CN100485946C - 图像拾取设备及其制造方法、相机模块和电子设备 - Google Patents

图像拾取设备及其制造方法、相机模块和电子设备 Download PDF

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Publication number
CN100485946C
CN100485946C CNB2007100067389A CN200710006738A CN100485946C CN 100485946 C CN100485946 C CN 100485946C CN B2007100067389 A CNB2007100067389 A CN B2007100067389A CN 200710006738 A CN200710006738 A CN 200710006738A CN 100485946 C CN100485946 C CN 100485946C
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CN
China
Prior art keywords
terminal block
image pickup
image pick
image
resinoid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CNB2007100067389A
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English (en)
Chinese (zh)
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CN101013710A (zh
Inventor
野村匠
涩谷仁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
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Sony Corp
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Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of CN101013710A publication Critical patent/CN101013710A/zh
Application granted granted Critical
Publication of CN100485946C publication Critical patent/CN100485946C/zh
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Studio Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
CNB2007100067389A 2006-02-02 2007-02-02 图像拾取设备及其制造方法、相机模块和电子设备 Expired - Fee Related CN100485946C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006025779A JP2007208045A (ja) 2006-02-02 2006-02-02 撮像装置、カメラモジュール、電子機器および撮像装置の製造方法
JP2006025779 2006-02-02

Publications (2)

Publication Number Publication Date
CN101013710A CN101013710A (zh) 2007-08-08
CN100485946C true CN100485946C (zh) 2009-05-06

Family

ID=38443089

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2007100067389A Expired - Fee Related CN100485946C (zh) 2006-02-02 2007-02-02 图像拾取设备及其制造方法、相机模块和电子设备

Country Status (5)

Country Link
US (1) US20070200053A1 (https=)
JP (1) JP2007208045A (https=)
KR (1) KR20070079556A (https=)
CN (1) CN100485946C (https=)
TW (1) TW200733724A (https=)

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KR100913426B1 (ko) * 2008-01-23 2009-08-21 삼성전기주식회사 카메라 모듈
JP5493569B2 (ja) * 2009-08-06 2014-05-14 株式会社ニコン 電子部品用パッケージおよび固体撮像装置
EP2553525A1 (de) * 2010-04-01 2013-02-06 Conti Temic Microelectronic GmbH Vorrichtung mit optischem modul und trägerplatte
JP5818455B2 (ja) 2011-02-17 2015-11-18 キヤノン株式会社 固体撮像装置およびその製造方法
JP6296687B2 (ja) * 2012-04-27 2018-03-20 キヤノン株式会社 電子部品、電子モジュールおよびこれらの製造方法。
JP5885690B2 (ja) 2012-04-27 2016-03-15 キヤノン株式会社 電子部品および電子機器
JP2013243340A (ja) 2012-04-27 2013-12-05 Canon Inc 電子部品、実装部材、電子機器およびこれらの製造方法
WO2014013742A1 (ja) * 2012-07-20 2014-01-23 株式会社ニコン 撮像ユニット、撮像装置、および撮像ユニットの製造方法
JP6192312B2 (ja) 2013-02-28 2017-09-06 キヤノン株式会社 実装部材の製造方法および電子部品の製造方法。
JP2014170819A (ja) * 2013-03-01 2014-09-18 Nikon Corp 撮像ユニットおよび撮像装置
JP2015084378A (ja) 2013-10-25 2015-04-30 キヤノン株式会社 電子部品、電子機器、実装部材の製造方法、電子部品の製造方法
JP6499042B2 (ja) * 2015-08-20 2019-04-10 京セラ株式会社 撮像素子実装用基板および撮像装置
JP2018121367A (ja) * 2018-04-23 2018-08-02 株式会社ニコン 撮像ユニットおよび撮像装置
US11240411B2 (en) * 2019-06-26 2022-02-01 Magna Electronics Inc. Vehicular camera with controlled camera focus
US11579400B2 (en) 2019-10-08 2023-02-14 Magna Electronics Inc. Vehicular camera with adhesive disposed between non-axially opposed surfaces of the lens barrel and PCB structure
JP2020025332A (ja) * 2019-11-06 2020-02-13 株式会社ニコン 撮像ユニットおよび撮像装置
US12174448B2 (en) 2020-06-08 2024-12-24 Magna Electronics Inc. Vehicular camera assembly process using welding to secure lens relative to camera image plane
US11635672B2 (en) 2020-06-08 2023-04-25 Magna Electronics Inc. Vehicular camera assembly process using welding to secure lens relative to camera image plane
KR20220040538A (ko) 2020-09-23 2022-03-31 삼성전자주식회사 이미지 센서 모듈
US12078913B2 (en) 2021-07-16 2024-09-03 Magna Electronics Inc. Vehicular camera with low CTE metal housing and plastic lens attachment
US12422691B2 (en) 2022-05-17 2025-09-23 Magna Electronics Inc. Vehicular camera assembly with lens barrel welded at imager housing

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JPH11340448A (ja) * 1998-05-29 1999-12-10 Sony Corp 光学装置
US6956615B2 (en) * 2000-01-28 2005-10-18 Pentax Corporation Structure for mounting a solid-state imaging device
JP4302279B2 (ja) * 2000-02-29 2009-07-22 富士フイルム株式会社 固体撮像装置及びその製造方法
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JP2005101711A (ja) * 2003-09-22 2005-04-14 Renesas Technology Corp 固体撮像装置およびその製造方法
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KR100673950B1 (ko) * 2004-02-20 2007-01-24 삼성테크윈 주식회사 이미지 센서 모듈과 이를 구비하는 카메라 모듈 패키지
JP2005260436A (ja) * 2004-03-10 2005-09-22 Mitsubishi Electric Corp 撮像モジュールおよびこれを用いた撮像装置
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KR100674911B1 (ko) * 2004-08-06 2007-01-26 삼성전자주식회사 이미지 센서 카메라 모듈 및 그 제조방법
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Also Published As

Publication number Publication date
CN101013710A (zh) 2007-08-08
US20070200053A1 (en) 2007-08-30
JP2007208045A (ja) 2007-08-16
KR20070079556A (ko) 2007-08-07
TW200733724A (en) 2007-09-01
TWI353171B (https=) 2011-11-21

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