CN102695985A - 具有折叠式柔性电路及腔基板的相机模块 - Google Patents
具有折叠式柔性电路及腔基板的相机模块 Download PDFInfo
- Publication number
- CN102695985A CN102695985A CN2010800606685A CN201080060668A CN102695985A CN 102695985 A CN102695985 A CN 102695985A CN 2010800606685 A CN2010800606685 A CN 2010800606685A CN 201080060668 A CN201080060668 A CN 201080060668A CN 102695985 A CN102695985 A CN 102695985A
- Authority
- CN
- China
- Prior art keywords
- flexible circuit
- circuit board
- camera model
- electronic component
- model according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Lens Barrels (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
Claims (39)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/590,325 US8248523B2 (en) | 2009-11-05 | 2009-11-05 | Camera module with fold over flexible circuit and cavity substrate |
US12/590,325 | 2009-11-05 | ||
PCT/US2010/002913 WO2011056228A1 (en) | 2009-11-05 | 2010-11-05 | Camera module with fold-over flexible circuit and cavity substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102695985A true CN102695985A (zh) | 2012-09-26 |
CN102695985B CN102695985B (zh) | 2015-09-09 |
Family
ID=43925059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080060668.5A Active CN102695985B (zh) | 2009-11-05 | 2010-11-05 | 具有折叠式柔性电路及腔基板的相机模块及其制造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8248523B2 (zh) |
EP (1) | EP2496988B1 (zh) |
JP (2) | JP5632006B2 (zh) |
CN (1) | CN102695985B (zh) |
CA (1) | CA2780157A1 (zh) |
WO (1) | WO2011056228A1 (zh) |
Cited By (4)
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CN104883817A (zh) * | 2014-02-28 | 2015-09-02 | 三星电子株式会社 | 模块器件和具有模块器件的电子设备 |
CN105572840A (zh) * | 2014-11-11 | 2016-05-11 | 信泰光学(深圳)有限公司 | 薄型化光学镜头 |
CN112327464A (zh) * | 2015-01-03 | 2021-02-05 | 核心光电有限公司 | 微型长焦镜头模块和使用该镜头模块的相机 |
CN114153102A (zh) * | 2018-12-14 | 2022-03-08 | 三美电机株式会社 | 透镜驱动装置、摄像机模块及摄像机搭载装置 |
Families Citing this family (41)
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WO2008133943A1 (en) | 2007-04-24 | 2008-11-06 | Flextronics Ap Llc | Small form factor modules using wafer level optics with bottom cavity and flip chip assembly |
WO2011008443A2 (en) * | 2009-06-29 | 2011-01-20 | Lensvector Inc. | Wafer level camera module with active optical element |
CN102782574B (zh) * | 2010-01-11 | 2016-11-09 | 弗莱克斯电子有限责任公司 | 具有成型带倒装成像器底座的照相机模块及制造方法 |
CN102238319A (zh) * | 2010-04-26 | 2011-11-09 | 鸿富锦精密工业(深圳)有限公司 | 摄像装置 |
CN105159009B (zh) * | 2010-05-20 | 2018-11-06 | Lg伊诺特有限公司 | 相机模块 |
US20120075518A1 (en) * | 2010-09-29 | 2012-03-29 | Hoya Corporation | Imaging unit |
US8545114B2 (en) | 2011-03-11 | 2013-10-01 | Digitaloptics Corporation | Auto focus-zoom actuator or camera module contamination reduction feature with integrated protective membrane |
JP5607830B2 (ja) * | 2011-07-29 | 2014-10-15 | 富士フイルム株式会社 | 撮影レンズ装置用カバー |
US8913180B2 (en) | 2011-09-29 | 2014-12-16 | Flextronics Ap, Llc | Folded tape package for electronic devices |
US20130128106A1 (en) * | 2011-11-23 | 2013-05-23 | Flextronics Ap, Llc | Camera module housing having molded tape substrate with folded leads |
TW201415970A (zh) * | 2012-08-10 | 2014-04-16 | Digitaloptics Corp | 具有可撓曲印刷電路延伸之自動聚焦照相機模組 |
US8717487B2 (en) | 2012-08-10 | 2014-05-06 | Digitaloptics Corporation | Camera module with compact sponge absorbing design |
US9007520B2 (en) | 2012-08-10 | 2015-04-14 | Nanchang O-Film Optoelectronics Technology Ltd | Camera module with EMI shield |
US9001268B2 (en) | 2012-08-10 | 2015-04-07 | Nan Chang O-Film Optoelectronics Technology Ltd | Auto-focus camera module with flexible printed circuit extension |
US9746636B2 (en) | 2012-10-19 | 2017-08-29 | Cognex Corporation | Carrier frame and circuit board for an electronic device |
US9513458B1 (en) | 2012-10-19 | 2016-12-06 | Cognex Corporation | Carrier frame and circuit board for an electronic device with lens backlash reduction |
CN103813070A (zh) * | 2012-11-14 | 2014-05-21 | 鸿富锦精密工业(深圳)有限公司 | 取像装置 |
CN104108224A (zh) * | 2013-04-22 | 2014-10-22 | 鸿富锦精密工业(深圳)有限公司 | 相机模组组装装置 |
US9857568B2 (en) | 2013-07-04 | 2018-01-02 | Corephotonics Ltd. | Miniature telephoto lens assembly |
US9167161B1 (en) | 2013-08-30 | 2015-10-20 | Amazon Technologies, Inc. | Camera module package with a folded substrate and laterally positioned components |
US9497364B2 (en) | 2013-09-13 | 2016-11-15 | Lg Innotek Co., Ltd. | Camera module |
US9241097B1 (en) | 2013-09-27 | 2016-01-19 | Amazon Technologies, Inc. | Camera module including image sensor die in molded cavity substrate |
JP5990655B2 (ja) * | 2014-01-09 | 2016-09-14 | 富士フイルム株式会社 | 撮像モジュール、撮像モジュールの製造方法、電子機器 |
US9392188B2 (en) | 2014-08-10 | 2016-07-12 | Corephotonics Ltd. | Zoom dual-aperture camera with folded lens |
US10447900B2 (en) * | 2015-08-06 | 2019-10-15 | Apple Inc. | Camera module design with lead frame and plastic moulding |
CN107710729A (zh) * | 2016-01-28 | 2018-02-16 | 奥林巴斯株式会社 | 摄像单元、摄像模块以及内窥镜 |
TWI618949B (zh) * | 2016-04-01 | 2018-03-21 | 台灣東電化股份有限公司 | 鏡頭驅動機構及其控制方法 |
US10925160B1 (en) | 2016-06-28 | 2021-02-16 | Amazon Technologies, Inc. | Electronic device with a display assembly and silicon circuit board substrate |
DE102018210909A1 (de) * | 2017-09-21 | 2019-03-21 | Robert Bosch Gmbh | Verfahren zur Herstellung von Kameramodulen und einer Kameramodulgruppe |
US10257933B1 (en) | 2017-09-26 | 2019-04-09 | Google Llc | Transverse circuit board to route electrical traces |
KR102473235B1 (ko) * | 2017-09-29 | 2022-12-02 | 엘지이노텍 주식회사 | 렌즈 구동 장치, 카메라 모듈 및 광학 기기 |
CN110839124A (zh) * | 2018-08-16 | 2020-02-25 | 三赢科技(深圳)有限公司 | 镜头模组及该镜头模组的组装方法 |
JP7295375B2 (ja) * | 2018-12-14 | 2023-06-21 | ミツミ電機株式会社 | レンズ駆動装置、カメラモジュール、及びカメラ搭載装置 |
WO2021048307A1 (en) * | 2019-09-10 | 2021-03-18 | Fn Herstal S.A. | Imaging system for firearm |
US11656538B2 (en) | 2019-11-25 | 2023-05-23 | Corephotonics Ltd. | Folded zoom camera module with adaptive aperture |
KR20240001277A (ko) | 2020-05-30 | 2024-01-03 | 코어포토닉스 리미티드 | 슈퍼 매크로 이미지를 얻기 위한 시스템 및 방법 |
CN214586259U (zh) * | 2020-07-24 | 2021-11-02 | 台湾东电化股份有限公司 | 光学系统 |
KR102380310B1 (ko) * | 2020-08-26 | 2022-03-30 | 삼성전기주식회사 | 카메라 모듈 |
WO2022118176A1 (en) | 2020-12-01 | 2022-06-09 | Corephotonics Ltd. | Folded camera with continuously adaptive zoom factor |
JP2023544219A (ja) | 2021-09-23 | 2023-10-20 | コアフォトニクス リミテッド | 大口径連続ズーム屈曲テレカメラ |
EP4244670A4 (en) | 2021-11-02 | 2024-03-06 | Corephotonics Ltd. | COMPACT DOUBLE-FOLDED TV CAMERAS |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1220573A (zh) * | 1997-10-10 | 1999-06-23 | 三星电子株式会社 | 三维组合电路板 |
CN1479506A (zh) * | 2002-07-31 | 2004-03-03 | �ձ�������ʽ���� | 照相机模块和使用该照相机模块的移动通讯终端 |
CN1518384A (zh) * | 2003-01-07 | 2004-08-04 | ���ǵ�����ʽ���� | 移动通信终端的照相机组件 |
JP2004274164A (ja) * | 2003-03-05 | 2004-09-30 | Seiko Epson Corp | 光モジュール及びその製造方法並びに電子機器 |
TWI242820B (en) * | 2005-03-29 | 2005-11-01 | Siliconware Precision Industries Co Ltd | Sensor semiconductor device and method for fabricating the same |
US20060087017A1 (en) * | 2004-10-21 | 2006-04-27 | Chipmos Technologies (Bermuda) Ltd. | Image sensor package |
US20080170141A1 (en) * | 2007-01-11 | 2008-07-17 | Samuel Waising Tam | Folded package camera module and method of manufacture |
CN101432759A (zh) * | 2004-06-25 | 2009-05-13 | 弗莱克斯特罗尼克斯美国国际公司 | 在柔性衬底上安装图像记录装置的系统和方法 |
US20090268318A1 (en) * | 2008-04-24 | 2009-10-29 | Samsung Electro-Mechanics Co., Ltd. | Lens driving module |
Family Cites Families (8)
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---|---|---|---|---|
DE60026331T8 (de) * | 1999-10-01 | 2007-02-01 | Seiko Epson Corp. | Leiterplatte, halbleiter und herstellung, test und gehäuse derselben und systemplatte und elektronikgerät |
JP4276678B2 (ja) * | 2004-07-28 | 2009-06-10 | 富士通マイクロエレクトロニクス株式会社 | 撮像装置 |
JP2007041419A (ja) | 2005-08-04 | 2007-02-15 | Konica Minolta Opto Inc | 支持機構及びこれを用いた撮像装置、フレキシブル基板の取付構造及び取付方法 |
JP2007174380A (ja) * | 2005-12-22 | 2007-07-05 | Citizen Electronics Co Ltd | カメラモジュールの配置構造 |
JP2007274624A (ja) * | 2006-03-31 | 2007-10-18 | Citizen Miyota Co Ltd | カメラモジュール |
CN101295848B (zh) * | 2007-04-27 | 2010-06-09 | 鸿富锦精密工业(深圳)有限公司 | 电连接器及具有该电连接器的相机装置 |
JP5004669B2 (ja) * | 2007-05-28 | 2012-08-22 | 京セラ株式会社 | 撮像部品および撮像ユニット、ならびにこれらの製造方法 |
CN102313959B (zh) * | 2007-11-21 | 2014-11-12 | Lg伊诺特有限公司 | 摄像模块 |
-
2009
- 2009-11-05 US US12/590,325 patent/US8248523B2/en active Active
-
2010
- 2010-11-05 WO PCT/US2010/002913 patent/WO2011056228A1/en active Application Filing
- 2010-11-05 EP EP10828667.5A patent/EP2496988B1/en active Active
- 2010-11-05 JP JP2012537862A patent/JP5632006B2/ja not_active Expired - Fee Related
- 2010-11-05 CN CN201080060668.5A patent/CN102695985B/zh active Active
- 2010-11-05 CA CA2780157A patent/CA2780157A1/en not_active Abandoned
-
2014
- 2014-08-08 JP JP2014162236A patent/JP5827385B2/ja not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1220573A (zh) * | 1997-10-10 | 1999-06-23 | 三星电子株式会社 | 三维组合电路板 |
CN1479506A (zh) * | 2002-07-31 | 2004-03-03 | �ձ�������ʽ���� | 照相机模块和使用该照相机模块的移动通讯终端 |
CN1518384A (zh) * | 2003-01-07 | 2004-08-04 | ���ǵ�����ʽ���� | 移动通信终端的照相机组件 |
JP2004274164A (ja) * | 2003-03-05 | 2004-09-30 | Seiko Epson Corp | 光モジュール及びその製造方法並びに電子機器 |
CN101432759A (zh) * | 2004-06-25 | 2009-05-13 | 弗莱克斯特罗尼克斯美国国际公司 | 在柔性衬底上安装图像记录装置的系统和方法 |
US20060087017A1 (en) * | 2004-10-21 | 2006-04-27 | Chipmos Technologies (Bermuda) Ltd. | Image sensor package |
TWI242820B (en) * | 2005-03-29 | 2005-11-01 | Siliconware Precision Industries Co Ltd | Sensor semiconductor device and method for fabricating the same |
US20080170141A1 (en) * | 2007-01-11 | 2008-07-17 | Samuel Waising Tam | Folded package camera module and method of manufacture |
US20090268318A1 (en) * | 2008-04-24 | 2009-10-29 | Samsung Electro-Mechanics Co., Ltd. | Lens driving module |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104883817A (zh) * | 2014-02-28 | 2015-09-02 | 三星电子株式会社 | 模块器件和具有模块器件的电子设备 |
CN105572840A (zh) * | 2014-11-11 | 2016-05-11 | 信泰光学(深圳)有限公司 | 薄型化光学镜头 |
CN105572840B (zh) * | 2014-11-11 | 2018-11-30 | 信泰光学(深圳)有限公司 | 薄型化光学镜头 |
CN112327464A (zh) * | 2015-01-03 | 2021-02-05 | 核心光电有限公司 | 微型长焦镜头模块和使用该镜头模块的相机 |
CN114153102A (zh) * | 2018-12-14 | 2022-03-08 | 三美电机株式会社 | 透镜驱动装置、摄像机模块及摄像机搭载装置 |
CN114153102B (zh) * | 2018-12-14 | 2024-04-30 | 三美电机株式会社 | 透镜驱动装置、摄像机模块及摄像机搭载装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2011056228A1 (en) | 2011-05-12 |
JP2014212577A (ja) | 2014-11-13 |
JP5632006B2 (ja) | 2014-11-26 |
US8248523B2 (en) | 2012-08-21 |
JP2013510503A (ja) | 2013-03-21 |
US20110102667A1 (en) | 2011-05-05 |
CN102695985B (zh) | 2015-09-09 |
CA2780157A1 (en) | 2011-05-12 |
EP2496988A4 (en) | 2014-09-03 |
JP5827385B2 (ja) | 2015-12-02 |
EP2496988A1 (en) | 2012-09-12 |
EP2496988B1 (en) | 2020-10-07 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: DIGITAL OPTICS CORP. Free format text: FORMER OWNER: FLEXTRONICS INTERNAT USA INC. Effective date: 20140416 |
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C41 | Transfer of patent application or patent right or utility model | ||
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Effective date of registration: 20140416 Address after: American California Applicant after: Digital Optics Corp. Address before: American Colorado Applicant before: Flextronics Internat USA Inc. |
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ASS | Succession or assignment of patent right |
Owner name: NANCHANG O-FILM TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: DIGITAL OPTICS CORP. Effective date: 20150115 |
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Free format text: CORRECT: ADDRESS; TO: 330013 NANCHANG, JIANGXI PROVINCE |
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TA01 | Transfer of patent application right |
Effective date of registration: 20150115 Address after: North to the East, 330013 in Jiangxi province Nanchang city Nanchang economic and technological development zones clove road Longtan ditch Applicant after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Address before: American California Applicant before: Digital Optics Corp. |
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C14 | Grant of patent or utility model | ||
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TR01 | Transfer of patent right |
Effective date of registration: 20210618 Address after: 330096 no.1404, Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi Jinghao optics Co.,Ltd. Address before: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. |
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