KR101007328B1 - 카메라 모듈용 인쇄회로기판 및 카메라 모듈 - Google Patents
카메라 모듈용 인쇄회로기판 및 카메라 모듈 Download PDFInfo
- Publication number
- KR101007328B1 KR101007328B1 KR1020090041125A KR20090041125A KR101007328B1 KR 101007328 B1 KR101007328 B1 KR 101007328B1 KR 1020090041125 A KR1020090041125 A KR 1020090041125A KR 20090041125 A KR20090041125 A KR 20090041125A KR 101007328 B1 KR101007328 B1 KR 101007328B1
- Authority
- KR
- South Korea
- Prior art keywords
- circuit board
- printed circuit
- connection pad
- camera head
- camera module
- Prior art date
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- 239000012212 insulator Substances 0.000 claims abstract description 22
- 229910000679 solder Inorganic materials 0.000 claims abstract description 19
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- 230000007547 defect Effects 0.000 abstract description 3
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- 230000008569 process Effects 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000012412 chemical coupling Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
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- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
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- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
Description
Claims (4)
- 내부에 렌즈가 마련되고 하면에 연결패드가 마련되는 카메라 헤드의 하면에 결합되는 인쇄회로기판으로서,절연체;상기 연결패드에 상응하여 상기 절연체의 상면에 마련되는 접속패드;상기 절연체의 상면 중, 상기 카메라 헤드가 안착되는 영역에 마련되며, 더미패턴이 형성된 그라운드; 및상기 접속패드가 선택적으로 노출되도록, 상기 절연체의 상면을 커버하는 솔더레지스트층을 포함하는 카메라 모듈용 인쇄회로기판.
- 제1항에 있어서,상기 더미패턴은 메시(mesh) 형상인 것을 특징으로 하는 카메라 모듈용 인쇄회로기판.
- 내부에 렌즈가 마련되고 하면에 연결패드가 마련되는 카메라 헤드; 및상기 카메라 헤드의 하면에 결합되는 인쇄회로기판을 포함하며,상기 인쇄회로기판은,절연체;상기 연결패드에 상응하여 상기 절연체의 상면에 마련되는 접속패드;상기 절연체의 상면 중, 상기 카메라 헤드가 안착되는 영역에 마련되며, 더미패턴이 형성된 그라운드; 및상기 접속패드가 선택적으로 노출되도록, 상기 절연체의 상면을 커버하는 솔더레지스트층을 포함하는 카메라 모듈
- 제3항에 있어서,상기 더미패턴은 메시(mesh) 형상인 것을 특징으로 하는 카메라 모듈.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090041125A KR101007328B1 (ko) | 2009-05-12 | 2009-05-12 | 카메라 모듈용 인쇄회로기판 및 카메라 모듈 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090041125A KR101007328B1 (ko) | 2009-05-12 | 2009-05-12 | 카메라 모듈용 인쇄회로기판 및 카메라 모듈 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100122199A KR20100122199A (ko) | 2010-11-22 |
KR101007328B1 true KR101007328B1 (ko) | 2011-01-13 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020090041125A KR101007328B1 (ko) | 2009-05-12 | 2009-05-12 | 카메라 모듈용 인쇄회로기판 및 카메라 모듈 |
Country Status (1)
Country | Link |
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KR (1) | KR101007328B1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102171594B1 (ko) | 2014-04-03 | 2020-10-30 | 삼성디스플레이 주식회사 | 백라이트 유닛 및 이를 포함하는 액정 표시 장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11307886A (ja) | 1998-04-21 | 1999-11-05 | Matsushita Electric Ind Co Ltd | フリップチップ接合ランドうねり防止パターン |
JP2003124447A (ja) * | 2001-10-09 | 2003-04-25 | Seiko Precision Inc | 固体撮像装置 |
JP2006294765A (ja) | 2005-04-08 | 2006-10-26 | Sony Corp | 固体撮像装置及びその製造方法 |
JP2008098286A (ja) * | 2006-10-10 | 2008-04-24 | Rohm Co Ltd | 半導体装置 |
-
2009
- 2009-05-12 KR KR1020090041125A patent/KR101007328B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11307886A (ja) | 1998-04-21 | 1999-11-05 | Matsushita Electric Ind Co Ltd | フリップチップ接合ランドうねり防止パターン |
JP2003124447A (ja) * | 2001-10-09 | 2003-04-25 | Seiko Precision Inc | 固体撮像装置 |
JP2006294765A (ja) | 2005-04-08 | 2006-10-26 | Sony Corp | 固体撮像装置及びその製造方法 |
JP2008098286A (ja) * | 2006-10-10 | 2008-04-24 | Rohm Co Ltd | 半導体装置 |
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Publication number | Publication date |
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KR20100122199A (ko) | 2010-11-22 |
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