03 | 異方性導電フィルム |
JP35471599A JP4491876B2 (ja) | 1999-12-14 | 1999-12-14 | 異方性導電フィルム |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60042131D1 true DE60042131D1 (de) | 2009-06-10 |
Family
ID=27341175
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60042131T Expired - Lifetime DE60042131D1 (de) | 1999-12-03 | 2000-11-30 | Anisotrop-leitender Film |
DE60025760T Expired - Lifetime DE60025760T2 (de) | 1999-12-03 | 2000-11-30 | Anisotrop-leitender film |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60025760T Expired - Lifetime DE60025760T2 (de) | 1999-12-03 | 2000-11-30 | Anisotrop-leitender film |
Country Status (4)
Country | Link |
---|---|
US (1) | US6706391B2 (de) |
EP (2) | EP1612252B1 (de) |
DE (2) | DE60042131D1 (de) |
WO (1) | WO2001041157A1 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5045865B2 (ja) * | 2001-06-26 | 2012-10-10 | 株式会社ブリヂストン | 光学機能部材一体型表示装置用接着剤組成物及び光学機能部材一体型表示装置 |
JP4158434B2 (ja) * | 2001-07-05 | 2008-10-01 | 株式会社ブリヂストン | 異方性導電フィルム |
EP1603162A1 (de) * | 2004-05-28 | 2005-12-07 | Infineon Technologies AG | Anordnung zum Schutz vor elektrostatischer Entladung (ESD) in einer integrierten Schaltungsstruktur |
DE102004057650A1 (de) * | 2004-11-29 | 2006-06-01 | Tesa Ag | Hitzeaktivierbares Klebeband auf Basis carboxylierter Nitrilkautschuke für die Verklebung von elektronischen Bauteilen und Leiterbahnen |
KR100662176B1 (ko) * | 2004-12-30 | 2006-12-27 | 제일모직주식회사 | 이방성 도전 필름용 조성물 |
US8802214B2 (en) | 2005-06-13 | 2014-08-12 | Trillion Science, Inc. | Non-random array anisotropic conductive film (ACF) and manufacturing processes |
US20060280912A1 (en) * | 2005-06-13 | 2006-12-14 | Rong-Chang Liang | Non-random array anisotropic conductive film (ACF) and manufacturing processes |
US7923488B2 (en) | 2006-10-16 | 2011-04-12 | Trillion Science, Inc. | Epoxy compositions |
US9102851B2 (en) | 2011-09-15 | 2015-08-11 | Trillion Science, Inc. | Microcavity carrier belt and method of manufacture |
US9475963B2 (en) | 2011-09-15 | 2016-10-25 | Trillion Science, Inc. | Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes |
JP6460673B2 (ja) * | 2013-08-02 | 2019-01-30 | 積水化学工業株式会社 | 基材粒子、導電性粒子、導電材料及び接続構造体 |
CN105118544A (zh) * | 2015-07-24 | 2015-12-02 | 南通慧源塑胶有限公司 | 一种柔性导电薄膜 |
JP6857451B2 (ja) * | 2016-04-20 | 2021-04-14 | 日東電工株式会社 | 活性エネルギー線硬化型接着剤組成物、積層偏光フィルムおよびその製造方法、積層光学フィルムおよび画像表示装置 |
JP2022093198A (ja) * | 2020-12-11 | 2022-06-23 | 株式会社村田製作所 | 積層セラミック電子部品および樹脂電極用導電性ペースト |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4997049A (de) * | 1972-12-20 | 1974-09-13 | ||
JPS532648B2 (de) * | 1975-02-25 | 1978-01-30 | ||
JPS5951576B2 (ja) * | 1979-08-03 | 1984-12-14 | 三井日曹ウレタン株式会社 | ポリウレタンエラストマ−と金属との接着方法 |
JP2575680B2 (ja) * | 1987-01-07 | 1997-01-29 | 東芝ケミカル株式会社 | 金属張積層板用接着剤 |
US5001542A (en) * | 1988-12-05 | 1991-03-19 | Hitachi Chemical Company | Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips |
JPH0565466A (ja) * | 1991-09-05 | 1993-03-19 | Hitachi Chem Co Ltd | 銅張積層板用接着剤 |
JPH06313158A (ja) * | 1993-04-30 | 1994-11-08 | Hitachi Chem Co Ltd | 銅張積層板用接着剤 |
JP2508963B2 (ja) | 1993-05-28 | 1996-06-19 | 日本電気株式会社 | 光送信装置 |
JPH07120914A (ja) * | 1993-10-21 | 1995-05-12 | Hoechst Japan Ltd | ポジ型ホトレジスト組成物 |
JPH08188748A (ja) * | 1994-11-30 | 1996-07-23 | Sekisui Chem Co Ltd | 速硬化性接着剤組成物 |
JPH08193188A (ja) * | 1995-01-18 | 1996-07-30 | Mitsui Mining & Smelting Co Ltd | 銅箔用接着剤および該接着剤付き銅箔 |
JPH09111216A (ja) * | 1995-10-24 | 1997-04-28 | Hitachi Chem Co Ltd | 接着剤組成物、接着剤付き銅はく及びこの接着剤付き銅はくを用いた銅張り積層板の製造方法 |
JPH09124892A (ja) * | 1995-10-26 | 1997-05-13 | Polyplastics Co | ポリアセタール樹脂組成物およびその製造方法 |
JPH09124893A (ja) * | 1995-10-26 | 1997-05-13 | Polyplastics Co | ポリアセタール樹脂組成物およびその製造方法 |
JPH09123891A (ja) * | 1995-10-30 | 1997-05-13 | Suzuki Motor Corp | 自動二輪車のアンチスキッドブレーキ装置における配管構造 |
JP3352877B2 (ja) * | 1996-02-21 | 2002-12-03 | 三洋化成工業株式会社 | 感圧接着剤とそれを塗布してなる表面保護シートおよび表面保護方法 |
JP3696696B2 (ja) * | 1996-06-28 | 2005-09-21 | ポリプラスチックス株式会社 | ポリアセタール樹脂組成物およびその製造方法 |
JPH10176142A (ja) * | 1996-12-18 | 1998-06-30 | Toagosei Co Ltd | シアノアクリレート系接着剤組成物 |
JP3796896B2 (ja) | 1997-05-12 | 2006-07-12 | ブラザー工業株式会社 | 印刷配線板 |
JPH10338860A (ja) * | 1997-06-06 | 1998-12-22 | Bridgestone Corp | 異方性導電フィルム |
JPH11172217A (ja) * | 1997-12-09 | 1999-06-29 | Sekisui Chem Co Ltd | アクリル系粘着剤の製造方法 |
-
2000
- 2000-11-30 DE DE60042131T patent/DE60042131D1/de not_active Expired - Lifetime
- 2000-11-30 EP EP05077054A patent/EP1612252B1/de not_active Expired - Lifetime
- 2000-11-30 WO PCT/JP2000/008474 patent/WO2001041157A1/ja active IP Right Grant
- 2000-11-30 EP EP00979028A patent/EP1168373B1/de not_active Expired - Lifetime
- 2000-11-30 DE DE60025760T patent/DE60025760T2/de not_active Expired - Lifetime
-
2001
- 2001-07-26 US US09/915,137 patent/US6706391B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO2001041157A1 (fr) | 2001-06-07 |
DE60025760T2 (de) | 2006-08-03 |
EP1612252B1 (de) | 2009-04-29 |
EP1168373A4 (de) | 2004-11-17 |
EP1168373B1 (de) | 2006-01-25 |
EP1612252A3 (de) | 2006-04-26 |
US6706391B2 (en) | 2004-03-16 |
US20020010247A1 (en) | 2002-01-24 |
EP1612252A2 (de) | 2006-01-04 |
DE60025760D1 (de) | 2006-04-13 |
EP1168373A1 (de) | 2002-01-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |