CN101023147A - 热膨胀抑制剂、零热膨胀材料、负热膨胀材料、热膨胀抑制方法和热膨胀抑制剂的制造方法 - Google Patents
热膨胀抑制剂、零热膨胀材料、负热膨胀材料、热膨胀抑制方法和热膨胀抑制剂的制造方法 Download PDFInfo
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- CN101023147A CN101023147A CNA200580030788XA CN200580030788A CN101023147A CN 101023147 A CN101023147 A CN 101023147A CN A200580030788X A CNA200580030788X A CN A200580030788XA CN 200580030788 A CN200580030788 A CN 200580030788A CN 101023147 A CN101023147 A CN 101023147A
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- manganese nitride
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- 150000001879 copper Chemical class 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
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- 229910000500 β-quartz Inorganic materials 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/02—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of crystals, e.g. rock-salt, semi-conductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/008—Mountings, adjusting means, or light-tight connections, for optical elements with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Luminescent Compositions (AREA)
- Ceramic Products (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
Description
化学式 | Tmin[℃] | Tmax[℃] | [ΔT[℃] | 线性膨胀系数[μ/℃] |
Mn3Cu0.4Ge0.6NMn3Cu0.45Ge0.55NMn3Cu0.5Ge0.5NMn3Cu0.55Ge0.45NMn3Cu0.8Ge0.4NMn3Cu0.7Ge0.3N | 784324-15-44-115 | *127117935716-65 | 497469726050 | -2-5-13-15-28-17 |
Mn3Zn0.6Ge0.4NMn3Ag0.75Ge0.25NMn3In0.75Ge0.25NMn3Ga0.85Ge0.35N | 51-1310096 | 10423*127*127 | 53362731 | -30-20-12-6 |
Mn3Ga0.6Sn0.4NMn3Ga0.8Sn0.2NMn3Cu0.5Sn0.5N | 1074418 | 12710753 | 206335 | -3-14-33 |
Mn2.88Fe0.12Zn0.4Ge0.6NMn2.94Fe0.08Zn0.5Ge0.5NMn2.88Fe0.12Zn0.5Ge0.5NMn2.88Fe0.12Zn0.55Ge0.45N | 84734327 | *127*12711388 | 43547061 | -7-24-25-40 |
Mn2.91Cr0.09GaNMn2.85Nb0.15Zn0.5Sn0.5NMn2.94Fe0.08Cu0.4Ge0.6NMn2.85Ta0.15Cu0.8Ge0.4N | -4710446-14 | 5*12711239 | 52236653 | -19-2-7-18 |
Mn3.1Zn0.4Ge0.5NMn3.1Ga0.5Ge0.4NMn3.1Ga0.6Ge0.3NMn3.13Ga0.67Ge0.2NMn3.15Ga0.55Ge0.3NMn3.17Ga0.83Ge0.2N | 616123-32-40-92 | 111*127904617-42 | 506667785750 | -13-3-13-32-15-36 |
Mn3Ga0.8Ge0.2N0.85C0.05Mn3Ga0.7Ge0.3N0.93C0.07Mn3Ga0.65Ge0.35N0.93C0.07Mn3Ga0.7Ge0.3N0.9C0.1 | -13-1521-66 | 43739636 | 568875102 | -17-10~-45-10~-38-5~-40 |
Mn3Cu0.5Ga0.5NMn3Cu0.5Ni0.5NMn3In0.75Co0.25N | -194-6035 | -133-2352 | 613717 | -15-60-38 |
Mn3.15Ge0.85N | -82 | -27 | 55 | -60 |
Mn3Cu0.85Pd0.15NMn3Ga0.7Ge0.3N0.88C0.12 | -136-76 | -6346 | 73122 | -30-18 |
Mn3Ga0.7Ge0.3N0.88C0.12(N2-8tm) | -88 | 6 | 94 | -24 |
Mn3Cu0.53Ge0.47N | 0 | 70 | 70 | -14 |
Mn3Cu0.53Ge0.47N(N2-8atm) | -85 | -19 | 66 | -32 |
Claims (24)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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JP2004224431 | 2004-07-30 | ||
JP224431/2004 | 2004-07-30 | ||
JP2005018311 | 2005-01-26 | ||
JP018311/2005 | 2005-01-26 | ||
PCT/JP2005/013914 WO2006011590A1 (ja) | 2004-07-30 | 2005-07-29 | 熱膨張抑制剤、ゼロ熱膨張材料、負の熱膨張材料、熱膨張抑制方法および熱膨張抑制剤の製造方法 |
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CN101023147A true CN101023147A (zh) | 2007-08-22 |
CN101023147B CN101023147B (zh) | 2010-05-12 |
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CN200580030788XA Expired - Fee Related CN101023147B (zh) | 2004-07-30 | 2005-07-29 | 热膨胀抑制剂、零热膨胀材料、负热膨胀材料、热膨胀抑制方法和热膨胀抑制剂的制造方法 |
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Country | Link |
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US (1) | US7632480B2 (zh) |
EP (1) | EP1790705A4 (zh) |
JP (2) | JP5099478B2 (zh) |
KR (1) | KR101121155B1 (zh) |
CN (1) | CN101023147B (zh) |
CA (1) | CA2575391C (zh) |
WO (1) | WO2006011590A1 (zh) |
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CN103449436A (zh) * | 2013-09-17 | 2013-12-18 | 盐城工学院 | 一种类钙钛矿结构负膨胀锰碳化合物制备方法 |
CN103466723A (zh) * | 2013-08-27 | 2013-12-25 | 江苏大学 | 一种超大负热膨胀材料及其制备方法 |
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US6187700B1 (en) * | 1998-05-19 | 2001-02-13 | Corning Incorporated | Negative thermal expansion materials including method of preparation and uses therefor |
KR100425254B1 (ko) * | 2001-05-16 | 2004-03-30 | 한국표준과학연구원 | 낮은 저항 계수를 갖는 망간 질화물의 제조방법 |
JP2003146693A (ja) * | 2001-11-09 | 2003-05-21 | Nippon Electric Glass Co Ltd | 光通信デバイス用基材、その製造方法及びそれを用いた光通信デバイス |
JP4476529B2 (ja) * | 2001-12-19 | 2010-06-09 | 株式会社オハラ | ガラスセラミックス及び温度補償部材 |
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2005
- 2005-07-29 CN CN200580030788XA patent/CN101023147B/zh not_active Expired - Fee Related
- 2005-07-29 EP EP05767076.2A patent/EP1790705A4/en not_active Withdrawn
- 2005-07-29 JP JP2006527870A patent/JP5099478B2/ja not_active Expired - Fee Related
- 2005-07-29 WO PCT/JP2005/013914 patent/WO2006011590A1/ja active Application Filing
- 2005-07-29 US US11/658,740 patent/US7632480B2/en not_active Expired - Fee Related
- 2005-07-29 CA CA2575391A patent/CA2575391C/en not_active Expired - Fee Related
- 2005-07-29 KR KR1020077004743A patent/KR101121155B1/ko not_active IP Right Cessation
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2012
- 2012-03-09 JP JP2012053250A patent/JP5553366B2/ja active Active
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CN115073141B (zh) * | 2022-08-22 | 2022-11-22 | 中国科学院理化技术研究所 | 一种单相近零热膨胀材料及其制备方法和应用 |
Also Published As
Publication number | Publication date |
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JP2012140324A (ja) | 2012-07-26 |
JP5099478B2 (ja) | 2012-12-19 |
EP1790705A1 (en) | 2007-05-30 |
CA2575391C (en) | 2012-09-25 |
KR101121155B1 (ko) | 2012-03-19 |
CA2575391A1 (en) | 2006-02-02 |
US7632480B2 (en) | 2009-12-15 |
KR20070083519A (ko) | 2007-08-24 |
WO2006011590A1 (ja) | 2006-02-02 |
JP5553366B2 (ja) | 2014-07-16 |
US20090004087A1 (en) | 2009-01-01 |
EP1790705A4 (en) | 2013-05-01 |
JPWO2006011590A1 (ja) | 2008-05-01 |
CN101023147B (zh) | 2010-05-12 |
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