JPS6487667A - Adhesive composition with good oil-surface adhesivity and adhesive taking advantage of said feature - Google Patents
Adhesive composition with good oil-surface adhesivity and adhesive taking advantage of said featureInfo
- Publication number
- JPS6487667A JPS6487667A JP24340987A JP24340987A JPS6487667A JP S6487667 A JPS6487667 A JP S6487667A JP 24340987 A JP24340987 A JP 24340987A JP 24340987 A JP24340987 A JP 24340987A JP S6487667 A JPS6487667 A JP S6487667A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- 10pts
- composition
- bisphenol
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To obtain the titled composition outstanding in film formability, by incorporating a specific epoxy resin composition with polyvinyl acetal, synthetic rubber, guanidine compound etc. CONSTITUTION:The objective composition can be obtained by incorporating (A) 100pts.wt. of an epoxy resin composition comprising (i) a precondensed epoxy resin containing carboxyl group-contg. liquid acrylonitrile-butadiene rubber/bisphenol compound/bisphenol-glycidyl ether type epoxy resin (ii) dinner acid- modified and/or dibasic acid-modified epoxy resin(s) and (iii) a bisphenol-glycidyl ether type epoxy resin with (B) 5-10pts.wt. of polyvinyl acetal, (C) 3-10pts.wt. of carboxyl group-contg. acrylonitrile-butadiene rubber, (D) a guanidine compound, (E) a urea compound, (F) 4-10pts.wt. of an organic fatty acid metal salt and (G) 10-50pts.wt. of inorganic filler.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24340987A JPS6487667A (en) | 1987-09-28 | 1987-09-28 | Adhesive composition with good oil-surface adhesivity and adhesive taking advantage of said feature |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24340987A JPS6487667A (en) | 1987-09-28 | 1987-09-28 | Adhesive composition with good oil-surface adhesivity and adhesive taking advantage of said feature |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6487667A true JPS6487667A (en) | 1989-03-31 |
Family
ID=17103432
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24340987A Pending JPS6487667A (en) | 1987-09-28 | 1987-09-28 | Adhesive composition with good oil-surface adhesivity and adhesive taking advantage of said feature |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6487667A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0702070A3 (en) * | 1994-09-13 | 1996-08-07 | Mitsui Mining & Smelting Co | Adhesive for copper foils and adhesive-backed copper foil |
US6015865A (en) * | 1991-06-26 | 2000-01-18 | Henkel-Teroson Gmbh | Hot melt adhesive from epoxy resin/amine-terminated polyalkylene glycol adduct |
JP2008522391A (en) * | 2004-11-29 | 2008-06-26 | テサ・アクチエンゲゼルシヤフト | Adhesive strip based on thermally activated and carboxylated nitrile rubber for bonding electronic components and strip conductors together |
US7750107B2 (en) * | 2003-05-30 | 2010-07-06 | Alzchem Trostberg Gmbh | Substituted urea accelerator with dicyandiamide for epoxy resin systems |
JP2014111694A (en) * | 2012-12-05 | 2014-06-19 | Kyocera Chemical Corp | Thin film adhesive sheet and method for producing the same |
JP2016138273A (en) * | 2007-11-14 | 2016-08-04 | シーカ・テクノロジー・アーゲー | Heat-curing epoxy resin composition containing non-aromatic urea as accelerant |
-
1987
- 1987-09-28 JP JP24340987A patent/JPS6487667A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6015865A (en) * | 1991-06-26 | 2000-01-18 | Henkel-Teroson Gmbh | Hot melt adhesive from epoxy resin/amine-terminated polyalkylene glycol adduct |
EP0702070A3 (en) * | 1994-09-13 | 1996-08-07 | Mitsui Mining & Smelting Co | Adhesive for copper foils and adhesive-backed copper foil |
US5707729A (en) * | 1994-09-13 | 1998-01-13 | Mitsui Mining & Smelting Co., Ltd. | Adhesive for copper foils and adhesive-backed copper foil |
US7750107B2 (en) * | 2003-05-30 | 2010-07-06 | Alzchem Trostberg Gmbh | Substituted urea accelerator with dicyandiamide for epoxy resin systems |
JP2008522391A (en) * | 2004-11-29 | 2008-06-26 | テサ・アクチエンゲゼルシヤフト | Adhesive strip based on thermally activated and carboxylated nitrile rubber for bonding electronic components and strip conductors together |
JP2016138273A (en) * | 2007-11-14 | 2016-08-04 | シーカ・テクノロジー・アーゲー | Heat-curing epoxy resin composition containing non-aromatic urea as accelerant |
US11198754B2 (en) | 2007-11-14 | 2021-12-14 | Sika Technology Ag | Heat-curing epoxy resin composition containing non-aromatic ureas as accelerator |
JP2014111694A (en) * | 2012-12-05 | 2014-06-19 | Kyocera Chemical Corp | Thin film adhesive sheet and method for producing the same |
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