CN100454537C - 电子装置及其制造方法 - Google Patents

电子装置及其制造方法 Download PDF

Info

Publication number
CN100454537C
CN100454537C CNB2006100753213A CN200610075321A CN100454537C CN 100454537 C CN100454537 C CN 100454537C CN B2006100753213 A CNB2006100753213 A CN B2006100753213A CN 200610075321 A CN200610075321 A CN 200610075321A CN 100454537 C CN100454537 C CN 100454537C
Authority
CN
China
Prior art keywords
terminal
connector unit
terminal block
unit
housing unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2006100753213A
Other languages
English (en)
Chinese (zh)
Other versions
CN1848427A (zh
Inventor
中野撤男
前田幸宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of CN1848427A publication Critical patent/CN1848427A/zh
Application granted granted Critical
Publication of CN100454537C publication Critical patent/CN100454537C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0069—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0173—Template for holding a PCB having mounted components thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
CNB2006100753213A 2005-04-13 2006-04-12 电子装置及其制造方法 Expired - Fee Related CN100454537C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005115625A JP4475160B2 (ja) 2005-04-13 2005-04-13 電子装置の製造方法
JP115625/2005 2005-04-13

Publications (2)

Publication Number Publication Date
CN1848427A CN1848427A (zh) 2006-10-18
CN100454537C true CN100454537C (zh) 2009-01-21

Family

ID=37055655

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2006100753213A Expired - Fee Related CN100454537C (zh) 2005-04-13 2006-04-12 电子装置及其制造方法

Country Status (4)

Country Link
US (1) US7209367B2 (enExample)
JP (1) JP4475160B2 (enExample)
CN (1) CN100454537C (enExample)
DE (1) DE102006016775A1 (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4628337B2 (ja) * 2006-10-04 2011-02-09 日本インター株式会社 パワー半導体モジュール
JP5088811B2 (ja) * 2007-01-10 2012-12-05 矢崎総業株式会社 電気接続箱
TWI402952B (zh) * 2007-09-27 2013-07-21 三洋電機股份有限公司 電路裝置及其製造方法
JP2009081325A (ja) * 2007-09-27 2009-04-16 Sanyo Electric Co Ltd 回路装置
JP4934559B2 (ja) * 2007-09-27 2012-05-16 オンセミコンダクター・トレーディング・リミテッド 回路装置およびその製造方法
JP4969388B2 (ja) * 2007-09-27 2012-07-04 オンセミコンダクター・トレーディング・リミテッド 回路モジュール
JP5187065B2 (ja) * 2008-08-18 2013-04-24 株式会社デンソー 電子制御装置の製造方法及び電子制御装置
JP5586866B2 (ja) * 2008-09-29 2014-09-10 株式会社日立産機システム 電力変換装置
WO2012057428A1 (ko) * 2010-10-25 2012-05-03 한국단자공업 주식회사 인쇄회로기판 및 이를 사용한 차량용 기판블록
FR2979177B1 (fr) * 2011-08-19 2014-05-23 Valeo Sys Controle Moteur Sas Bloc de puissance pour onduleur de vehicule electrique
DE102012204145A1 (de) * 2012-03-16 2013-09-19 Continental Automotive Gmbh Gehäuseblende zur Aufnahme von Steckermodulen
JP2015026820A (ja) * 2013-06-18 2015-02-05 株式会社デンソー 電子装置
DE102013010843A1 (de) * 2013-06-28 2014-12-31 Wabco Gmbh Elektrisches Steuergerät
DE102014007443A1 (de) * 2014-05-21 2015-11-26 Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Hallstadt Elektrische Baugruppe für ein Kraftfahrzeug und Verfahren zur Montage einer solchen elektrischen Baugruppe
JP6354594B2 (ja) * 2015-01-09 2018-07-11 株式会社デンソー 電子装置
US9293870B1 (en) * 2015-03-10 2016-03-22 Continental Automotive Systems, Inc. Electronic control module having a cover allowing for inspection of right angle press-fit pins
US9652008B2 (en) * 2015-04-02 2017-05-16 Det International Holding Limited Power module
US10517181B2 (en) * 2015-09-29 2019-12-24 Hitachi Automotive Systems, Ltd. Electronic control device and manufacturing method for same
JP6806024B2 (ja) * 2017-10-03 2020-12-23 三菱電機株式会社 半導体装置
EP3531806B1 (de) * 2018-02-26 2020-03-25 ZKW Group GmbH Elektronische leiterplattenbaugruppe für hochleistungsbauteile
JP6768730B2 (ja) * 2018-03-30 2020-10-14 株式会社東芝 電子機器
DE102019113068A1 (de) * 2019-05-17 2020-11-19 Marelli Automotive Lighting Reutlingen (Germany) GmbH Leiterplatte mit einer Steckverbindung
EP3829000B1 (en) * 2019-11-26 2023-02-15 Eaton Intelligent Power Limited Bonding resistance and electromagnetic interference management of a surface mounted connector
JP2021128984A (ja) * 2020-02-12 2021-09-02 キヤノン株式会社 光学センサ、画像形成装置
JP2021128983A (ja) * 2020-02-12 2021-09-02 キヤノン株式会社 光学センサ、画像形成装置
CN112614830A (zh) * 2020-11-30 2021-04-06 华为技术有限公司 一种封装模组及电子设备
EP4213202B1 (de) * 2022-01-17 2024-02-28 Siemens Aktiengesellschaft Leistungsmodul

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5408383A (en) * 1991-05-31 1995-04-18 Nippondenso Co., Ltd. Container for electronic devices having a plurality of circuit boards
US6060772A (en) * 1997-06-30 2000-05-09 Kabushiki Kaisha Toshiba Power semiconductor module with a plurality of semiconductor chips
JP3172393B2 (ja) * 1995-04-27 2001-06-04 三洋電機株式会社 混成集積回路装置
US6421244B1 (en) * 1999-12-28 2002-07-16 Mitsubishi Denki Kabushiki Kaisha Power module
US20020113302A1 (en) * 2001-02-20 2002-08-22 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
CN1381161A (zh) * 2000-05-11 2002-11-20 罗伯特·博施有限公司 电子装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4993956A (en) * 1989-11-01 1991-02-19 Amp Incorporated Active electrical connector
JP2765278B2 (ja) 1991-05-31 1998-06-11 株式会社デンソー 電子装置の製造方法
JP2705368B2 (ja) * 1991-05-31 1998-01-28 株式会社デンソー 電子装置
US5646827A (en) 1991-05-31 1997-07-08 Nippondenso Co., Ltd. Electronic device having a plurality of circuit boards arranged therein
US5586388A (en) 1991-05-31 1996-12-24 Nippondenso Co., Ltd. Method for producing multi-board electronic device
JPH0729647A (ja) 1993-07-12 1995-01-31 Nippondenso Co Ltd フレキシブルプリント板装置
US5329436A (en) * 1993-10-04 1994-07-12 David Chiu Removable heat sink for xenon arc lamp packages
DE4426465A1 (de) * 1994-07-26 1996-02-01 Siemens Ag Verbindungsteil zwischen elektrischen Anschlüssen im Inneren eines Gehäuses und aus dem Gehäuse herausragenden Anschlüssen
JP3778586B2 (ja) 1994-09-30 2006-05-24 三洋電機株式会社 混成集積回路装置
JP3334394B2 (ja) 1995-01-17 2002-10-15 株式会社デンソー 車両用計器の防水構造
JP3785276B2 (ja) * 1998-09-10 2006-06-14 矢崎総業株式会社 電気接続箱
US6354846B1 (en) * 1998-09-17 2002-03-12 The Furukawa Electric Co., Ltd. Electrical connection box
JP3720642B2 (ja) * 1999-07-26 2005-11-30 アルプス電気株式会社 スイッチ装置
DE10017335B4 (de) * 2000-04-07 2011-03-10 Conti Temic Microelectronic Gmbh Elektronische Baugruppe
JP2003243066A (ja) * 2002-02-19 2003-08-29 Denso Corp 電子装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5408383A (en) * 1991-05-31 1995-04-18 Nippondenso Co., Ltd. Container for electronic devices having a plurality of circuit boards
JP3172393B2 (ja) * 1995-04-27 2001-06-04 三洋電機株式会社 混成集積回路装置
US6060772A (en) * 1997-06-30 2000-05-09 Kabushiki Kaisha Toshiba Power semiconductor module with a plurality of semiconductor chips
US6421244B1 (en) * 1999-12-28 2002-07-16 Mitsubishi Denki Kabushiki Kaisha Power module
CN1381161A (zh) * 2000-05-11 2002-11-20 罗伯特·博施有限公司 电子装置
US20020113302A1 (en) * 2001-02-20 2002-08-22 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

Also Published As

Publication number Publication date
US7209367B2 (en) 2007-04-24
DE102006016775A1 (de) 2006-10-19
US20060234528A1 (en) 2006-10-19
CN1848427A (zh) 2006-10-18
JP4475160B2 (ja) 2010-06-09
JP2006294974A (ja) 2006-10-26

Similar Documents

Publication Publication Date Title
US7209367B2 (en) Electronic apparatus and method for manufacturing the same
US6843421B2 (en) Molded memory module and method of making the module absent a substrate support
JP5599328B2 (ja) 電力用半導体装置とプリント配線板との接続機構
US20110182048A1 (en) Electronic assembly and method for its manufacture
JP4886308B2 (ja) Ｕｓｂメモリ装置
JP2010129797A (ja) 電力用半導体装置
JP2010027813A (ja) 電力用半導体装置
CN102005433B (zh) 带连接端子的基板
CN101202275A (zh) 具有屏蔽壳的封装
WO2015079294A2 (en) Semiconductor device
JP2000208686A (ja) パワ―モジュ―ルのパッケ―ジ構造
CN119731786A (zh) 具有模制通孔和双侧压接插针的功率模块封装
EP4123696A2 (en) Power module
CN110301166B (zh) 电子器件模块和用于制造电子器件模块的方法
JP3379920B2 (ja) Ｉｃ用ソケット
JP4172767B2 (ja) 配線基板
JP3505908B2 (ja) 導電ワイヤ接続端子
JP2001035961A (ja) 半導体装置及びその製造方法
JPH10242385A (ja) 電力用混合集積回路装置
JPH07263622A (ja) 半導体装置
CN119422232A (zh) 具有模制通孔和双侧压接插针的功率模块封装
JP3652102B2 (ja) 電子回路モジュール
JP4114902B2 (ja) 複合半導体装置
JP3312353B2 (ja) Ｉｃソケット
JP2001015198A (ja) エレクトロニクスパッケージとこれに接続されて使用するコンタクトとこのパッケージの構成方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090121

Termination date: 20190412