CN100465212C - 可活性能量射线固化的有机聚硅氧烷树脂组合物、透光组件及其制造方法 - Google Patents
可活性能量射线固化的有机聚硅氧烷树脂组合物、透光组件及其制造方法 Download PDFInfo
- Publication number
- CN100465212C CN100465212C CNB2005800174642A CN200580017464A CN100465212C CN 100465212 C CN100465212 C CN 100465212C CN B2005800174642 A CNB2005800174642 A CN B2005800174642A CN 200580017464 A CN200580017464 A CN 200580017464A CN 100465212 C CN100465212 C CN 100465212C
- Authority
- CN
- China
- Prior art keywords
- active energy
- resin composition
- energy ray
- sio
- organopolysiloxane resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Epoxy Resins (AREA)
- Silicon Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Optical Integrated Circuits (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004160720A JP4629367B2 (ja) | 2004-05-31 | 2004-05-31 | 活性エネルギー線硬化型オルガノポリシロキサン樹脂組成物、光伝送部材およびその製造方法 |
| JP160720/2004 | 2004-05-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1961026A CN1961026A (zh) | 2007-05-09 |
| CN100465212C true CN100465212C (zh) | 2009-03-04 |
Family
ID=34968837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005800174642A Expired - Fee Related CN100465212C (zh) | 2004-05-31 | 2005-05-30 | 可活性能量射线固化的有机聚硅氧烷树脂组合物、透光组件及其制造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7844153B2 (https=) |
| EP (1) | EP1761586B1 (https=) |
| JP (1) | JP4629367B2 (https=) |
| CN (1) | CN100465212C (https=) |
| AT (1) | ATE457327T1 (https=) |
| DE (1) | DE602005019292D1 (https=) |
| TW (1) | TWI383007B (https=) |
| WO (1) | WO2005116113A1 (https=) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2003254564A1 (en) * | 2003-07-22 | 2005-02-25 | Canon Kabushiki Kaisha | Liquid-repellent coating composition and coating having high alkali resistance |
| DE102005002960A1 (de) | 2005-01-21 | 2006-08-03 | Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh | Kompositzusammensetzung für mikrogemusterte Schichten mit hohem Relaxationsvermögen, hoher chemischer Beständigkeit und mechanischer Stabilität |
| JP4818646B2 (ja) * | 2005-06-10 | 2011-11-16 | 東レ・ダウコーニング株式会社 | シリコーンレジンの精製方法 |
| DE102006033280A1 (de) | 2006-07-18 | 2008-01-24 | Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh | Kompositzusammensetzung für mikrostrukturierte Schichten |
| AT505533A1 (de) * | 2007-08-14 | 2009-02-15 | Austria Tech & System Tech | Verfahren zur herstellung von in einem auf einem träger aufgebrachten, insbesondere flexiblen polymermaterial ausgebildeten, optischen wellenleitern sowie leiterplatte und verwendung |
| JP2010241948A (ja) * | 2009-04-06 | 2010-10-28 | Shin-Etsu Chemical Co Ltd | 放射線硬化性シリコーン組成物 |
| JP5526321B2 (ja) * | 2009-08-24 | 2014-06-18 | 独立行政法人 宇宙航空研究開発機構 | 宇宙空間用硬化性組成物、宇宙空間用硬化物、及び、宇宙空間用複合膜 |
| EP2517052B1 (en) | 2009-12-21 | 2019-06-12 | Dow Silicones Corporation | Methods for fabricating flexible waveguides using alkyl-functional silsesquioxane resins |
| JP5878862B2 (ja) * | 2010-03-02 | 2016-03-08 | 日本化薬株式会社 | 硬化性樹脂組成物、及びその硬化物 |
| US9064686B2 (en) * | 2010-04-15 | 2015-06-23 | Suss Microtec Lithography, Gmbh | Method and apparatus for temporary bonding of ultra thin wafers |
| KR20140035359A (ko) * | 2011-04-08 | 2014-03-21 | 다우 코닝 코포레이션 | 에폭시-작용성 실록산을 사용해 가스 선택적 막을 제조하는 방법 |
| TW201319170A (zh) | 2011-05-25 | 2013-05-16 | Dow Corning | 在溶劑顯影期間增強膜保留和黏附之含有環氧官能化矽氧烷寡聚物的環氧官能化的可輻射固化組合物 |
| US8995814B2 (en) * | 2012-03-20 | 2015-03-31 | Dow Corning Corporation | Light guide and associated light assemblies |
| JP6004581B2 (ja) * | 2013-03-25 | 2016-10-12 | 日本化薬株式会社 | エポキシ基含有シリコーン樹脂、エポキシ基含有シリコーン樹脂組成物、及びその硬化物 |
| US9188861B2 (en) * | 2014-03-05 | 2015-11-17 | Eastman Kodak Company | Photopolymerizable compositions for electroless plating methods |
| JP2016009195A (ja) * | 2014-06-26 | 2016-01-18 | 東洋合成工業株式会社 | 化学種の発生を向上させるための化合物 |
| WO2016052323A1 (ja) * | 2014-09-30 | 2016-04-07 | 東レ株式会社 | ディスプレイ用支持基板、それを用いたカラーフィルターおよびその製造方法、有機el素子およびその製造方法、ならびにフレキシブル有機elディスプレイ |
| US9434852B2 (en) * | 2014-10-15 | 2016-09-06 | Eastman Kodak Company | Photocurable compositions with dispersed carbon-coated metal particles |
| CN104293179A (zh) * | 2014-10-28 | 2015-01-21 | 成都纳硕科技有限公司 | 一种耐候性强的紫外光固化水性涂料 |
| US10604653B2 (en) * | 2015-10-19 | 2020-03-31 | Dow Toray Co., Ltd. | Active energy ray curable hot melt silicone composition, cured product thereof, and method of producing film |
| KR102505090B1 (ko) * | 2016-02-24 | 2023-03-02 | 닛산 가가쿠 가부시키가이샤 | 실리콘 함유 패턴반전용 피복제 |
| US10852480B2 (en) * | 2017-08-24 | 2020-12-01 | Dow Global Technologies Llc | Method for optical waveguide fabrication using polysiloxane, epoxy, photo acid generator, and hydrosilation catalyst |
| SG11202001247PA (en) * | 2017-08-24 | 2020-03-30 | Dow Global Technologies Llc | Method for optical waveguide fabrication |
| CN110998389B (zh) | 2017-08-24 | 2022-03-01 | 陶氏环球技术有限责任公司 | 光波导制造方法 |
| TWI858038B (zh) * | 2019-03-29 | 2024-10-11 | 日商大日本印刷股份有限公司 | 壓印用光硬化性樹脂組合物、壓印用光硬化性樹脂組合物之製造方法、及圖案形成體之製造方法 |
| CN114502662A (zh) * | 2019-10-03 | 2022-05-13 | 3M创新有限公司 | 采用自由基介导固化的有机硅弹性体 |
| TWI871377B (zh) * | 2019-12-18 | 2025-02-01 | 美商陶氏有機矽公司 | 可固化聚矽氧組成物及其固化產物 |
| US12559628B2 (en) | 2020-09-25 | 2026-02-24 | Dow Silicones Corporation | Curable silicone composition and cured product thereof |
| JP7801242B2 (ja) * | 2020-11-10 | 2026-01-16 | ダウ・東レ株式会社 | 紫外線硬化性組成物およびその用途 |
| KR20230161491A (ko) * | 2021-03-26 | 2023-11-27 | 다우 도레이 캄파니 리미티드 | 자외선 경화성 조성물 및 그의 용도 |
| TW202300545A (zh) * | 2021-06-22 | 2023-01-01 | 美商陶氏有機矽公司 | 可雙重固化聚矽氧組成物 |
| WO2025105092A1 (ja) * | 2023-11-17 | 2025-05-22 | パナソニックIpマネジメント株式会社 | 光導波路用樹脂組成物、並びに、それを用いたドライフィルム、光導波路及び半導体パッケージ基板 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0355381A1 (en) * | 1988-07-29 | 1990-02-28 | General Electric Company | Silicone release coating compositions |
| CN1272858A (zh) * | 1998-04-17 | 2000-11-08 | Ck韦特科公司 | 有机硅低聚物及含该低聚物的可固化组合物 |
| CN1279250A (zh) * | 1999-06-24 | 2001-01-10 | 瓦克化学有限公司 | 可加成交联的环氧官能化聚有机硅氧烷聚合物及涂料组合物 |
| JP2003327664A (ja) * | 2002-05-16 | 2003-11-19 | Dow Corning Toray Silicone Co Ltd | 紫外線硬化性オルガノポリシロキサン組成物 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5369205A (en) * | 1992-07-30 | 1994-11-29 | General Electric Company | UV-curable epoxysilicones bearing pendant silicone resin |
| JP3263177B2 (ja) | 1993-04-15 | 2002-03-04 | 東レ・ダウコーニング・シリコーン株式会社 | エポキシ基含有シリコーンレジンおよびその製造方法 |
| JP3339910B2 (ja) * | 1993-04-15 | 2002-10-28 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性樹脂組成物 |
| US5739174A (en) * | 1993-12-15 | 1998-04-14 | Minnesota Mining And Manufacturing Company | Epoxysilicone photocurable composition comprising a sulfolene or isatin photosensitizer |
| FR2724660B1 (fr) * | 1994-09-16 | 1997-01-31 | Rhone Poulenc Chimie | Amorceurs de reticulation, par voie cationique, de polymeres a groupements organofonctionnels, compositions a base de polyorganosiloxanes reticulables et contenant ces amorceurs et application desdites compositions en antiadherence |
| WO1998020394A1 (en) * | 1996-11-04 | 1998-05-14 | The B.F. Goodrich Company | Photodefinable dielectric compositions |
| EP1099737A1 (en) * | 1999-11-12 | 2001-05-16 | General Electric Company | Radiation curable silicone composition |
| JP2001348482A (ja) * | 2000-06-07 | 2001-12-18 | Shin Etsu Chem Co Ltd | 放射線硬化型シリコーン含有剥離性組成物及び剥離フィルム |
| DE60120432T2 (de) * | 2000-08-28 | 2007-01-04 | Aprilis, Inc., Maynard | Holographisches speichermedium, das polyfunktionelle epoxidmonomere enthält, welche zur kationischen polymerisation fähig sind |
| JP3952149B2 (ja) * | 2002-02-06 | 2007-08-01 | 信越化学工業株式会社 | 光導波路形成用材料及び光導波路の製造方法 |
| US7031591B2 (en) * | 2002-07-18 | 2006-04-18 | Shin-Etsu Chemical Co., Ltd. | Optical waveguide, forming material and making method |
| US6832036B2 (en) * | 2002-10-11 | 2004-12-14 | Polyset Company, Inc. | Siloxane optical waveguides |
| JP4651935B2 (ja) * | 2003-12-10 | 2011-03-16 | 東レ・ダウコーニング株式会社 | 活性エネルギー線硬化型オルガノポリシロキサン樹脂組成物、光伝送部材および光伝送部材の製造方法 |
| US7122290B2 (en) * | 2004-06-15 | 2006-10-17 | General Electric Company | Holographic storage medium |
-
2004
- 2004-05-31 JP JP2004160720A patent/JP4629367B2/ja not_active Expired - Fee Related
-
2005
- 2005-05-30 DE DE602005019292T patent/DE602005019292D1/de not_active Expired - Lifetime
- 2005-05-30 EP EP05745950A patent/EP1761586B1/en not_active Expired - Lifetime
- 2005-05-30 CN CNB2005800174642A patent/CN100465212C/zh not_active Expired - Fee Related
- 2005-05-30 WO PCT/JP2005/010293 patent/WO2005116113A1/en not_active Ceased
- 2005-05-30 AT AT05745950T patent/ATE457327T1/de not_active IP Right Cessation
- 2005-05-30 US US11/569,788 patent/US7844153B2/en active Active
- 2005-05-31 TW TW094117925A patent/TWI383007B/zh not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0355381A1 (en) * | 1988-07-29 | 1990-02-28 | General Electric Company | Silicone release coating compositions |
| CN1272858A (zh) * | 1998-04-17 | 2000-11-08 | Ck韦特科公司 | 有机硅低聚物及含该低聚物的可固化组合物 |
| CN1279250A (zh) * | 1999-06-24 | 2001-01-10 | 瓦克化学有限公司 | 可加成交联的环氧官能化聚有机硅氧烷聚合物及涂料组合物 |
| JP2003327664A (ja) * | 2002-05-16 | 2003-11-19 | Dow Corning Toray Silicone Co Ltd | 紫外線硬化性オルガノポリシロキサン組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI383007B (zh) | 2013-01-21 |
| ATE457327T1 (de) | 2010-02-15 |
| WO2005116113A1 (en) | 2005-12-08 |
| TW200613373A (en) | 2006-05-01 |
| EP1761586A1 (en) | 2007-03-14 |
| JP2005336421A (ja) | 2005-12-08 |
| DE602005019292D1 (de) | 2010-03-25 |
| JP4629367B2 (ja) | 2011-02-09 |
| EP1761586B1 (en) | 2010-02-10 |
| CN1961026A (zh) | 2007-05-09 |
| US7844153B2 (en) | 2010-11-30 |
| US20080032061A1 (en) | 2008-02-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090304 |