JP2007208045A - 撮像装置、カメラモジュール、電子機器および撮像装置の製造方法 - Google Patents

撮像装置、カメラモジュール、電子機器および撮像装置の製造方法 Download PDF

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Publication number
JP2007208045A
JP2007208045A JP2006025779A JP2006025779A JP2007208045A JP 2007208045 A JP2007208045 A JP 2007208045A JP 2006025779 A JP2006025779 A JP 2006025779A JP 2006025779 A JP2006025779 A JP 2006025779A JP 2007208045 A JP2007208045 A JP 2007208045A
Authority
JP
Japan
Prior art keywords
wiring board
frame
imaging
thermosetting adhesive
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006025779A
Other languages
English (en)
Japanese (ja)
Inventor
Takumi Nomura
匠 野村
Hitoshi Shibuya
仁 渋谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2006025779A priority Critical patent/JP2007208045A/ja
Priority to KR1020070008764A priority patent/KR20070079556A/ko
Priority to US11/701,525 priority patent/US20070200053A1/en
Priority to TW096103735A priority patent/TW200733724A/zh
Priority to CNB2007100067389A priority patent/CN100485946C/zh
Publication of JP2007208045A publication Critical patent/JP2007208045A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Studio Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
JP2006025779A 2006-02-02 2006-02-02 撮像装置、カメラモジュール、電子機器および撮像装置の製造方法 Pending JP2007208045A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006025779A JP2007208045A (ja) 2006-02-02 2006-02-02 撮像装置、カメラモジュール、電子機器および撮像装置の製造方法
KR1020070008764A KR20070079556A (ko) 2006-02-02 2007-01-29 촬상 장치, 카메라 모듈, 전자 기기 및 촬상 장치의 제조방법
US11/701,525 US20070200053A1 (en) 2006-02-02 2007-02-01 Image pickup apparatus, camera module, electronic device, and fabrication method for image pickup apparatus
TW096103735A TW200733724A (en) 2006-02-02 2007-02-01 Image pickup apparatus, camera module, electronic device, and fabrication method for image pickup apparatus
CNB2007100067389A CN100485946C (zh) 2006-02-02 2007-02-02 图像拾取设备及其制造方法、相机模块和电子设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006025779A JP2007208045A (ja) 2006-02-02 2006-02-02 撮像装置、カメラモジュール、電子機器および撮像装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010115470A Division JP2010220245A (ja) 2010-05-19 2010-05-19 撮像装置、カメラモジュール、電子機器および撮像装置の製造方法

Publications (1)

Publication Number Publication Date
JP2007208045A true JP2007208045A (ja) 2007-08-16

Family

ID=38443089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006025779A Pending JP2007208045A (ja) 2006-02-02 2006-02-02 撮像装置、カメラモジュール、電子機器および撮像装置の製造方法

Country Status (5)

Country Link
US (1) US20070200053A1 (https=)
JP (1) JP2007208045A (https=)
KR (1) KR20070079556A (https=)
CN (1) CN100485946C (https=)
TW (1) TW200733724A (https=)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011040428A (ja) * 2009-08-06 2011-02-24 Nikon Corp 電子部品用パッケージおよび固体撮像装置
JP2013524702A (ja) * 2010-04-01 2013-06-17 コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツング 光学モジュール及び支持板を持つ装置
JP2013243339A (ja) * 2012-04-27 2013-12-05 Canon Inc 電子部品、電子モジュールおよびこれらの製造方法。
US8698938B2 (en) 2011-02-17 2014-04-15 Canon Kabushiki Kaisha Solid-state imaging apparatus, method of manufacturing same, and camera
JP2014167990A (ja) * 2013-02-28 2014-09-11 Canon Inc 実装部材の製造方法および電子部品の製造方法。
JP2014170819A (ja) * 2013-03-01 2014-09-18 Nikon Corp 撮像ユニットおよび撮像装置
US9155212B2 (en) 2012-04-27 2015-10-06 Canon Kabushiki Kaisha Electronic component, mounting member, electronic apparatus, and their manufacturing methods
US9253922B2 (en) 2012-04-27 2016-02-02 Canon Kabushiki Kaisha Electronic component and electronic apparatus
US9576877B2 (en) 2013-10-25 2017-02-21 Canon Kabushiki Kaisha Electronic component, electronic device, method of manufacturing mounted member, and method of manufacturing electronic component
JP2017041546A (ja) * 2015-08-20 2017-02-23 京セラ株式会社 撮像素子実装用基板および撮像装置
JP2018121367A (ja) * 2018-04-23 2018-08-02 株式会社ニコン 撮像ユニットおよび撮像装置
JP2020025332A (ja) * 2019-11-06 2020-02-13 株式会社ニコン 撮像ユニットおよび撮像装置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4470971B2 (ja) * 2007-08-07 2010-06-02 株式会社デンソー 携帯機
KR100885505B1 (ko) * 2007-09-28 2009-02-26 삼성전기주식회사 카메라 모듈 및 그 제조방법
KR100913426B1 (ko) * 2008-01-23 2009-08-21 삼성전기주식회사 카메라 모듈
WO2014013742A1 (ja) * 2012-07-20 2014-01-23 株式会社ニコン 撮像ユニット、撮像装置、および撮像ユニットの製造方法
US11240411B2 (en) * 2019-06-26 2022-02-01 Magna Electronics Inc. Vehicular camera with controlled camera focus
US11579400B2 (en) 2019-10-08 2023-02-14 Magna Electronics Inc. Vehicular camera with adhesive disposed between non-axially opposed surfaces of the lens barrel and PCB structure
US12174448B2 (en) 2020-06-08 2024-12-24 Magna Electronics Inc. Vehicular camera assembly process using welding to secure lens relative to camera image plane
US11635672B2 (en) 2020-06-08 2023-04-25 Magna Electronics Inc. Vehicular camera assembly process using welding to secure lens relative to camera image plane
KR20220040538A (ko) 2020-09-23 2022-03-31 삼성전자주식회사 이미지 센서 모듈
US12078913B2 (en) 2021-07-16 2024-09-03 Magna Electronics Inc. Vehicular camera with low CTE metal housing and plastic lens attachment
US12422691B2 (en) 2022-05-17 2025-09-23 Magna Electronics Inc. Vehicular camera assembly with lens barrel welded at imager housing

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JPS61234159A (ja) * 1985-04-10 1986-10-18 Matsushita Electric Ind Co Ltd 密着型イメ−ジセンサ
JPH11340448A (ja) * 1998-05-29 1999-12-10 Sony Corp 光学装置
JP2001244280A (ja) * 2000-02-29 2001-09-07 Fuji Film Microdevices Co Ltd 固体撮像装置及びその製造方法
JP2002289718A (ja) * 2001-03-27 2002-10-04 Kyocera Corp 固体撮像装置
JP2004119881A (ja) * 2002-09-27 2004-04-15 Sony Corp 半導体装置及びその製造方法
JP2004172511A (ja) * 2002-11-22 2004-06-17 Yoshikawa Kogyo Co Ltd 半導体光センサー
JP2005050831A (ja) * 2003-07-28 2005-02-24 Kyocera Corp 電子部品搭載用基板
JP2005260436A (ja) * 2004-03-10 2005-09-22 Mitsubishi Electric Corp 撮像モジュールおよびこれを用いた撮像装置
JP2005347337A (ja) * 2004-05-31 2005-12-15 Matsushita Electric Works Ltd 固体撮像素子収納パッケージ、および固体撮像素子収納パッケージの製造方法

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US6956615B2 (en) * 2000-01-28 2005-10-18 Pentax Corporation Structure for mounting a solid-state imaging device
JP2001245217A (ja) * 2000-03-02 2001-09-07 Olympus Optical Co Ltd 小型撮像モジュール
US6825540B2 (en) * 2001-12-05 2004-11-30 Matsushita Electric Industrial Co., Ltd. Miniaturized, resin-sealed solid state imaging apparatus
EP1471730A1 (en) * 2003-03-31 2004-10-27 Dialog Semiconductor GmbH Miniature camera module
JP3782406B2 (ja) * 2003-07-01 2006-06-07 松下電器産業株式会社 固体撮像装置およびその製造方法
US7330211B2 (en) * 2003-07-08 2008-02-12 Micron Technology, Inc. Camera module with focus adjustment structure and systems and methods of making the same
JP2005101711A (ja) * 2003-09-22 2005-04-14 Renesas Technology Corp 固体撮像装置およびその製造方法
JP4542768B2 (ja) * 2003-11-25 2010-09-15 富士フイルム株式会社 固体撮像装置及びその製造方法
KR100673950B1 (ko) * 2004-02-20 2007-01-24 삼성테크윈 주식회사 이미지 센서 모듈과 이를 구비하는 카메라 모듈 패키지
US7368695B2 (en) * 2004-05-03 2008-05-06 Tessera, Inc. Image sensor package and fabrication method
JP2006032886A (ja) * 2004-06-15 2006-02-02 Fuji Photo Film Co Ltd 固体撮像装置及びその製造方法及びカメラモジュール
KR100674911B1 (ko) * 2004-08-06 2007-01-26 삼성전자주식회사 이미지 센서 카메라 모듈 및 그 제조방법
JP2006165105A (ja) * 2004-12-03 2006-06-22 Fuji Photo Film Co Ltd 配線基板及びカメラモジュール
US7086902B1 (en) * 2005-12-15 2006-08-08 Hon Hai Precision Ind. Co., Ltd. Connector with improved shielding member

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Publication number Priority date Publication date Assignee Title
JPS61234159A (ja) * 1985-04-10 1986-10-18 Matsushita Electric Ind Co Ltd 密着型イメ−ジセンサ
JPH11340448A (ja) * 1998-05-29 1999-12-10 Sony Corp 光学装置
JP2001244280A (ja) * 2000-02-29 2001-09-07 Fuji Film Microdevices Co Ltd 固体撮像装置及びその製造方法
JP2002289718A (ja) * 2001-03-27 2002-10-04 Kyocera Corp 固体撮像装置
JP2004119881A (ja) * 2002-09-27 2004-04-15 Sony Corp 半導体装置及びその製造方法
JP2004172511A (ja) * 2002-11-22 2004-06-17 Yoshikawa Kogyo Co Ltd 半導体光センサー
JP2005050831A (ja) * 2003-07-28 2005-02-24 Kyocera Corp 電子部品搭載用基板
JP2005260436A (ja) * 2004-03-10 2005-09-22 Mitsubishi Electric Corp 撮像モジュールおよびこれを用いた撮像装置
JP2005347337A (ja) * 2004-05-31 2005-12-15 Matsushita Electric Works Ltd 固体撮像素子収納パッケージ、および固体撮像素子収納パッケージの製造方法

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011040428A (ja) * 2009-08-06 2011-02-24 Nikon Corp 電子部品用パッケージおよび固体撮像装置
US9025061B2 (en) 2010-04-01 2015-05-05 Conti Temic Microelectronic Gmbh Device having an optical module and a supporting plate
JP2013524702A (ja) * 2010-04-01 2013-06-17 コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツング 光学モジュール及び支持板を持つ装置
KR101984632B1 (ko) * 2010-04-01 2019-05-31 콘티 테믹 마이크로일렉트로닉 게엠베하 광학 모듈과 지지판이 장착된 장치
KR20180038056A (ko) * 2010-04-01 2018-04-13 콘티 테믹 마이크로일렉트로닉 게엠베하 광학 모듈과 지지판이 장착된 장치
US8698938B2 (en) 2011-02-17 2014-04-15 Canon Kabushiki Kaisha Solid-state imaging apparatus, method of manufacturing same, and camera
US9220172B2 (en) 2012-04-27 2015-12-22 Canon Kabushiki Kaisha Electronic component, electronic module, their manufacturing methods, mounting member, and electronic apparatus
US9155212B2 (en) 2012-04-27 2015-10-06 Canon Kabushiki Kaisha Electronic component, mounting member, electronic apparatus, and their manufacturing methods
US9253922B2 (en) 2012-04-27 2016-02-02 Canon Kabushiki Kaisha Electronic component and electronic apparatus
JP2013243339A (ja) * 2012-04-27 2013-12-05 Canon Inc 電子部品、電子モジュールおよびこれらの製造方法。
JP2014167990A (ja) * 2013-02-28 2014-09-11 Canon Inc 実装部材の製造方法および電子部品の製造方法。
US10381314B2 (en) 2013-02-28 2019-08-13 Canon Kabushiki Kaisha Method of manufacturing mounting member and method of manufacturing electronic component
JP2014170819A (ja) * 2013-03-01 2014-09-18 Nikon Corp 撮像ユニットおよび撮像装置
US9576877B2 (en) 2013-10-25 2017-02-21 Canon Kabushiki Kaisha Electronic component, electronic device, method of manufacturing mounted member, and method of manufacturing electronic component
JP2017041546A (ja) * 2015-08-20 2017-02-23 京セラ株式会社 撮像素子実装用基板および撮像装置
JP2018121367A (ja) * 2018-04-23 2018-08-02 株式会社ニコン 撮像ユニットおよび撮像装置
JP2020025332A (ja) * 2019-11-06 2020-02-13 株式会社ニコン 撮像ユニットおよび撮像装置

Also Published As

Publication number Publication date
CN101013710A (zh) 2007-08-08
CN100485946C (zh) 2009-05-06
US20070200053A1 (en) 2007-08-30
KR20070079556A (ko) 2007-08-07
TW200733724A (en) 2007-09-01
TWI353171B (https=) 2011-11-21

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