CN100448023C - 具有u字型栅极结构的半导体器件 - Google Patents
具有u字型栅极结构的半导体器件 Download PDFInfo
- Publication number
- CN100448023C CN100448023C CNB2003801019541A CN200380101954A CN100448023C CN 100448023 C CN100448023 C CN 100448023C CN B2003801019541 A CNB2003801019541 A CN B2003801019541A CN 200380101954 A CN200380101954 A CN 200380101954A CN 100448023 C CN100448023 C CN 100448023C
- Authority
- CN
- China
- Prior art keywords
- gate
- fin
- semiconductor device
- insulating layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/024—Manufacture or treatment of FETs having insulated gates [IGFET] of fin field-effect transistors [FinFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/024—Manufacture or treatment of FETs having insulated gates [IGFET] of fin field-effect transistors [FinFET]
- H10D30/0241—Manufacture or treatment of FETs having insulated gates [IGFET] of fin field-effect transistors [FinFET] doping of vertical sidewalls, e.g. using tilted or multi-angled implants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/62—Fin field-effect transistors [FinFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6733—Multi-gate TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/517—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
- H10D64/518—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers characterised by their lengths or sectional shapes
Landscapes
- Thin Film Transistor (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/274,867 US6833588B2 (en) | 2002-10-22 | 2002-10-22 | Semiconductor device having a U-shaped gate structure |
| US10/274,867 | 2002-10-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1708855A CN1708855A (zh) | 2005-12-14 |
| CN100448023C true CN100448023C (zh) | 2008-12-31 |
Family
ID=32093167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003801019541A Expired - Fee Related CN100448023C (zh) | 2002-10-22 | 2003-10-14 | 具有u字型栅极结构的半导体器件 |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US6833588B2 (enExample) |
| JP (1) | JP4745663B2 (enExample) |
| KR (1) | KR100993937B1 (enExample) |
| CN (1) | CN100448023C (enExample) |
| AU (1) | AU2003282849A1 (enExample) |
| DE (1) | DE10393565B4 (enExample) |
| GB (1) | GB2409575B (enExample) |
| TW (1) | TWI321336B (enExample) |
| WO (1) | WO2004038804A2 (enExample) |
Families Citing this family (90)
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| US7728360B2 (en) * | 2002-12-06 | 2010-06-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Multiple-gate transistor structure |
| US7148526B1 (en) | 2003-01-23 | 2006-12-12 | Advanced Micro Devices, Inc. | Germanium MOSFET devices and methods for making same |
| US7259425B2 (en) * | 2003-01-23 | 2007-08-21 | Advanced Micro Devices, Inc. | Tri-gate and gate around MOSFET devices and methods for making same |
| US7074656B2 (en) * | 2003-04-29 | 2006-07-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Doping of semiconductor fin devices |
| US6909151B2 (en) | 2003-06-27 | 2005-06-21 | Intel Corporation | Nonplanar device with stress incorporation layer and method of fabrication |
| US7456476B2 (en) | 2003-06-27 | 2008-11-25 | Intel Corporation | Nonplanar semiconductor device with partially or fully wrapped around gate electrode and methods of fabrication |
| US6960804B1 (en) | 2003-08-04 | 2005-11-01 | Hussman Corporation | Semiconductor device having a gate structure surrounding a fin |
| US6876042B1 (en) | 2003-09-03 | 2005-04-05 | Advanced Micro Devices, Inc. | Additional gate control for a double-gate MOSFET |
| US6970373B2 (en) * | 2003-10-02 | 2005-11-29 | Intel Corporation | Method and apparatus for improving stability of a 6T CMOS SRAM cell |
| US7064022B1 (en) * | 2003-12-08 | 2006-06-20 | Advanced Micro Devices, Inc. | Method of forming merged FET inverter/logic gate |
| US7271444B2 (en) * | 2003-12-11 | 2007-09-18 | International Business Machines Corporation | Wrap-around gate field effect transistor |
| US8217450B1 (en) | 2004-02-03 | 2012-07-10 | GlobalFoundries, Inc. | Double-gate semiconductor device with gate contacts formed adjacent sidewalls of a fin |
| US7154118B2 (en) | 2004-03-31 | 2006-12-26 | Intel Corporation | Bulk non-planar transistor having strained enhanced mobility and methods of fabrication |
| US7579280B2 (en) | 2004-06-01 | 2009-08-25 | Intel Corporation | Method of patterning a film |
| US7042009B2 (en) | 2004-06-30 | 2006-05-09 | Intel Corporation | High mobility tri-gate devices and methods of fabrication |
| US7348284B2 (en) | 2004-08-10 | 2008-03-25 | Intel Corporation | Non-planar pMOS structure with a strained channel region and an integrated strained CMOS flow |
| US7332439B2 (en) | 2004-09-29 | 2008-02-19 | Intel Corporation | Metal gate transistors with epitaxial source and drain regions |
| US7422946B2 (en) | 2004-09-29 | 2008-09-09 | Intel Corporation | Independently accessed double-gate and tri-gate transistors in same process flow |
| US7361958B2 (en) | 2004-09-30 | 2008-04-22 | Intel Corporation | Nonplanar transistors with metal gate electrodes |
| US20060086977A1 (en) | 2004-10-25 | 2006-04-27 | Uday Shah | Nonplanar device with thinned lower body portion and method of fabrication |
| US7518196B2 (en) | 2005-02-23 | 2009-04-14 | Intel Corporation | Field effect transistor with narrow bandgap source and drain regions and method of fabrication |
| US20060202266A1 (en) | 2005-03-14 | 2006-09-14 | Marko Radosavljevic | Field effect transistor with metal source/drain regions |
| US7858481B2 (en) | 2005-06-15 | 2010-12-28 | Intel Corporation | Method for fabricating transistor with thinned channel |
| US7547637B2 (en) | 2005-06-21 | 2009-06-16 | Intel Corporation | Methods for patterning a semiconductor film |
| US7279375B2 (en) | 2005-06-30 | 2007-10-09 | Intel Corporation | Block contact architectures for nanoscale channel transistors |
| US7402875B2 (en) | 2005-08-17 | 2008-07-22 | Intel Corporation | Lateral undercut of metal gate in SOI device |
| US20070090416A1 (en) | 2005-09-28 | 2007-04-26 | Doyle Brian S | CMOS devices with a single work function gate electrode and method of fabrication |
| US7479421B2 (en) | 2005-09-28 | 2009-01-20 | Intel Corporation | Process for integrating planar and non-planar CMOS transistors on a bulk substrate and article made thereby |
| US7485503B2 (en) | 2005-11-30 | 2009-02-03 | Intel Corporation | Dielectric interface for group III-V semiconductor device |
| US7564081B2 (en) * | 2005-11-30 | 2009-07-21 | International Business Machines Corporation | finFET structure with multiply stressed gate electrode |
| US7402856B2 (en) * | 2005-12-09 | 2008-07-22 | Intel Corporation | Non-planar microelectronic device having isolation element to mitigate fringe effects and method to fabricate same |
| US7439588B2 (en) * | 2005-12-13 | 2008-10-21 | Intel Corporation | Tri-gate integration with embedded floating body memory cell using a high-K dual metal gate |
| US7512017B2 (en) * | 2005-12-21 | 2009-03-31 | Intel Corporation | Integration of planar and tri-gate devices on the same substrate |
| US7525160B2 (en) | 2005-12-27 | 2009-04-28 | Intel Corporation | Multigate device with recessed strain regions |
| US7396711B2 (en) | 2005-12-27 | 2008-07-08 | Intel Corporation | Method of fabricating a multi-cornered film |
| US20070148926A1 (en) * | 2005-12-28 | 2007-06-28 | Intel Corporation | Dual halo implant for improving short channel effect in three-dimensional tri-gate transistors |
| US20070235763A1 (en) * | 2006-03-29 | 2007-10-11 | Doyle Brian S | Substrate band gap engineered multi-gate pMOS devices |
| US7407847B2 (en) * | 2006-03-31 | 2008-08-05 | Intel Corporation | Stacked multi-gate transistor design and method of fabrication |
| US7425500B2 (en) | 2006-03-31 | 2008-09-16 | Intel Corporation | Uniform silicide metal on epitaxially grown source and drain regions of three-dimensional transistors |
| US7449373B2 (en) | 2006-03-31 | 2008-11-11 | Intel Corporation | Method of ion implanting for tri-gate devices |
| US8143646B2 (en) | 2006-08-02 | 2012-03-27 | Intel Corporation | Stacking fault and twin blocking barrier for integrating III-V on Si |
| US7435683B2 (en) * | 2006-09-15 | 2008-10-14 | Intel Corporation | Apparatus and method for selectively recessing spacers on multi-gate devices |
| US20080097346A1 (en) * | 2006-09-19 | 2008-04-24 | Alcon, Inc. | Trocar cannula |
| US7700470B2 (en) | 2006-09-22 | 2010-04-20 | Intel Corporation | Selective anisotropic wet etching of workfunction metal for semiconductor devices |
| US7842579B2 (en) * | 2007-01-22 | 2010-11-30 | Infineon Technologies Ag | Method for manufacturing a semiconductor device having doped and undoped polysilicon layers |
| US7838948B2 (en) * | 2007-01-30 | 2010-11-23 | Infineon Technologies Ag | Fin interconnects for multigate FET circuit blocks |
| US7680553B2 (en) * | 2007-03-08 | 2010-03-16 | Smp Logic Systems Llc | Methods of interfacing nanomaterials for the monitoring and execution of pharmaceutical manufacturing processes |
| US8567869B2 (en) | 2007-05-12 | 2013-10-29 | Willi Kussel | Shield control device for carrying out the longwall function of a longwall unit in the longwall face working in a mine |
| US20090004231A1 (en) | 2007-06-30 | 2009-01-01 | Popp Shane M | Pharmaceutical dosage forms fabricated with nanomaterials for quality monitoring |
| US8362566B2 (en) | 2008-06-23 | 2013-01-29 | Intel Corporation | Stress in trigate devices using complimentary gate fill materials |
| US20100155801A1 (en) * | 2008-12-22 | 2010-06-24 | Doyle Brian S | Integrated circuit, 1T-1C embedded memory cell containing same, and method of manufacturing 1T-1C memory cell for embedded memory application |
| US7999298B2 (en) * | 2008-12-30 | 2011-08-16 | Intel Corporation | Embedded memory cell and method of manufacturing same |
| US8957482B2 (en) * | 2009-03-31 | 2015-02-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Electrical fuse and related applications |
| US8912602B2 (en) * | 2009-04-14 | 2014-12-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | FinFETs and methods for forming the same |
| US8461015B2 (en) * | 2009-07-08 | 2013-06-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | STI structure and method of forming bottom void in same |
| US8472227B2 (en) * | 2010-01-27 | 2013-06-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated circuits and methods for forming the same |
| US8629478B2 (en) * | 2009-07-31 | 2014-01-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fin structure for high mobility multiple-gate transistor |
| US8298925B2 (en) | 2010-11-08 | 2012-10-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mechanisms for forming ultra shallow junction |
| US8759943B2 (en) | 2010-10-08 | 2014-06-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Transistor having notched fin structure and method of making the same |
| US8623728B2 (en) | 2009-07-28 | 2014-01-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for forming high germanium concentration SiGe stressor |
| US8264032B2 (en) | 2009-09-01 | 2012-09-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Accumulation type FinFET, circuits and fabrication method thereof |
| US8497528B2 (en) | 2010-05-06 | 2013-07-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for fabricating a strained structure |
| US8440517B2 (en) | 2010-10-13 | 2013-05-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | FinFET and method of fabricating the same |
| US8482073B2 (en) * | 2010-03-25 | 2013-07-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated circuit including FINFETs and methods for forming the same |
| US9484462B2 (en) * | 2009-09-24 | 2016-11-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fin structure of fin field effect transistor |
| US8980719B2 (en) | 2010-04-28 | 2015-03-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods for doping fin field-effect transistors |
| US9922878B2 (en) | 2010-01-08 | 2018-03-20 | Semiconductor Manufacturing International (Shanghai) Corporation | Hybrid integrated semiconductor tri-gate and split dual-gate FinFET devices and method for manufacturing |
| CN102122645B (zh) | 2010-01-08 | 2014-03-12 | 中芯国际集成电路制造(上海)有限公司 | 集成电路结构、其制造方法和使用方法 |
| US9040393B2 (en) | 2010-01-14 | 2015-05-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of forming semiconductor structure |
| US8174055B2 (en) | 2010-02-17 | 2012-05-08 | Globalfoundries Inc. | Formation of FinFET gate spacer |
| US8603924B2 (en) | 2010-10-19 | 2013-12-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods of forming gate dielectric material |
| US8769446B2 (en) | 2010-11-12 | 2014-07-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and device for increasing fin device density for unaligned fins |
| US8592915B2 (en) | 2011-01-25 | 2013-11-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Doped oxide for shallow trench isolation (STI) |
| US8877602B2 (en) | 2011-01-25 | 2014-11-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mechanisms of doping oxide for forming shallow trench isolation |
| US8431453B2 (en) | 2011-03-31 | 2013-04-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Plasma doping to reduce dielectric loss during removal of dummy layers in a gate structure |
| US8637372B2 (en) * | 2011-06-29 | 2014-01-28 | GlobalFoundries, Inc. | Methods for fabricating a FINFET integrated circuit on a bulk silicon substrate |
| US8637930B2 (en) * | 2011-10-13 | 2014-01-28 | International Business Machines Company | FinFET parasitic capacitance reduction using air gap |
| US9166049B2 (en) * | 2014-03-07 | 2015-10-20 | Stmicroelectronics, Inc. | Method to enhance strain in fully isolated finFET structures |
| US9685501B2 (en) | 2014-04-02 | 2017-06-20 | International Business Machines Corporation | Low parasitic capacitance finFET device |
| US9362362B2 (en) * | 2014-04-09 | 2016-06-07 | International Business Machines Corporation | FinFET with dielectric isolated channel |
| US9112032B1 (en) * | 2014-06-16 | 2015-08-18 | Globalfoundries Inc. | Methods of forming replacement gate structures on semiconductor devices |
| US9318574B2 (en) | 2014-06-18 | 2016-04-19 | International Business Machines Corporation | Method and structure for enabling high aspect ratio sacrificial gates |
| US9748394B2 (en) | 2015-05-20 | 2017-08-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | FinFET having a multi-portioned gate stack |
| US9722079B2 (en) | 2015-10-15 | 2017-08-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Fin-type field effect transistor structure and manufacturing method thereof |
| KR102294932B1 (ko) | 2016-04-25 | 2021-09-17 | 어플라이드 머티어리얼스, 인코포레이티드 | 수평 게이트 올어라운드 디바이스 나노와이어 에어 갭 스페이서 형성 |
| CN107799420A (zh) * | 2016-09-05 | 2018-03-13 | 中芯国际集成电路制造(上海)有限公司 | 一种半导体器件及其制作方法、电子装置 |
| TWI790939B (zh) * | 2022-03-09 | 2023-01-21 | 華邦電子股份有限公司 | 半導體元件及其形成方法 |
| US12185553B2 (en) | 2022-04-07 | 2024-12-31 | Winbond Electronics Corp. | Semiconductor device and method of forming the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6300160B1 (en) * | 1999-11-18 | 2001-10-09 | Eastman Kodak Company | Process for charge coupled image sensor with U-shaped gates |
| JP2002043581A (ja) * | 2000-06-02 | 2002-02-08 | Internatl Business Mach Corp <Ibm> | デュアル/ラップ−アラウンド・ゲート電界効果トランジスタおよびその製造方法 |
| US20020149031A1 (en) * | 2001-04-12 | 2002-10-17 | Samsung Electronics Co., Ltd. | Semiconductor device having gate all around type transistor and method of forming the same |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02302044A (ja) * | 1989-05-16 | 1990-12-14 | Fujitsu Ltd | 半導体装置の製造方法 |
| US5273921A (en) * | 1991-12-27 | 1993-12-28 | Purdue Research Foundation | Methods for fabricating a dual-gated semiconductor-on-insulator field effect transistor |
| US5705405A (en) * | 1994-09-30 | 1998-01-06 | Sgs-Thomson Microelectronics, Inc. | Method of making the film transistor with all-around gate electrode |
| US5801387A (en) * | 1996-03-28 | 1998-09-01 | Electron Processing Systems, Inc. | Method of and apparatus for the electron beam treatment of powders and aggregates in pneumatic transfer |
| JPH09293793A (ja) * | 1996-04-26 | 1997-11-11 | Mitsubishi Electric Corp | 薄膜トランジスタを有する半導体装置およびその製造方法 |
| US5981367A (en) * | 1996-10-17 | 1999-11-09 | Micron Technology, Inc. | Method for making an access transistor |
| JPH10163166A (ja) * | 1996-11-28 | 1998-06-19 | Mitsubishi Electric Corp | 半導体装置の製造方法及び製造装置 |
| JP3543117B2 (ja) * | 2001-03-13 | 2004-07-14 | 独立行政法人産業技術総合研究所 | 二重ゲート電界効果トランジスタ |
| US6544848B1 (en) * | 2002-08-20 | 2003-04-08 | Chartered Semiconductor Manufacturing Ltd. | Method to form an asymmetrical non-volatile memory device using small in-situ doped polysilicon spacers |
-
2002
- 2002-10-22 US US10/274,867 patent/US6833588B2/en not_active Expired - Lifetime
-
2003
- 2003-10-14 JP JP2004546873A patent/JP4745663B2/ja not_active Expired - Fee Related
- 2003-10-14 WO PCT/US2003/032663 patent/WO2004038804A2/en not_active Ceased
- 2003-10-14 CN CNB2003801019541A patent/CN100448023C/zh not_active Expired - Fee Related
- 2003-10-14 KR KR1020057006823A patent/KR100993937B1/ko not_active Expired - Fee Related
- 2003-10-14 DE DE10393565T patent/DE10393565B4/de not_active Expired - Fee Related
- 2003-10-14 AU AU2003282849A patent/AU2003282849A1/en not_active Abandoned
- 2003-10-14 GB GB0506579A patent/GB2409575B/en not_active Expired - Fee Related
- 2003-10-17 TW TW092128797A patent/TWI321336B/zh not_active IP Right Cessation
-
2004
- 2004-08-09 US US10/913,409 patent/US7179692B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6300160B1 (en) * | 1999-11-18 | 2001-10-09 | Eastman Kodak Company | Process for charge coupled image sensor with U-shaped gates |
| JP2002043581A (ja) * | 2000-06-02 | 2002-02-08 | Internatl Business Mach Corp <Ibm> | デュアル/ラップ−アラウンド・ゲート電界効果トランジスタおよびその製造方法 |
| US20020149031A1 (en) * | 2001-04-12 | 2002-10-17 | Samsung Electronics Co., Ltd. | Semiconductor device having gate all around type transistor and method of forming the same |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004038804A3 (en) | 2004-06-10 |
| CN1708855A (zh) | 2005-12-14 |
| DE10393565T5 (de) | 2005-09-01 |
| GB2409575B (en) | 2006-02-15 |
| US20040075121A1 (en) | 2004-04-22 |
| AU2003282849A1 (en) | 2004-05-13 |
| GB0506579D0 (en) | 2005-05-04 |
| KR20050057663A (ko) | 2005-06-16 |
| TWI321336B (en) | 2010-03-01 |
| TW200414324A (en) | 2004-08-01 |
| KR100993937B1 (ko) | 2010-11-12 |
| DE10393565B4 (de) | 2010-07-15 |
| JP2006504268A (ja) | 2006-02-02 |
| JP4745663B2 (ja) | 2011-08-10 |
| US20050006666A1 (en) | 2005-01-13 |
| GB2409575A (en) | 2005-06-29 |
| WO2004038804A2 (en) | 2004-05-06 |
| US7179692B2 (en) | 2007-02-20 |
| US6833588B2 (en) | 2004-12-21 |
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