JP2005336421A5 - - Google Patents
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- Publication number
- JP2005336421A5 JP2005336421A5 JP2004160720A JP2004160720A JP2005336421A5 JP 2005336421 A5 JP2005336421 A5 JP 2005336421A5 JP 2004160720 A JP2004160720 A JP 2004160720A JP 2004160720 A JP2004160720 A JP 2004160720A JP 2005336421 A5 JP2005336421 A5 JP 2005336421A5
- Authority
- JP
- Japan
- Prior art keywords
- component
- organopolysiloxane resin
- epoxy group
- containing organopolysiloxane
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001296 polysiloxane Polymers 0.000 description 31
- 125000003700 epoxy group Chemical group 0.000 description 27
- 239000011347 resin Substances 0.000 description 16
- 229920005989 resin Polymers 0.000 description 16
- 239000011342 resin composition Substances 0.000 description 16
- 230000003287 optical effect Effects 0.000 description 10
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 8
- 239000003504 photosensitizing agent Substances 0.000 description 7
- 238000002834 transmittance Methods 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- -1 polysiloxane Polymers 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 4
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 4
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000005253 cladding Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 2
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- RJGDLRCDCYRQOQ-UHFFFAOYSA-N anthrone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3CC2=C1 RJGDLRCDCYRQOQ-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004160720A JP4629367B2 (ja) | 2004-05-31 | 2004-05-31 | 活性エネルギー線硬化型オルガノポリシロキサン樹脂組成物、光伝送部材およびその製造方法 |
| DE602005019292T DE602005019292D1 (de) | 2004-05-31 | 2005-05-30 | Mit strahlen aktiver energie härtbare organopolysiloxanharzzusammensetzung, optisches transmissionsbauteil und herstellungsverfahren dafür |
| US11/569,788 US7844153B2 (en) | 2004-05-31 | 2005-05-30 | Active energy ray-curable organopolysiloxane resin composition, optical transmission component, and manufacturing method thereof |
| PCT/JP2005/010293 WO2005116113A1 (en) | 2004-05-31 | 2005-05-30 | Active energy ray-curable organopolysiloxane resin composition, optical transmission component, and manufacturing method thereof |
| AT05745950T ATE457327T1 (de) | 2004-05-31 | 2005-05-30 | Mit strahlen aktiver energie härtbare organopolysiloxanharzzusammensetzung, optisches transmissionsbauteil und herstellungsverfahren dafür |
| CNB2005800174642A CN100465212C (zh) | 2004-05-31 | 2005-05-30 | 可活性能量射线固化的有机聚硅氧烷树脂组合物、透光组件及其制造方法 |
| EP05745950A EP1761586B1 (en) | 2004-05-31 | 2005-05-30 | Active energy ray-curable organopolysiloxane resin composition, optical transmission component, and manufacturing method thereof |
| TW094117925A TWI383007B (zh) | 2004-05-31 | 2005-05-31 | 活性能量射線可固化之有機聚矽氧烷樹脂組合物，光傳輸元件及彼等之製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004160720A JP4629367B2 (ja) | 2004-05-31 | 2004-05-31 | 活性エネルギー線硬化型オルガノポリシロキサン樹脂組成物、光伝送部材およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005336421A JP2005336421A (ja) | 2005-12-08 |
| JP2005336421A5 true JP2005336421A5 (https=) | 2007-07-05 |
| JP4629367B2 JP4629367B2 (ja) | 2011-02-09 |
Family
ID=34968837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004160720A Expired - Fee Related JP4629367B2 (ja) | 2004-05-31 | 2004-05-31 | 活性エネルギー線硬化型オルガノポリシロキサン樹脂組成物、光伝送部材およびその製造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7844153B2 (https=) |
| EP (1) | EP1761586B1 (https=) |
| JP (1) | JP4629367B2 (https=) |
| CN (1) | CN100465212C (https=) |
| AT (1) | ATE457327T1 (https=) |
| DE (1) | DE602005019292D1 (https=) |
| TW (1) | TWI383007B (https=) |
| WO (1) | WO2005116113A1 (https=) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1601733A1 (en) * | 2003-07-22 | 2005-12-07 | Leibniz-Institut für Neue Materialien gemeinnützige GmbH | Liquid-repellent coating composition and coating having high alkali resistance |
| DE102005002960A1 (de) | 2005-01-21 | 2006-08-03 | Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh | Kompositzusammensetzung für mikrogemusterte Schichten mit hohem Relaxationsvermögen, hoher chemischer Beständigkeit und mechanischer Stabilität |
| JP4818646B2 (ja) * | 2005-06-10 | 2011-11-16 | 東レ・ダウコーニング株式会社 | シリコーンレジンの精製方法 |
| DE102006033280A1 (de) | 2006-07-18 | 2008-01-24 | Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh | Kompositzusammensetzung für mikrostrukturierte Schichten |
| AT505533A1 (de) * | 2007-08-14 | 2009-02-15 | Austria Tech & System Tech | Verfahren zur herstellung von in einem auf einem träger aufgebrachten, insbesondere flexiblen polymermaterial ausgebildeten, optischen wellenleitern sowie leiterplatte und verwendung |
| JP2010241948A (ja) * | 2009-04-06 | 2010-10-28 | Shin-Etsu Chemical Co Ltd | 放射線硬化性シリコーン組成物 |
| JP5526321B2 (ja) * | 2009-08-24 | 2014-06-18 | 独立行政法人 宇宙航空研究開発機構 | 宇宙空間用硬化性組成物、宇宙空間用硬化物、及び、宇宙空間用複合膜 |
| JP5914351B2 (ja) | 2009-12-21 | 2016-05-11 | ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ | アルキル官能性シルセスキオキサン樹脂を使用した柔軟性導波路の製造方法 |
| TWI538959B (zh) * | 2010-03-02 | 2016-06-21 | 日本化藥股份有限公司 | Hardened resin composition and hardened product thereof |
| US9064686B2 (en) * | 2010-04-15 | 2015-06-23 | Suss Microtec Lithography, Gmbh | Method and apparatus for temporary bonding of ultra thin wafers |
| WO2012138755A1 (en) * | 2011-04-08 | 2012-10-11 | Dongchan Ahn | Method of preparing gas selective membrane using epoxy-functional siloxanes |
| KR101804344B1 (ko) | 2011-05-25 | 2017-12-04 | 다우 코닝 코포레이션 | 에폭시－작용성 실록산 올리고머를 함유하는 에폭시－작용성 방사선－경화성 조성물 |
| KR102063029B1 (ko) * | 2012-03-20 | 2020-02-11 | 다우 실리콘즈 코포레이션 | 광 가이드 및 관련된 광 어셈블리 |
| JP6004581B2 (ja) * | 2013-03-25 | 2016-10-12 | 日本化薬株式会社 | エポキシ基含有シリコーン樹脂、エポキシ基含有シリコーン樹脂組成物、及びその硬化物 |
| US9188861B2 (en) * | 2014-03-05 | 2015-11-17 | Eastman Kodak Company | Photopolymerizable compositions for electroless plating methods |
| JP2016009195A (ja) * | 2014-06-26 | 2016-01-18 | 東洋合成工業株式会社 | 化学種の発生を向上させるための化合物 |
| SG11201702467QA (en) * | 2014-09-30 | 2017-04-27 | Toray Industries | Support substrate for display, color filter employing same and method for manufacturing same, organic led element and method for manufacturing same, and flexible organic el display |
| US9434852B2 (en) * | 2014-10-15 | 2016-09-06 | Eastman Kodak Company | Photocurable compositions with dispersed carbon-coated metal particles |
| CN104293179A (zh) * | 2014-10-28 | 2015-01-21 | 成都纳硕科技有限公司 | 一种耐候性强的紫外光固化水性涂料 |
| EP3365391A4 (en) * | 2015-10-19 | 2019-06-12 | Dow Corning Toray Co., Ltd. | MELT SILICONE COMPOSITION CURABLE BY ACTIVE ENERGY RADIATION, CURED PRODUCT THEREOF, AND FILM PRODUCTION PROCESS |
| WO2017145809A1 (ja) * | 2016-02-24 | 2017-08-31 | 日産化学工業株式会社 | シリコン含有パターン反転用被覆剤 |
| US10852480B2 (en) * | 2017-08-24 | 2020-12-01 | Dow Global Technologies Llc | Method for optical waveguide fabrication using polysiloxane, epoxy, photo acid generator, and hydrosilation catalyst |
| KR102620913B1 (ko) * | 2017-08-24 | 2024-01-05 | 다우 글로벌 테크놀로지스 엘엘씨 | 광학 도파관 제작 방법 |
| CN110998389B (zh) * | 2017-08-24 | 2022-03-01 | 陶氏环球技术有限责任公司 | 光波导制造方法 |
| WO2020203472A1 (ja) * | 2019-03-29 | 2020-10-08 | 大日本印刷株式会社 | インプリント用光硬化性樹脂組成物、インプリント用光硬化性樹脂組成物の製造方法、およびパターン形成体の製造方法 |
| WO2021064534A2 (en) * | 2019-10-03 | 2021-04-08 | 3M Innovative Properties Company | Silicone elastomers by free radical mediated cure |
| TWI871377B (zh) * | 2019-12-18 | 2025-02-01 | 美商陶氏有機矽公司 | 可固化聚矽氧組成物及其固化產物 |
| JP7774044B2 (ja) | 2020-09-25 | 2025-11-20 | ダウ シリコーンズ コーポレーション | 硬化性シリコーン組成物及びその硬化物 |
| WO2022102626A1 (ja) * | 2020-11-10 | 2022-05-19 | ダウ・東レ株式会社 | 紫外線硬化性組成物およびその用途 |
| KR20230161491A (ko) * | 2021-03-26 | 2023-11-27 | 다우 도레이 캄파니 리미티드 | 자외선 경화성 조성물 및 그의 용도 |
| TW202300545A (zh) * | 2021-06-22 | 2023-01-01 | 美商陶氏有機矽公司 | 可雙重固化聚矽氧組成物 |
| WO2025105092A1 (ja) * | 2023-11-17 | 2025-05-22 | パナソニックＩｐマネジメント株式会社 | 光導波路用樹脂組成物、並びに、それを用いたドライフィルム、光導波路及び半導体パッケージ基板 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4952657A (en) * | 1988-07-29 | 1990-08-28 | General Electric Company | Silicone release coating compositions |
| US5369205A (en) * | 1992-07-30 | 1994-11-29 | General Electric Company | UV-curable epoxysilicones bearing pendant silicone resin |
| JP3263177B2 (ja) | 1993-04-15 | 2002-03-04 | 東レ・ダウコーニング・シリコーン株式会社 | エポキシ基含有シリコーンレジンおよびその製造方法 |
| JP3339910B2 (ja) * | 1993-04-15 | 2002-10-28 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性樹脂組成物 |
| US5739174A (en) * | 1993-12-15 | 1998-04-14 | Minnesota Mining And Manufacturing Company | Epoxysilicone photocurable composition comprising a sulfolene or isatin photosensitizer |
| FR2724660B1 (fr) * | 1994-09-16 | 1997-01-31 | Rhone Poulenc Chimie | Amorceurs de reticulation, par voie cationique, de polymeres a groupements organofonctionnels, compositions a base de polyorganosiloxanes reticulables et contenant ces amorceurs et application desdites compositions en antiadherence |
| WO1998020394A1 (en) * | 1996-11-04 | 1998-05-14 | The B.F. Goodrich Company | Photodefinable dielectric compositions |
| US6140445A (en) * | 1998-04-17 | 2000-10-31 | Crompton Corporation | Silane functional oligomer |
| US6344520B1 (en) * | 1999-06-24 | 2002-02-05 | Wacker Silicones Corporation | Addition-crosslinkable epoxy-functional organopolysiloxane polymer and coating compositions |
| EP1099737A1 (en) * | 1999-11-12 | 2001-05-16 | General Electric Company | Radiation curable silicone composition |
| JP2001348482A (ja) * | 2000-06-07 | 2001-12-18 | Shin Etsu Chem Co Ltd | 放射線硬化型シリコーン含有剥離性組成物及び剥離フィルム |
| ATE328939T1 (de) * | 2000-08-28 | 2006-06-15 | Aprilis Inc | Holographisches speichermedium, das polyfunktionelle epoxidmonomere enthält, welche zur kationischen polymerisation fähig sind |
| JP3952149B2 (ja) * | 2002-02-06 | 2007-08-01 | 信越化学工業株式会社 | 光導波路形成用材料及び光導波路の製造方法 |
| JP2003327664A (ja) * | 2002-05-16 | 2003-11-19 | Dow Corning Toray Silicone Co Ltd | 紫外線硬化性オルガノポリシロキサン組成物 |
| US7031591B2 (en) * | 2002-07-18 | 2006-04-18 | Shin-Etsu Chemical Co., Ltd. | Optical waveguide, forming material and making method |
| US6832036B2 (en) * | 2002-10-11 | 2004-12-14 | Polyset Company, Inc. | Siloxane optical waveguides |
| JP4651935B2 (ja) * | 2003-12-10 | 2011-03-16 | 東レ・ダウコーニング株式会社 | 活性エネルギー線硬化型オルガノポリシロキサン樹脂組成物、光伝送部材および光伝送部材の製造方法 |
| US7122290B2 (en) * | 2004-06-15 | 2006-10-17 | General Electric Company | Holographic storage medium |
-
2004
- 2004-05-31 JP JP2004160720A patent/JP4629367B2/ja not_active Expired - Fee Related
-
2005
- 2005-05-30 US US11/569,788 patent/US7844153B2/en active Active
- 2005-05-30 DE DE602005019292T patent/DE602005019292D1/de not_active Expired - Lifetime
- 2005-05-30 CN CNB2005800174642A patent/CN100465212C/zh not_active Expired - Fee Related
- 2005-05-30 WO PCT/JP2005/010293 patent/WO2005116113A1/en not_active Ceased
- 2005-05-30 EP EP05745950A patent/EP1761586B1/en not_active Expired - Lifetime
- 2005-05-30 AT AT05745950T patent/ATE457327T1/de not_active IP Right Cessation
- 2005-05-31 TW TW094117925A patent/TWI383007B/zh not_active IP Right Cessation
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