TWI383007B - 活性能量射線可固化之有機聚矽氧烷樹脂組合物，光傳輸元件及彼等之製造方法 - Google Patents
活性能量射線可固化之有機聚矽氧烷樹脂組合物，光傳輸元件及彼等之製造方法 Download PDFInfo
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- TWI383007B TWI383007B TW094117925A TW94117925A TWI383007B TW I383007 B TWI383007 B TW I383007B TW 094117925 A TW094117925 A TW 094117925A TW 94117925 A TW94117925 A TW 94117925A TW I383007 B TWI383007 B TW I383007B
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- 239000001301 oxygen Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- OJNNAJJFLWBPRS-UHFFFAOYSA-N phenyl-[(2,4,6-trimethylphenyl)methyl]-[(2,4,6-trimethylphenyl)methylidene]phosphanium Chemical compound CC1=C(C=P(C2=CC=CC=C2)=CC2=C(C=C(C=C2C)C)C)C(=CC(=C1)C)C OJNNAJJFLWBPRS-UHFFFAOYSA-N 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 208000017983 photosensitivity disease Diseases 0.000 description 1
- 231100000434 photosensitization Toxicity 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000003847 radiation curing Methods 0.000 description 1
- 150000003342 selenium Chemical class 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 238000000807 solvent casting Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 125000003107 substituted aryl group Chemical group 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Epoxy Resins (AREA)
- Silicon Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Optical Integrated Circuits (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004160720A JP4629367B2 (ja) | 2004-05-31 | 2004-05-31 | 活性エネルギー線硬化型オルガノポリシロキサン樹脂組成物、光伝送部材およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200613373A TW200613373A (en) | 2006-05-01 |
| TWI383007B true TWI383007B (zh) | 2013-01-21 |
Family
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| TW094117925A TWI383007B (zh) | 2004-05-31 | 2005-05-31 | 活性能量射線可固化之有機聚矽氧烷樹脂組合物，光傳輸元件及彼等之製造方法 |
Country Status (8)
| Country | Link |
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| US (1) | US7844153B2 (https=) |
| EP (1) | EP1761586B1 (https=) |
| JP (1) | JP4629367B2 (https=) |
| CN (1) | CN100465212C (https=) |
| AT (1) | ATE457327T1 (https=) |
| DE (1) | DE602005019292D1 (https=) |
| TW (1) | TWI383007B (https=) |
| WO (1) | WO2005116113A1 (https=) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2003254564A1 (en) * | 2003-07-22 | 2005-02-25 | Canon Kabushiki Kaisha | Liquid-repellent coating composition and coating having high alkali resistance |
| DE102005002960A1 (de) | 2005-01-21 | 2006-08-03 | Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh | Kompositzusammensetzung für mikrogemusterte Schichten mit hohem Relaxationsvermögen, hoher chemischer Beständigkeit und mechanischer Stabilität |
| JP4818646B2 (ja) * | 2005-06-10 | 2011-11-16 | 東レ・ダウコーニング株式会社 | シリコーンレジンの精製方法 |
| DE102006033280A1 (de) | 2006-07-18 | 2008-01-24 | Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh | Kompositzusammensetzung für mikrostrukturierte Schichten |
| AT505533A1 (de) * | 2007-08-14 | 2009-02-15 | Austria Tech & System Tech | Verfahren zur herstellung von in einem auf einem träger aufgebrachten, insbesondere flexiblen polymermaterial ausgebildeten, optischen wellenleitern sowie leiterplatte und verwendung |
| JP2010241948A (ja) * | 2009-04-06 | 2010-10-28 | Shin-Etsu Chemical Co Ltd | 放射線硬化性シリコーン組成物 |
| JP5526321B2 (ja) * | 2009-08-24 | 2014-06-18 | 独立行政法人 宇宙航空研究開発機構 | 宇宙空間用硬化性組成物、宇宙空間用硬化物、及び、宇宙空間用複合膜 |
| EP2517052B1 (en) | 2009-12-21 | 2019-06-12 | Dow Silicones Corporation | Methods for fabricating flexible waveguides using alkyl-functional silsesquioxane resins |
| JP5878862B2 (ja) * | 2010-03-02 | 2016-03-08 | 日本化薬株式会社 | 硬化性樹脂組成物、及びその硬化物 |
| US9064686B2 (en) * | 2010-04-15 | 2015-06-23 | Suss Microtec Lithography, Gmbh | Method and apparatus for temporary bonding of ultra thin wafers |
| KR20140035359A (ko) * | 2011-04-08 | 2014-03-21 | 다우 코닝 코포레이션 | 에폭시-작용성 실록산을 사용해 가스 선택적 막을 제조하는 방법 |
| TW201319170A (zh) | 2011-05-25 | 2013-05-16 | Dow Corning | 在溶劑顯影期間增強膜保留和黏附之含有環氧官能化矽氧烷寡聚物的環氧官能化的可輻射固化組合物 |
| US8995814B2 (en) * | 2012-03-20 | 2015-03-31 | Dow Corning Corporation | Light guide and associated light assemblies |
| JP6004581B2 (ja) * | 2013-03-25 | 2016-10-12 | 日本化薬株式会社 | エポキシ基含有シリコーン樹脂、エポキシ基含有シリコーン樹脂組成物、及びその硬化物 |
| US9188861B2 (en) * | 2014-03-05 | 2015-11-17 | Eastman Kodak Company | Photopolymerizable compositions for electroless plating methods |
| JP2016009195A (ja) * | 2014-06-26 | 2016-01-18 | 東洋合成工業株式会社 | 化学種の発生を向上させるための化合物 |
| WO2016052323A1 (ja) * | 2014-09-30 | 2016-04-07 | 東レ株式会社 | ディスプレイ用支持基板、それを用いたカラーフィルターおよびその製造方法、有機ｅｌ素子およびその製造方法、ならびにフレキシブル有機ｅｌディスプレイ |
| US9434852B2 (en) * | 2014-10-15 | 2016-09-06 | Eastman Kodak Company | Photocurable compositions with dispersed carbon-coated metal particles |
| CN104293179A (zh) * | 2014-10-28 | 2015-01-21 | 成都纳硕科技有限公司 | 一种耐候性强的紫外光固化水性涂料 |
| US10604653B2 (en) * | 2015-10-19 | 2020-03-31 | Dow Toray Co., Ltd. | Active energy ray curable hot melt silicone composition, cured product thereof, and method of producing film |
| KR102505090B1 (ko) * | 2016-02-24 | 2023-03-02 | 닛산 가가쿠 가부시키가이샤 | 실리콘 함유 패턴반전용 피복제 |
| US10852480B2 (en) * | 2017-08-24 | 2020-12-01 | Dow Global Technologies Llc | Method for optical waveguide fabrication using polysiloxane, epoxy, photo acid generator, and hydrosilation catalyst |
| SG11202001247PA (en) * | 2017-08-24 | 2020-03-30 | Dow Global Technologies Llc | Method for optical waveguide fabrication |
| CN110998389B (zh) | 2017-08-24 | 2022-03-01 | 陶氏环球技术有限责任公司 | 光波导制造方法 |
| TWI858038B (zh) * | 2019-03-29 | 2024-10-11 | 日商大日本印刷股份有限公司 | 壓印用光硬化性樹脂組合物、壓印用光硬化性樹脂組合物之製造方法、及圖案形成體之製造方法 |
| CN114502662A (zh) * | 2019-10-03 | 2022-05-13 | 3M创新有限公司 | 采用自由基介导固化的有机硅弹性体 |
| TWI871377B (zh) * | 2019-12-18 | 2025-02-01 | 美商陶氏有機矽公司 | 可固化聚矽氧組成物及其固化產物 |
| US12559628B2 (en) | 2020-09-25 | 2026-02-24 | Dow Silicones Corporation | Curable silicone composition and cured product thereof |
| JP7801242B2 (ja) * | 2020-11-10 | 2026-01-16 | ダウ・東レ株式会社 | 紫外線硬化性組成物およびその用途 |
| KR20230161491A (ko) * | 2021-03-26 | 2023-11-27 | 다우 도레이 캄파니 리미티드 | 자외선 경화성 조성물 및 그의 용도 |
| TW202300545A (zh) * | 2021-06-22 | 2023-01-01 | 美商陶氏有機矽公司 | 可雙重固化聚矽氧組成物 |
| WO2025105092A1 (ja) * | 2023-11-17 | 2025-05-22 | パナソニックＩｐマネジメント株式会社 | 光導波路用樹脂組成物、並びに、それを用いたドライフィルム、光導波路及び半導体パッケージ基板 |
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| US20030148226A1 (en) * | 2002-02-06 | 2003-08-07 | Kinya Kodama | Optical waveguide forming material and method |
| US20040076391A1 (en) * | 2002-10-11 | 2004-04-22 | Polyset Chemical Company Inc. | Siloxane optical waveguides |
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| US4952657A (en) * | 1988-07-29 | 1990-08-28 | General Electric Company | Silicone release coating compositions |
| US5369205A (en) * | 1992-07-30 | 1994-11-29 | General Electric Company | UV-curable epoxysilicones bearing pendant silicone resin |
| JP3263177B2 (ja) | 1993-04-15 | 2002-03-04 | 東レ・ダウコーニング・シリコーン株式会社 | エポキシ基含有シリコーンレジンおよびその製造方法 |
| JP3339910B2 (ja) * | 1993-04-15 | 2002-10-28 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性樹脂組成物 |
| US5739174A (en) * | 1993-12-15 | 1998-04-14 | Minnesota Mining And Manufacturing Company | Epoxysilicone photocurable composition comprising a sulfolene or isatin photosensitizer |
| FR2724660B1 (fr) * | 1994-09-16 | 1997-01-31 | Rhone Poulenc Chimie | Amorceurs de reticulation, par voie cationique, de polymeres a groupements organofonctionnels, compositions a base de polyorganosiloxanes reticulables et contenant ces amorceurs et application desdites compositions en antiadherence |
| WO1998020394A1 (en) * | 1996-11-04 | 1998-05-14 | The B.F. Goodrich Company | Photodefinable dielectric compositions |
| US6140445A (en) * | 1998-04-17 | 2000-10-31 | Crompton Corporation | Silane functional oligomer |
| US6344520B1 (en) * | 1999-06-24 | 2002-02-05 | Wacker Silicones Corporation | Addition-crosslinkable epoxy-functional organopolysiloxane polymer and coating compositions |
| EP1099737A1 (en) * | 1999-11-12 | 2001-05-16 | General Electric Company | Radiation curable silicone composition |
| JP2001348482A (ja) * | 2000-06-07 | 2001-12-18 | Shin Etsu Chem Co Ltd | 放射線硬化型シリコーン含有剥離性組成物及び剥離フィルム |
| DE60120432T2 (de) * | 2000-08-28 | 2007-01-04 | Aprilis, Inc., Maynard | Holographisches speichermedium, das polyfunktionelle epoxidmonomere enthält, welche zur kationischen polymerisation fähig sind |
| JP2003327664A (ja) * | 2002-05-16 | 2003-11-19 | Dow Corning Toray Silicone Co Ltd | 紫外線硬化性オルガノポリシロキサン組成物 |
| US7031591B2 (en) * | 2002-07-18 | 2006-04-18 | Shin-Etsu Chemical Co., Ltd. | Optical waveguide, forming material and making method |
| JP4651935B2 (ja) * | 2003-12-10 | 2011-03-16 | 東レ・ダウコーニング株式会社 | 活性エネルギー線硬化型オルガノポリシロキサン樹脂組成物、光伝送部材および光伝送部材の製造方法 |
| US7122290B2 (en) * | 2004-06-15 | 2006-10-17 | General Electric Company | Holographic storage medium |
-
2004
- 2004-05-31 JP JP2004160720A patent/JP4629367B2/ja not_active Expired - Fee Related
-
2005
- 2005-05-30 DE DE602005019292T patent/DE602005019292D1/de not_active Expired - Lifetime
- 2005-05-30 EP EP05745950A patent/EP1761586B1/en not_active Expired - Lifetime
- 2005-05-30 CN CNB2005800174642A patent/CN100465212C/zh not_active Expired - Fee Related
- 2005-05-30 WO PCT/JP2005/010293 patent/WO2005116113A1/en not_active Ceased
- 2005-05-30 AT AT05745950T patent/ATE457327T1/de not_active IP Right Cessation
- 2005-05-30 US US11/569,788 patent/US7844153B2/en active Active
- 2005-05-31 TW TW094117925A patent/TWI383007B/zh not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030148226A1 (en) * | 2002-02-06 | 2003-08-07 | Kinya Kodama | Optical waveguide forming material and method |
| US20040076391A1 (en) * | 2002-10-11 | 2004-04-22 | Polyset Chemical Company Inc. | Siloxane optical waveguides |
Also Published As
| Publication number | Publication date |
|---|---|
| ATE457327T1 (de) | 2010-02-15 |
| WO2005116113A1 (en) | 2005-12-08 |
| TW200613373A (en) | 2006-05-01 |
| EP1761586A1 (en) | 2007-03-14 |
| JP2005336421A (ja) | 2005-12-08 |
| DE602005019292D1 (de) | 2010-03-25 |
| JP4629367B2 (ja) | 2011-02-09 |
| EP1761586B1 (en) | 2010-02-10 |
| CN100465212C (zh) | 2009-03-04 |
| CN1961026A (zh) | 2007-05-09 |
| US7844153B2 (en) | 2010-11-30 |
| US20080032061A1 (en) | 2008-02-07 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |