CN100430526C - 电解抛光和/或电镀设备及方法 - Google Patents

电解抛光和/或电镀设备及方法 Download PDF

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Publication number
CN100430526C
CN100430526C CNB038102064A CN03810206A CN100430526C CN 100430526 C CN100430526 C CN 100430526C CN B038102064 A CNB038102064 A CN B038102064A CN 03810206 A CN03810206 A CN 03810206A CN 100430526 C CN100430526 C CN 100430526C
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China
Prior art keywords
wafer
assembly
module
exemplary
electropolishing
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Expired - Fee Related
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CNB038102064A
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English (en)
Chinese (zh)
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CN1653211A (zh
Inventor
王晖
沃哈·纳持
费利克斯·古特曼
穆罕默德·阿夫南
希曼舒·J·乔克什
马克·J·范柯克威科
戴蒙·L·克勒
佩奥尔·伊
麦·H·源
张如皋
弗雷德里克·霍
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ACM Research Inc
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ACM Research Inc
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Publication of CN1653211A publication Critical patent/CN1653211A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/16—Polishing
    • C25F3/30—Polishing of semiconducting materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Robotics (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
CNB038102064A 2002-04-08 2003-04-08 电解抛光和/或电镀设备及方法 Expired - Fee Related CN100430526C (zh)

Applications Claiming Priority (16)

Application Number Priority Date Filing Date Title
US37091902P 2002-04-08 2002-04-08
US37092902P 2002-04-08 2002-04-08
US37095602P 2002-04-08 2002-04-08
US37095502P 2002-04-08 2002-04-08
US60/370,955 2002-04-08
US60/370,929 2002-04-08
US60/370,919 2002-04-08
US60/370,956 2002-04-08
US37254202P 2002-04-14 2002-04-14
US37256602P 2002-04-14 2002-04-14
US37256702P 2002-04-14 2002-04-14
US60/372,542 2002-04-14
US60/372,567 2002-04-14
US60/372,566 2002-04-14
US39046002P 2002-06-21 2002-06-21
US60/390,460 2002-06-21

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN2008102128377A Division CN101353810B (zh) 2002-04-08 2003-04-08 用于对半导体晶片执行清洗的方法及装置

Publications (2)

Publication Number Publication Date
CN1653211A CN1653211A (zh) 2005-08-10
CN100430526C true CN100430526C (zh) 2008-11-05

Family

ID=29255769

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2008102128377A Expired - Fee Related CN101353810B (zh) 2002-04-08 2003-04-08 用于对半导体晶片执行清洗的方法及装置
CNB038102064A Expired - Fee Related CN100430526C (zh) 2002-04-08 2003-04-08 电解抛光和/或电镀设备及方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN2008102128377A Expired - Fee Related CN101353810B (zh) 2002-04-08 2003-04-08 用于对半导体晶片执行清洗的方法及装置

Country Status (10)

Country Link
US (1) US20050218003A1 (fr)
EP (1) EP1492907A4 (fr)
JP (5) JP2005522585A (fr)
KR (1) KR20040099407A (fr)
CN (2) CN101353810B (fr)
AU (1) AU2003226319A1 (fr)
CA (1) CA2479794A1 (fr)
SG (1) SG159384A1 (fr)
TW (1) TWI274393B (fr)
WO (1) WO2003087436A1 (fr)

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CN100419121C (zh) * 2004-05-12 2008-09-17 鸿富锦精密工业（深圳）有限公司 湿蚀刻设备
JP5155517B2 (ja) * 2005-04-21 2013-03-06 株式会社荏原製作所 ウエハ受渡装置及びポリッシング装置
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EP2047507A2 (fr) * 2006-08-04 2009-04-15 E.I. Du Pont De Nemours And Company Enceinte de support de substrat
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CN109676274B (zh) * 2018-12-27 2021-01-15 深圳市大族数控科技有限公司 一种释压机构及具有该释压机构的真空吸附和吸尘装置
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CN112017932B (zh) * 2019-05-31 2022-11-29 中微半导体设备(上海)股份有限公司 等离子体处理装置中气体输送系统的耐腐蚀结构
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CN111693852B (zh) * 2020-06-23 2023-12-22 宏茂微电子(上海)有限公司 一种塑封装元器件开封方法及开封装置
CN114473818B (zh) * 2022-02-28 2023-05-02 南京尚吉增材制造研究院有限公司 用于义齿的组合式调节型抛光夹具
CN114990549B (zh) * 2022-05-30 2024-01-12 东莞海雅特汽车科技有限公司 一种汽车冲压模具铸件表面拉毛处理装置及方法

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US20050218003A1 (en) 2005-10-06
TWI274393B (en) 2007-02-21
CN101353810A (zh) 2009-01-28
CN101353810B (zh) 2012-02-15
JP2007077501A (ja) 2007-03-29
JP2006328543A (ja) 2006-12-07
CN1653211A (zh) 2005-08-10
JP2007051377A (ja) 2007-03-01
JP2006319348A (ja) 2006-11-24
KR20040099407A (ko) 2004-11-26
CA2479794A1 (fr) 2003-10-23
AU2003226319A1 (en) 2003-10-27
EP1492907A4 (fr) 2008-01-09
SG159384A1 (en) 2010-03-30

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