WO2008081647A1 - 低膨張材料および低膨張材料の製造方法 - Google Patents

低膨張材料および低膨張材料の製造方法 Download PDF

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Publication number
WO2008081647A1
WO2008081647A1 PCT/JP2007/071019 JP2007071019W WO2008081647A1 WO 2008081647 A1 WO2008081647 A1 WO 2008081647A1 JP 2007071019 W JP2007071019 W JP 2007071019W WO 2008081647 A1 WO2008081647 A1 WO 2008081647A1
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WIPO (PCT)
Prior art keywords
low
expansion material
atom
production
general formula
Prior art date
Application number
PCT/JP2007/071019
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English (en)
French (fr)
Inventor
Koshi Takenaka
Hidenori Takagi
Original Assignee
Riken
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Riken filed Critical Riken
Priority to JP2008552059A priority Critical patent/JP5164168B2/ja
Publication of WO2008081647A1 publication Critical patent/WO2008081647A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/082—Compounds containing nitrogen and non-metals and optionally metals
    • C01B21/0828—Carbonitrides or oxycarbonitrides of metals, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/0602—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with two or more other elements chosen from metals, silicon or boron
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/30—Three-dimensional structures
    • C01P2002/34—Three-dimensional structures perovskite-type (ABO3)

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Products (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)

Abstract

 従来の低膨張材料より、安価な、低膨張材料を提供する。 一般式（１）で表される組成からなるマンガン窒化物結晶を含み、１０°C以上の温度域に渡って、線膨張率が－２μ/°C～＋２μ/°Cである低膨張材料。 一般式（１） Ｍｎ4-xＳｎx1Ａx2Ｅx3Ｄ （一般式（１）中、ＡはＮｉ、Ｃｕ、Ｚｎのうち少なくとも１種を表し、Ｅは原子を表し、Ｄは一部が他の原子で置換されていてもよい窒素原子である。ここでｘ＝ｘ１＋ｘ２＋ｘ３であり、０＜ｘ１＜１．０、０＜ｘ２＜１．０、０≦ｘ３≦１．０である。）
PCT/JP2007/071019 2006-12-27 2007-10-29 低膨張材料および低膨張材料の製造方法 WO2008081647A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008552059A JP5164168B2 (ja) 2006-12-27 2007-10-29 複合材料

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006352329 2006-12-27
JP2006-352329 2006-12-27
JP2007-153847 2007-06-11
JP2007153847 2007-06-11

Publications (1)

Publication Number Publication Date
WO2008081647A1 true WO2008081647A1 (ja) 2008-07-10

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ID=39588332

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/071019 WO2008081647A1 (ja) 2006-12-27 2007-10-29 低膨張材料および低膨張材料の製造方法

Country Status (2)

Country Link
JP (1) JP5164168B2 (ja)
WO (1) WO2008081647A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010071009A1 (ja) * 2008-12-17 2010-06-24 コニカミノルタオプト株式会社 可撓性樹脂基板及びそれを用いた表示装置
WO2014112406A1 (ja) * 2013-01-16 2014-07-24 独立行政法人科学技術振興機構 磁性材料及び磁性材料の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005047206A1 (ja) * 2003-11-14 2005-05-26 Matsushita Electric Industrial Co., Ltd. 負又は低い熱膨張係数を示す材料及びその製造方法
WO2006011590A1 (ja) * 2004-07-30 2006-02-02 Riken 熱膨張抑制剤、ゼロ熱膨張材料、負の熱膨張材料、熱膨張抑制方法および熱膨張抑制剤の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005047206A1 (ja) * 2003-11-14 2005-05-26 Matsushita Electric Industrial Co., Ltd. 負又は低い熱膨張係数を示す材料及びその製造方法
WO2006011590A1 (ja) * 2004-07-30 2006-02-02 Riken 熱膨張抑制剤、ゼロ熱膨張材料、負の熱膨張材料、熱膨張抑制方法および熱膨張抑制剤の製造方法

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
TAKENAKA K. ET AL.: "Giant negative thermal expansion in Ge-doped anti-perovskite mangenese nitrides", APPLIED PHYSICS LETTERS, vol. 87, 20 December 2005 (2005-12-20), pages 261902 - 261902 *
TAKENAKA K.: "Anti-perovskite Kozo o Motsu Mn Chikkabutsu: Jiki Taiseki Koka to Kyodai Fubocho", PAPERS OF DAI 150 KAI TECHNICAL MEETING OF THE MAGNETICS SOCIETY OF JAPAN, 18 October 2006 (2006-10-18), pages 7 - 12 *
TAKENAKA K.: "Ondo ga Agaru to Shushuku suru Manganese Chikkabutsu Zairyo", HAIKAN GIJUTSU, vol. 48, no. 9, 1 August 2006 (2006-08-01), pages 75 - 77 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010071009A1 (ja) * 2008-12-17 2010-06-24 コニカミノルタオプト株式会社 可撓性樹脂基板及びそれを用いた表示装置
WO2014112406A1 (ja) * 2013-01-16 2014-07-24 独立行政法人科学技術振興機構 磁性材料及び磁性材料の製造方法
US10043606B2 (en) 2013-01-16 2018-08-07 Japan Science And Technology Agency Magnetic material and method for producing magnetic material

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Publication number Publication date
JP5164168B2 (ja) 2013-03-13
JPWO2008081647A1 (ja) 2010-04-30

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