CN100374490C - Rtv导热硅橡胶组合物 - Google Patents
Rtv导热硅橡胶组合物 Download PDFInfo
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- CN100374490C CN100374490C CNB2004100550332A CN200410055033A CN100374490C CN 100374490 C CN100374490 C CN 100374490C CN B2004100550332 A CNB2004100550332 A CN B2004100550332A CN 200410055033 A CN200410055033 A CN 200410055033A CN 100374490 C CN100374490 C CN 100374490C
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Abstract
一种RTV导热硅橡胶组合物,包含(A)两端具有可水解基团的有机聚硅氧烷,(B)在一端具有至少一个可水解基团的有机聚硅氧烷,(C)导热填料,和(D)具有可水解基团的有机硅化合物或其部分水解缩合物。该组合物即使填充大量导热填料(C),粘度也只经历最轻微的增加,具有很好的灌注、涂覆和密封性能,适合用于单组分形式。
Description
技术领域
本发明涉及室温硫化(RTV)导热硅橡胶组合物,其在填充大量导热填料后,粘度只发生轻微的增加,具有很好的灌注、涂覆和密封性能,适合用于单组分(one package)形式。
背景技术
发热零件如功率晶体管和闸流晶体管,由于热的产生,其性能会变坏。在现有技术中,常见的做法是这些发热零件都装备有用于散热的散热器或者将热传递到用于放热的配套设备的金属底盘的适当的手段。为了改善电绝缘性和传热性能,经常在发热零件和散热器之间插入填充有导热填料的散热性电绝缘硅橡胶片。
作为散热性电绝缘材料,JP-A 47-32400公开了一种电绝缘组合物,其包含100重量份的合成橡胶,典型的是硅橡胶,和100-800重量份的至少一种选自氧化铍、氧化铝、水合氧化铝、氧化镁和氧化锌的金属氧化物。
作为用于不要求电绝缘的领域的散热材料,JP-A56-100849公开了一种加成硫化型硅橡胶组合物,其包含100重量份的硅橡胶和60-500重量份的二氧化硅和导热粉末如银、金或硅。
然而,这些导热材料都很难铸模和加工,因为如果在液态硅橡胶组合物中填充大量用于改善传热性的导热填料,液态硅橡胶组合物就失去了流动性。
此后,美国专利US6,306,957提出一种导热性硅橡胶组合物,当填充大量导热填料时,其粘度只发生轻微的增加。这个组合物是热固型的。其中没有涉及室温硫化型。
在电子仪器如个人电脑和CD-ROM驱动器中,包括LSI和CPU的IC芯片都增加了集成度。因为这样紧密结合的IC芯片产生了更多热量,传统的冷却方式(包括散热器和冷却风扇)有时不能令人满意。特别地,膝上型的个人电脑由于其内部只有有限的可利用空间,因此很难装入大的散热器或冷却风扇。在这样的仪器中,IC芯片都安装在印刷电路板上,这些印刷电路板使用导热性很差的玻璃增强环氧树脂和聚酰亚胺树脂作为基片。从而,通过现有技术中的散热性电绝缘片材将热释放到这种基片的效率很低。
于是,气冷或迫冷型散热零件都布置在接近于IC芯片处,以便使芯片产生的热导至散热零件。当散热零件与IC芯片紧密接触时,由于表面不规则,导致传热迟缓。当一种散热性电绝缘片材插入在散热零件和IC芯片之间时,较低的绝缘片材柔韧性在芯片和零件之间产生不同的热膨胀,给芯片施加应力,可能造成芯片故障。另外,每个电路芯片附加散热零件都需更额外的空间,妨碍了尺寸减小。一种只用一个散热零件就能够冷却多个IC芯片的体系被应用于此种情况。特别地,用于膝上型个人电脑的TCP型的CPU,需要周密的考虑冷却体系,因为它们高度降低了,但是和普通CPU相比放热却增加了。
当不同高度的半导体芯片以间隙排列时,能够填充各种间隙的液态硅橡胶组合物变得必不可少。由于驱动频率变得更高,CPU进步了,具备了改善的性能,但产生了更多的热。就这点而言也需要一种更好的导热材料。
尝试在导热液态硅橡胶组合物中填充大量导热填料来增加其导热性,结果组合物失去了流动性,并且变得难以加工。
就加成硫化(热固性)硅橡胶组合物而言,一种用于硫化的加热手段是必需的。考虑到IC芯片的耐热性,禁止加热到60℃或更高的温度。另外,运用加热手段就暗示着额外的资本投入。
发明内容
因此,本发明的一个目的就是提供一种RTV导热硅橡胶组合物,即使填充大量导热填料,其粘度也只有最小的增加,具有很好的灌注、涂覆和密封性能,适合用于单组分形式。
发明人发现混合下面定义的成分(A)和(B)能够得到一种RTV导热硅橡胶组合物,其在填充大量导热填料后,粘度只发生轻微的增加,并保持很好的灌注、涂覆和密封性能。该组合物十分适合作为散热材料。
本发明提供一种室温硫化(RTV)导热硅橡胶组合物,包含
(A)60-99重量份的具有通式(1)的有机聚硅氧烷:
其中R1是氢或者取代或未被取代的一价碳氢化合物基团,R2是取代或未被取代的一价碳氢化合物基因,Z是氧原子或二价碳氢化合物基团,a是0、1或2,n是至少为10的整数;
(B)1-40重量份的具有通式(2)的含有可水解基团的有机聚硅氧烷:
其中R3是取代或未被取代的一价碳氢化合物基团,R4是氢或者取代或未被取代的一价碳氢化合物基团,b是0、1或2,m是5-200的整数,成分(A)和(B)的总量为100重量份;
(C)100-4000重量份的导热填料;和
(D)1-50重量份的化学式为R5 CSiX4-C的有机硅化合物,或其部分水解缩合物,其中R5是取代或未被取代的一价碳氢化合物基团,X是可解基团,c是0、1或2。
成分A
在本发明的RTV导热硅橡胶组合物中,充当基础的成分(A)是具有下述通式(1)的有机聚硅氧烷。
其中R1是氢或者取代或未被取代的一价碳氢化合物基团,R2是取代或未被取代的一价碳氢化合物基团,Z是氧原子或二价碳氢化合物基团,a是0、1或2,n是至少为10的整数。
更特别地,R1优选选自氢和具有1-6个碳原子,优选1-4个碳原子的取代或未被取代的一价碳氢化合物基团,例如:烷基基团如甲基、乙基和丙基,卤代碳氢化合物基团如氯甲基、三氯丙基和三氟丙基,氰基-碳氢化合物基团如2-氰乙基、3-氰丙基和2-氰丁基,乙烯基,烯丙基,异丙烯基和苯基。如果a=0或1,优选一价碳氢化合物基团,特别优选甲基和乙基。如果a=2,优选氢。
R2优选选自具有1-15个碳原子,更优选1-10个碳原子的取代或未被取代的一价碳氢化合物基团,例如:烷基基团如甲基、乙基、丙基、异丙基、丁基、2-乙基丁基和辛基,环烷基基团如环己基和环戊基,烯基基团如乙烯基和烯丙基,芳基基团如苯基、甲苯基、二甲苯基、萘基、联苯基和菲基,芳烷基基团如苯甲基和苯乙基,卤代碳氢化合物基团如氯甲基、三氯丙基、三氟丙基、溴苯基和氯代环己基,和氰基-碳氢化合物基团如2-氰乙基、3-氰丙基和2-氰丁基。就这些而言,优选的是甲基、乙烯基、苯基和三氟丙基,特别优选的是甲基。
Z代表性地是氧原子或有1-12个碳原子、优选1-10个碳原子的亚烷基基团如亚甲基、亚乙基或亚丙基。就这些而言,氧和亚乙基是优选的。
在式(1)中,n是至少为10的整数,以使该有机聚硅氧烷在23℃时的粘度至少为25mPa·s,优选为100~1,000,000mPa·s,更优选为500~200,000mPa·s。
成分B
成分(B)是具有可水解基团的二有机聚硅氧烷,如通式(2)所示。
其中R3是取代或未被取代的一价碳氢化合物基团,R4是氢或者取代或未被取代的一价碳氢化合物基团,b是0、1或2,m是5-200的整数。
更特别地,R3优选选自具有1-15个碳原子,尤其是1-10个碳原子的未被取代的一价碳氢化合物基团,以及上述基团的取代形式,其中的一些氢原子被卤素原子等取代。R3基团可以是相同的,也可以是不同的。R3的例子包括烷基基团如甲基、乙基、丙基、异丙基、丁基、2-乙基丁基和辛基,环烷基基团如环己基和环戊基,烯基基团如乙烯基和烯丙基,芳基基团如苯基、甲苯基、二甲苯基、萘基、联苯基和菲基,芳烷基基团如苯甲基和苯乙基,卤代碳氢化合物基团如氯甲基、三氯丙基、三氟丙基、溴苯基和氯代环己基,和氰基-碳氢化合物基团如2-氰乙基、3-氰丙基和2-氰丁基。就这些而言,优选的是甲基、乙烯基和苯基,特别优选的是甲基。
R4优选选自氢和具有1-6个碳原子,优选1-4个碳原子的取代或未被取代的一价碳氢化合基团,例如:烷基基团如甲基、乙基和丙基,卤代碳氢化合物基团如氯甲基、三氯丙基和三氟丙基,氰基-碳氢化合物基团如2-氰乙基、3-氰丙基和2-氰丁基,乙烯基,烯丙基,异丙烯基和苯基。就这些而言,甲基和乙基是优选的,甲基是最优选的。
下标中的b为0、1或2,优选为0或1,最优选为0。成分(B)的分子用至少一个可水解基团封端。
在式(2)中,m是5-200的整数。如果m在这个范围之外,该二有机聚硅氧烷在缩减组合物的粘度方面变得不太有效。
成分(B)以1-40%重量,优选2-35%重量,更优选5-30%重量的量混入,以成分(A)和(B)的总重量计。成分(B)小于1%重量,则在缩减组合物粘度方面会不太有效。如果成分(B)或含可水解基团的有机聚硅氧烷的用量超过40%重量,则其效果达到了饱和,并且存在一种可能性,就是导热填料随时间的推移沉降下来或者该有机聚硅氧烷在硫化后渗出。
成分(B)或含可水解基团的有机聚硅氧烷的典型例子如下所述,当然,其并不局限于此。
成分C
成分(C)是导热填料。可使用至少一种选自下述的无机粉末:氧化铝、氧化锌、石英粉、碳化硅、氮化硅、氧化镁、氮化铝、氮化硼和石墨,或者至少一种金属粉末,选自铝、铜、银、镍、铁和不锈钢。这些粉末的任何一种组合都是有效的。氧化铝、氮化铝和氮化硼是优选的。
就作为成分(A)和(B)的有机聚硅氧烷和作为成分(C)的填料的混合比例而言,每100重量份的成分(A)和(B)的组合,使用成分(C)100~4000重量份,优选250~3000重量份。成分(C)的用量较小,则不能赋予组合物足够的导热性。成分(C)的用量较大,则难以混合,且增大组合物的粘度到一个妨碍加工的水平。
该导热填料优选具有不大于50微米的平均粒度,更优选为0.1~40微米,最优选为0.2~30微米。平均粒度超过50微米的填料是不太容易分散的,以致当以此填充的硅橡胶液体一静止,该填料就沉淀出来。导热填料优选是接近球状的圆形。圆形的填料可以更有效的防止大量填充时粘度的增加。这类球状导热填料是可以商业购得的,如来自Showa Denko K.K.的商品名球状氧化铝AS系列和来自Admatechs K.K.的高纯球状氧化铝AO系列。在本发明的操作中,推荐将具有大的平均粒度的导热填料粉末部分与具有小的平均粒度的导热填料粉末部分以对应于理论最密堆积分布曲线的比例组合使用,这样改善了填充效率,获得较低的粘度和较高的导热性。具体来讲,将平均粒度小于5微米,优选0.1~3微米的导热填料粉末部分与平均粒度至少为5微米,优选5-40微米的导热填料粉末部分相组合。它们的重量比例优选为10∶90~90∶10,更优选为20∶80~80∶20。
成分D
这里用到的硫化剂是在一个分子中具有至少两个可水解基团的硅烷,如下式所述:
R5 CSiX4-C
其中R5是取代或未被取代的一价碳氢化合物基团,X是可水解基团,c是0、1或2,或者是其部分水解缩合物。更特别地,R5是优选具有1~10个碳原子,更优选1~8个碳原子的取代或未被取代的一价碳氢化合物基团,更优选1~8个碳原子,例如甲基、乙基、丙基、乙烯基或苯基。由X表示的合适的可水解基团包括烷氧基基团如甲氧基、乙氧基和丁氧基,酮肟基团如二甲基酮肟和甲乙酮肟,酰氧基基团如乙酰氧基,链烯氧基基团如异丙烯氧基和异丁烯氧基,氨基基团如N-丁基氨基和N,N-二乙基氨基,酰胺基团如N-甲基乙酰胺。
硫化剂的用量为1~50重量份/100重量份的成分(A)和(B)的组合,也就是,两端羟基或有机氧基封端的有机聚硅氧烷加上一端羟基或有机氧基封端的有机聚硅氧烷。硫化剂小于1重量份,则不能获得充分的交联或不能使得到的组合物具有理想的橡胶弹性。组合物中硫化剂超过50重量份,则表现增加的硫化收缩因数和差的机械性能。优选硫化剂用量为3~20重量份。
硫化促进剂
本发明的硅橡胶组合物是缩合硫化型,其中经常会用到硫化促进剂。合适的硫化促进剂包括烷基锡酯如二醋酸二丁锡、二月桂酸二丁锡和二辛酸二丁锡;钛酸酯或钛螯合物如四异丙氧基钛、四正丁氧基钛、四(2-乙基己氧基)钛、二丙氧基二(乙酰丙酮合)钛和异丙氧基辛二醇钛;有机金属化合物如环烷酸锌、硬脂酸锌、2-乙基辛酸锌、2-乙基己酸铁、2-乙基己酸钴、2-乙基己酸锰、环烷酸钴和烷氧基铝化合物;氨烷基取代的烷氧基硅烷如3-氨丙基三乙氧基硅烷和N-β(氨乙基)-γ-氨丙基三甲氧基硅烷、胺化合物及其盐如己胺和十二烷胺磷酸盐;季铵盐如苄基三乙基乙酸铵;低级脂肪酸的碱金属盐如乙酸钾、乙酸钠和草酸锂;二烷基羟基胺如二甲基羟基胺和二乙基羟基胺;和包含胍基的硅烷或硅氧烷如四甲基胍基丙基三甲氧基硅烷、四甲基胍基丙基甲基二甲氧基硅烷和四甲基胍基丙基三(三甲基甲硅烷氧基)硅烷,单独或其任意混合均可。硫化促进剂的用量为0~10重量份,优选为0.01~5重量份,以每100重量份的成分(A)和(B)的组合计。
填料
在本发明的RTV导热硅橡胶组合物中,如果需要,还可以混入各种其他填料。合适的填料包括热解法二氧化硅,沉淀硅石,硅藻土,金属氧化物如氧化铁和氧化钛,金属碳酸盐如碳酸钙、碳酸镁和碳酸锌,石棉,玻璃棉,炭黑,细粉碎的云母,熔凝硅石粉末和粉末合成树脂如聚苯乙烯、聚氯乙烯和聚丙烯。只要不损害本发明的目的,填料可以任何所需的量混入。优选地,填料在使用之前通过预干燥除去了水分。在本发明的RTV导热硅橡胶组合物中,颜料、染料、防老剂、抗氧剂、抗静电剂和阻燃剂如氧化锑和氯化石蜡都可以任选地被加入。
添加剂和胶粘助剂
添加剂也可以添加到本发明的组合物中。合适的添加剂包括触变剂如聚醚,防霉剂,抗菌剂,和胶粘助剂,例如:氨基硅烷如γ-氨基丙基三乙氧基硅烷和3-(2-氨基乙基氨基)丙基三甲氧基硅烷,和环氧硅烷如γ-环氧丙氧丙基三甲氧基硅烷和β-(3,4-环氧环己基)乙基三甲氧基硅烷。
本发明的RTV导热硅橡胶组合物可以通过在干燥的气氛中均匀混合上述的成分(A)~(D)和可有可无的硫化促进剂、填料和添加剂来获得。
本发明的RTV导热硅橡胶组合物在密封状态保持稳定,但当其暴露于空气中时,会迅速被空气中的湿气硫化。如果需要,可以在使用前将烃溶剂如甲苯和石油醚、酮或酯加到组合物中作为稀释剂。
本发明的硅橡胶组合物,如果不含稀释剂,在23℃时具有优选不大于300Pa·s的粘度,更优选为5~300Pa·s,最优选为10~200Pa·s。
具体实施方式
本发明的实施例如下,这些实施例只用于说明而不是限定。所有的份数为重量份。粘度是在23℃下测得的。
实施例1-3 & 对比例1-2
所用的成分(A)为二甲基聚硅氧烷,分子链的两端用羟基封端,具有700mPa·s的粘度(23℃)。所用的成分(B)是含可水解基团的二甲基聚硅氧烷,结构式如下。
在成分(A)和(B)中加入600份的平均粒度为16微米的球状氧化铝粉末AS-30(商品名,Showa Denko K.K.)和300份的平均粒度为1微米的氧化铝粉末AL-47-1(商品名,Showa Denko K.K.)作为成分(C)。将它们在室温下,在Shinagawa混合器上混合20分钟。该混合物再与作为成分(D)的16份苯基三(异丙烯氧基)硅烷、作为硫化促进剂的0.8份1,1,3,3-四甲基-2-[3-(三甲氧基甲硅烷基)丙基]胍-硅氧烷和作为胶粘助剂的1份3-氨基丙基三乙氧基硅烷,在无水状态下混合。接下来是除去空气/混合处理20分钟,得到组合物。组分(A)和(B)的用量如表1所示。
如上述制备的低粘度、导热硅橡胶组合物,在23±2℃和50±5%RH下硫化7天,成为6mm厚的片材。然后用Durometer型A硬度计来测量它们的硬度。
另外,将组合物在23±2℃和50+5%RH下硫化14天,成为12mm厚的块,用导热性测量计Kemtherm QTM-D3(快速导热测量仪,产自Kyoto ElectronicIndustry K.K.)测量其导热性。为了测量储存稳定性,将100g的每种组合物样品放在玻璃瓶中,在23℃下静置1000小时。如果成分(C)沉淀出来,样品就被评定为NG,如果没有发现沉淀,就被评定为OK。
结果如表1所示。
表1
实施例 | 对比例 | |||||
1 | 2 | 3 | 1 | 2 | ||
成分(pbw) | 成分A | 95 | 90 | 70 | 50 | 100 |
成分B | 5 | 10 | 30 | 50 | 0 | |
成分C | 900 | 900 | 900 | 900 | 900 | |
成分D | 16 | 16 | 16 | 16 | 16 | |
硫化促进剂 | 0.8 | 0.8 | 0.8 | 0.8 | 0.8 | |
胶粘助剂 | 1 | 1 | 1 | 1 | 1 | |
性能 | 粘度(Pa·s) | 100 | 80 | 76 | 61 | 360 |
硬度(Durometer型A) | 90 | 90 | 87 | 82 | 90 | |
导热性(W/m·K) | 2.5 | 2.4 | 2.4 | 2.5 | 2.4 | |
储存稳定性 | OK | OK | OK | NG | OK |
表1的结果显示,添加成分(B)可以缩减粘度,从而保证组合物是可流动和易于加工的。
实施例4-6&对比例3-4
所用的成分(A)为二甲基聚硅氧烷,分子链的两端用羟基封端,具有700mPa·s的粘度(23℃)。所用的成分(B)是含可水解基团的二甲基聚硅氧烷,结构式如下。
在成分(A)和(B)中加入600份的平均粒度为16微米的球状氧化铝粉末AS-30(商品名,Showa Denko K.K.)和300份的平均粒度为1微米的氧化铝粉末AL-47-1(商品名,Showa Denko K.K.)作为成分(C)。将它们在室温下,在Shinagawa混合器上混合20分钟。该混合物再与作为成分(D)的16份苯基三(异丙烯氧基)硅烷、作为硫化促进剂的0.8份1,1,3,3-四甲基-2-[3-(三甲氧基甲硅烷基)丙基]胍-硅烷和作为胶粘助剂的1份3-氨基丙基三乙氧基硅烷,在无水状态下混合,接下来除去空气/混合处理20分钟,得到组合物。组分(A)和(B)的用量如表2所示。
如上述制备的低粘度、导热硅橡胶组合物,在23±2℃和50±5%RH下硫化7天,成为6mm厚的片材,然后用Durometer型A硬度计来测量它们的硬度。
另外,将组合物在23±2℃和50±5%RH下硫化14天,成为12mm厚的块,用导热性测量计Kemtherm QTM-D3(快速导热仪,产自Kyoto ElectronicIndustry K.K.)测量其导热性。为了测量储存稳定性,将100g的每种组合物样品放在玻璃瓶中,在23℃下静置1000小时。如果成分(C)沉淀出来,样品就评定为NG,如果没有发现沉淀,就评定为OK。
结果如表2所示。
表2
实施例 | 对比例 | |||||
4 | 5 | 6 | 3 | 4 | ||
成分(pbw) | 成分A | 95 | 90 | 70 | 50 | 100 |
成分B | 5 | 10 | 30 | 50 | 0 | |
成分C | 900 | 900 | 900 | 900 | 900 | |
成分D | 16 | 16 | 16 | 16 | 16 | |
硫化促进剂 | 0.8 | 0.8 | 0.8 | 0.8 | 0.8 | |
胶粘助剂 | 1 | 1 | 1 | 1 | 1 | |
性能 | 粘度(Pa·s) | 140 | 130 | 98 | 80 | 360 |
硬度(Durometer型A) | 87 | 92 | 88 | 80 | 90 | |
导热性(W/m·K) | 2.3 | 2.3 | 2.4 | 2.4 | 2.4 | |
储存稳定性 | OK | OK | OK | NG | OK |
表2的结果显示,添加成分(B)可以缩减粘度,从而保证组合物是可流动和易于加工的。
实施例7-9&对比例5-6
所用的成分(A)为二甲基聚硅氧烷,其分子链的两端用三甲氧基封端,具有900mPa·s的粘度(23℃)。所用的成分(B)是含可水解团的二甲基聚硅氧烷,结构式如下。
在成分(A)和(B)中加入600份的平均粒度为16微米的球状氧化铝粉末AS-30(商品名,Showa Denko K.K.)和300份的平均粒度为1微米的氧化铝粉末AL-47-1(商品名,Showa Denko K.K.)作为成分(C)。将它们在室温下,在Shinagawa混合器上混合20分钟。该混合物再与7份作为成分(D)的甲基三甲氧基硅烷、2份作为硫化促进剂的钛螯合物催化剂Orgatix TC-750(商品名,Matsumoto Trading Co.,Ltd.)和0.2份作为胶粘助剂的3-氨基丙基三乙氧基硅烷,在无水状态下混合。接下来通过除去空气/混合处理20分钟,得到一组合物。组分(A)和(B)的用量如表3所示。
如上述制备的低粘度、导热硅橡胶组合物,在23±2℃和50±5%RH下硫化7天,成为6mm厚的片材。然后用Durometer型A硬度计来测量它们的硬度。
另外,将组合物在23±2℃和50±5%RH下硫化14天,成为12mm厚的块,用导热性测量计Kemtherm QTM-D3(快速导热仪,产自Kyoto ElectronicIndustry K.K.)测量共导热性。为了测量储存稳定性,将100g的每种组合物样品放在玻璃瓶中,在23℃下静置1000小时。如果成分(C)沉淀出来,样品就评定为NG,如果没有发现沉淀,就评定为OK。
结果如表3所示。
表3
实施例 | 对比例 | |||||
7 | 8 | 9 | 5 | 6 | ||
成分(pbw) | 成分A | 95 | 90 | 70 | 50 | 100 |
成分B | 5 | 10 | 30 | 50 | 0 | |
成分C | 900 | 900 | 900 | 900 | 900 | |
成分D | 7 | 7 | 7 | 7 | 7 | |
硫化促进剂 | 2 | 2 | 2 | 2 | 2 | |
胶粘助剂 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | |
性能 | 粘度(Pa·s) | 130 | 110 | 92 | 80 | 460 |
硬度(Durometer型A) | 88 | 89 | 85 | 80 | 88 | |
导热性(W/m·K) | 2.5 | 2.5 | 2.4 | 2.4 | 2.5 | |
储存稳定性 | OK | OK | OK | NG | OK |
表3的结果显示,添加成分(B)可以缩减粘度,从而保证组合物是可流动和易于加工的。
本发明的RTV导热硅橡胶组合物消除了现有技术的缺陷,即使填充大量导热填料,粘度也只出现最轻微的增加,具有很好的灌注、涂覆和密封性能,适合用于单组分形式。
Claims (5)
1.一种室温硫化导热硅橡胶组合物,包含
(A)60-99重量份的具有通式(1)的有机聚硅氧烷:
其中R1是氢或者取代或未被取代的一价碳氢化合物基团,R2是取代或未被取代的一阶碳氢化合物基团,Z是氧原子或二价碳氢化合物基团,a是0、1或2,n是至少为10的整数,
(B)1-40重量份的具有通式(2)的含有可水解基团的有机聚硅氧烷:
其中R3是取代或未被取代的一阶碳氢化合物基团,R4是氢或者取代或未被取代的一价碳氢化合物基团,b是0、1或2,m是5-200的整数,成分(A)和(B)的总量为100重量份,
(C)100-4000重量份的平均粒度不大于50μm的导热填料,和
(D)1-50重量份的化学式为R5 CSiX4-C的有机硅化合物,或其部分水解缩合物,其中R5是取代或未被取代的一价碳氢化合物基团,X是可水解基团,c是0、1或2。
2.根据权利要求1的组合物,其中式(2)中的R3是甲基、乙烯基或苯基,式(2)中的R4是甲基或乙基。
3.根据权利要求1的组合物,其中导热填料(C)包含选自氧化铝、氧化锌、石英粉、碳化硅、氮化硅、氧化镁、氮化铝、氮化硼和石墨,以及铝、铜、银、镍、铁和不锈钢的至少一种。
4.根据权利要求3的组合物,其中导热填料(C)包含选自氧化铝、氮化铝和氮化硼的至少一种。
5.根据权利要求1的组合物,其是单组分类型。
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JP4799835B2 (ja) * | 2004-07-09 | 2011-10-26 | 東レ・ダウコーニング株式会社 | 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器 |
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Also Published As
Publication number | Publication date |
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TW200502322A (en) | 2005-01-16 |
US20040242762A1 (en) | 2004-12-02 |
KR100989254B1 (ko) | 2010-10-20 |
CN1583883A (zh) | 2005-02-23 |
JP2004352947A (ja) | 2004-12-16 |
KR20040103386A (ko) | 2004-12-08 |
DE102004025867A1 (de) | 2005-01-13 |
TWI322168B (zh) | 2010-03-21 |
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