CN101001519B - 电子部件安装设备和电子部件安装方法 - Google Patents

电子部件安装设备和电子部件安装方法 Download PDF

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Publication number
CN101001519B
CN101001519B CN2007100021120A CN200710002112A CN101001519B CN 101001519 B CN101001519 B CN 101001519B CN 2007100021120 A CN2007100021120 A CN 2007100021120A CN 200710002112 A CN200710002112 A CN 200710002112A CN 101001519 B CN101001519 B CN 101001519B
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CN
China
Prior art keywords
substrate
adhesive
lsi
unit
mounting
Prior art date
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Expired - Fee Related
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CN2007100021120A
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English (en)
Chinese (zh)
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CN101001519A (zh
Inventor
中村宏一郎
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Toshiba Corp
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Toshiba Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53187—Multiple station assembly apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
CN2007100021120A 2006-01-10 2007-01-10 电子部件安装设备和电子部件安装方法 Expired - Fee Related CN101001519B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006002671A JP4714026B2 (ja) 2006-01-10 2006-01-10 電子部品実装装置、電子部品実装方法及び電子部品装置
JP2006-002671 2006-01-10
JP2006002671 2006-01-10

Publications (2)

Publication Number Publication Date
CN101001519A CN101001519A (zh) 2007-07-18
CN101001519B true CN101001519B (zh) 2010-06-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007100021120A Expired - Fee Related CN101001519B (zh) 2006-01-10 2007-01-10 电子部件安装设备和电子部件安装方法

Country Status (5)

Country Link
US (1) US7748113B2 (https=)
EP (1) EP1806962B1 (https=)
JP (1) JP4714026B2 (https=)
CN (1) CN101001519B (https=)
SG (1) SG134221A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104620686A (zh) * 2012-09-28 2015-05-13 伊利诺斯工具制品有限公司 基于角定位特征的分配系统和分配材料的方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4819602B2 (ja) * 2006-07-05 2011-11-24 パナソニック株式会社 Ａｃｆ貼付装置及びａｃｆ貼付方法
KR20090038856A (ko) * 2006-07-31 2009-04-21 파나소닉 주식회사 부품 장착 조건 결정 방법
KR20090125151A (ko) * 2007-04-03 2009-12-03 파나소닉 주식회사 부품 실장 방법
US7923056B2 (en) * 2007-06-01 2011-04-12 Illinois Tool Works Inc. Method and apparatus for dispensing material on a substrate
US7833572B2 (en) * 2007-06-01 2010-11-16 Illinois Tool Works, Inc. Method and apparatus for dispensing a viscous material on a substrate
CN101842000B (zh) * 2009-03-19 2014-04-30 鸿富锦精密工业（深圳）有限公司 贴附装置及使用该贴附装置的贴附方法
JP5440483B2 (ja) 2010-12-09 2014-03-12 パナソニック株式会社 電子部品実装システムおよび電子部品実装方法
JP6450923B2 (ja) * 2013-12-20 2019-01-16 パナソニックＩｐマネジメント株式会社 電子部品実装システムおよび電子部品実装方法ならびに電子部品実装装置
US9815081B2 (en) 2015-02-24 2017-11-14 Illinois Tool Works Inc. Method of calibrating a dispenser
CN108019403A (zh) * 2016-10-31 2018-05-11 富鼎电子科技(嘉善)有限公司 组装装置
CN110586386A (zh) * 2019-09-10 2019-12-20 浙江诺派建筑系统有限公司 一种复合板喷胶工艺
CN110831348B (zh) * 2019-11-24 2021-10-08 湖南凯通电子有限公司 热敏电阻粘接机

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1351466A (zh) * 2000-10-26 2002-05-29 三洋电机株式会社 混合集成电路装置的制造方法
CN1685470A (zh) * 2002-09-28 2005-10-19 米尔鲍尔股份公司 用于安装半导体芯片到基片上的设备和方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5602A (en) 1848-05-30 James p
JP3116509B2 (ja) * 1992-01-29 2000-12-11 松下電器産業株式会社 ヒートシンクのボンディング装置およびボンディング方法
US5811317A (en) * 1995-08-25 1998-09-22 Texas Instruments Incorporated Process for reflow bonding a semiconductor die to a substrate and the product produced by the product
JP2806348B2 (ja) * 1996-03-08 1998-09-30 日本電気株式会社 半導体素子の実装構造及びその製造方法
JP2000137781A (ja) * 1998-10-30 2000-05-16 Hitachi Ltd カード型電子回路基板及びその製造方法
JP4075204B2 (ja) * 1999-04-09 2008-04-16 松下電器産業株式会社 積層型半導体装置
JP2001028381A (ja) 1999-07-14 2001-01-30 Sony Corp 実装方法及び実装装置
JP3691995B2 (ja) * 1999-11-12 2005-09-07 新光電気工業株式会社 半導体パッケージ及びその製造方法並びに半導体装置
JP4128319B2 (ja) * 1999-12-24 2008-07-30 株式会社新川 マルチチップボンディング方法及び装置
FR2803413A1 (fr) 1999-12-30 2001-07-06 Schlumberger Systems & Service Element de carte a circuit integre monte en flip-chip
JP3531586B2 (ja) * 2000-06-12 2004-05-31 松下電器産業株式会社 表示パネルの組立装置および組立方法
JP3988878B2 (ja) * 2001-03-02 2007-10-10 東レエンジニアリング株式会社 チップ実装方法およびその装置
US6874225B2 (en) * 2001-12-18 2005-04-05 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus
JP4045838B2 (ja) * 2002-04-12 2008-02-13 松下電器産業株式会社 部品装着管理方法
JP4104062B2 (ja) * 2002-12-13 2008-06-18 松下電器産業株式会社 電子部品実装装置
ATE396607T1 (de) 2003-05-02 2008-06-15 Ericsson Ab Klebeverfahren und -vorrichtung
JP4200090B2 (ja) * 2003-12-18 2008-12-24 新光電気工業株式会社 半導体装置の製造方法
US7023089B1 (en) * 2004-03-31 2006-04-04 Intel Corporation Low temperature packaging apparatus and method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1351466A (zh) * 2000-10-26 2002-05-29 三洋电机株式会社 混合集成电路装置的制造方法
CN1685470A (zh) * 2002-09-28 2005-10-19 米尔鲍尔股份公司 用于安装半导体芯片到基片上的设备和方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP特开2001-28381A 2001.01.30
JP特开2003-115502A 2003.04.18

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104620686A (zh) * 2012-09-28 2015-05-13 伊利诺斯工具制品有限公司 基于角定位特征的分配系统和分配材料的方法
CN104620686B (zh) * 2012-09-28 2018-05-04 伊利诺斯工具制品有限公司 基于角定位特征的分配系统和分配材料的方法

Also Published As

Publication number Publication date
CN101001519A (zh) 2007-07-18
JP2007184485A (ja) 2007-07-19
EP1806962B1 (en) 2012-02-22
JP4714026B2 (ja) 2011-06-29
SG134221A1 (en) 2007-08-29
EP1806962A3 (en) 2008-06-04
US20070157462A1 (en) 2007-07-12
EP1806962A2 (en) 2007-07-11
US7748113B2 (en) 2010-07-06

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