CN100421212C - 真空腔室和真空处理装置 - Google Patents

真空腔室和真空处理装置 Download PDF

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Publication number
CN100421212C
CN100421212C CNB2006101289226A CN200610128922A CN100421212C CN 100421212 C CN100421212 C CN 100421212C CN B2006101289226 A CNB2006101289226 A CN B2006101289226A CN 200610128922 A CN200610128922 A CN 200610128922A CN 100421212 C CN100421212 C CN 100421212C
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CN
China
Prior art keywords
main frame
vacuum chamber
vacuum
frame body
reinforcement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2006101289226A
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English (en)
Chinese (zh)
Other versions
CN1925111A (zh
Inventor
冈部星儿
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN1925111A publication Critical patent/CN1925111A/zh
Application granted granted Critical
Publication of CN100421212C publication Critical patent/CN100421212C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
CNB2006101289226A 2005-09-02 2006-09-04 真空腔室和真空处理装置 Expired - Fee Related CN100421212C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005255294 2005-09-02
JP2005255294A JP4791110B2 (ja) 2005-09-02 2005-09-02 真空チャンバおよび真空処理装置
JP2005-255294 2005-09-02

Publications (2)

Publication Number Publication Date
CN1925111A CN1925111A (zh) 2007-03-07
CN100421212C true CN100421212C (zh) 2008-09-24

Family

ID=37817679

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2006101289226A Expired - Fee Related CN100421212C (zh) 2005-09-02 2006-09-04 真空腔室和真空处理装置

Country Status (4)

Country Link
JP (1) JP4791110B2 (https=)
KR (1) KR100856145B1 (https=)
CN (1) CN100421212C (https=)
TW (1) TWI406332B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8033772B2 (en) 2002-06-21 2011-10-11 Applied Materials, Inc. Transfer chamber for vacuum processing system

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101101757B1 (ko) * 2005-11-07 2012-01-05 주성엔지니어링(주) 제조비용을 절감한 진공챔버
KR101309363B1 (ko) * 2007-12-14 2013-09-17 가부시키가이샤 알박 챔버 및 성막 장치
JP5551346B2 (ja) * 2008-06-10 2014-07-16 東京エレクトロン株式会社 チャンバ及び処理装置
WO2010082467A1 (ja) * 2009-01-14 2010-07-22 株式会社アルバック プラズマｃｖｄ装置
FI122940B (fi) * 2009-02-09 2012-09-14 Beneq Oy Reaktiokammio
KR20110067939A (ko) * 2009-12-15 2011-06-22 주식회사 테스 로드락 챔버
KR101598176B1 (ko) * 2010-03-30 2016-02-26 주식회사 원익아이피에스 진공챔버
JP5526988B2 (ja) * 2010-04-28 2014-06-18 東京エレクトロン株式会社 基板処理装置及び基板処理システム
KR101363064B1 (ko) * 2012-05-22 2014-02-14 박종민 진공 챔버 구조
JP2016537805A (ja) * 2013-09-26 2016-12-01 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板処理のための混合プラットフォームの装置、システム、及び方法
JP7023097B2 (ja) * 2016-12-28 2022-02-21 東京エレクトロン株式会社 真空チャンバおよび真空チャンバの扉の施錠方法
JP6625597B2 (ja) * 2017-11-13 2019-12-25 平田機工株式会社 搬送チャンバ
JP7277137B2 (ja) * 2018-12-28 2023-05-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および搬送モジュール
KR102193096B1 (ko) 2019-01-31 2020-12-21 (주)에프티엘 진공챔버의 리브를 용접하기 위한 용접지그장치
KR102720200B1 (ko) * 2019-10-10 2024-10-21 주성엔지니어링(주) 클러스터형 기판처리장치
KR20260049865A (ko) * 2023-08-31 2026-04-14 캐논 톡키 가부시키가이샤 진공 챔버 및 성막 장치
KR102785109B1 (ko) 2024-08-30 2025-03-26 주식회사 창하이앤지 리브를 용접하기 위한 용접 테이블 장치
KR102785110B1 (ko) 2024-08-30 2025-03-26 주식회사 창하이앤지 용접용 지그

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10135231A (ja) * 1996-10-31 1998-05-22 Tokyo Electron Ltd 縦型熱処理装置およびそのボートと保温筒のメンテナンス方法
US5914493A (en) * 1997-02-21 1999-06-22 Nikon Corporation Charged-particle-beam exposure apparatus and methods with substrate-temperature control
US6241117B1 (en) * 1997-11-26 2001-06-05 Steven R. Wickins Pressure differential containment structure
JP2004089872A (ja) * 2002-08-30 2004-03-25 Tsukishima Kikai Co Ltd 真空装置
CN1574270A (zh) * 2003-06-24 2005-02-02 东京毅力科创株式会社 处理设备、处理方法、压力控制方法、传送方法以及传送设备

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4253107B2 (ja) * 2000-08-24 2009-04-08 キヤノンアネルバ株式会社 基板処理装置及びその増設方法
JP4003412B2 (ja) * 2001-06-20 2007-11-07 株式会社島津製作所 真空チャンバ及びその真空チャンバを用いた液晶注入装置
JP2003077974A (ja) * 2001-08-31 2003-03-14 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
JP2003188226A (ja) * 2001-12-18 2003-07-04 Anelva Corp 真空搬送処理装置
JP2004311640A (ja) * 2003-04-04 2004-11-04 Tokyo Electron Ltd 処理容器
SG115678A1 (en) * 2003-04-22 2005-10-28 Asml Netherlands Bv Substrate carrier and method for making a substrate carrier
JP2004335743A (ja) * 2003-05-08 2004-11-25 Ulvac Japan Ltd 真空処理装置用真空チャンバー
KR100441875B1 (ko) * 2003-06-02 2004-07-27 주성엔지니어링(주) 분리형 이송 챔버
JP4767574B2 (ja) * 2005-03-31 2011-09-07 東京エレクトロン株式会社 処理チャンバおよび処理装置
JP4079157B2 (ja) * 2005-04-12 2008-04-23 東京エレクトロン株式会社 ゲートバルブ装置及び処理システム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10135231A (ja) * 1996-10-31 1998-05-22 Tokyo Electron Ltd 縦型熱処理装置およびそのボートと保温筒のメンテナンス方法
US5914493A (en) * 1997-02-21 1999-06-22 Nikon Corporation Charged-particle-beam exposure apparatus and methods with substrate-temperature control
US6241117B1 (en) * 1997-11-26 2001-06-05 Steven R. Wickins Pressure differential containment structure
JP2004089872A (ja) * 2002-08-30 2004-03-25 Tsukishima Kikai Co Ltd 真空装置
CN1574270A (zh) * 2003-06-24 2005-02-02 东京毅力科创株式会社 处理设备、处理方法、压力控制方法、传送方法以及传送设备

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8033772B2 (en) 2002-06-21 2011-10-11 Applied Materials, Inc. Transfer chamber for vacuum processing system

Also Published As

Publication number Publication date
KR20070026215A (ko) 2007-03-08
JP4791110B2 (ja) 2011-10-12
JP2007073542A (ja) 2007-03-22
CN1925111A (zh) 2007-03-07
TW200731391A (en) 2007-08-16
TWI406332B (zh) 2013-08-21
KR100856145B1 (ko) 2008-09-03

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Granted publication date: 20080924